Document Number: 631121-012
11
th
Generation Intel
®
Core™
Processor
Datasheet, Volume 1 of 2
Supporting 11th Generation Intel
®
Core™ Processor Families, Intel
®
Pentium
®
Processors, Intel
®
Celeron
®
Processors for UP3, UP4, H35 and H
Platforms, formerly known as Tiger Lake
May 2023
Revision 012
2 Datasheet, Volume 1 of 2
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names and brands may be claimed as the property of others.
Datasheet, Volume 1 of 2 3
Contents
1 Introduction ............................................................................................................ 11
1.1 Processor Volatility Statement............................................................................. 13
1.2 Package Support ............................................................................................... 13
1.3 Supported Technologies ..................................................................................... 14
1.3.1 API Support (Windows*) ......................................................................... 15
1.4 Power Management Support ............................................................................... 15
1.4.1 Processor Core Power Management........................................................... 15
1.4.2 System Power Management..................................................................... 15
1.4.3 Memory Controller Power Management...................................................... 16
1.4.4 Processor Graphics Power Management ..................................................... 16
1.4.4.1 Memory Power Savings Technologies ........................................... 16
1.4.4.2 Display Power Savings Technologies ............................................ 16
1.4.4.3 Graphics Core Power Savings Technologies................................... 16
1.5 Thermal Management Support ............................................................................ 16
1.6 Ball-out Information .......................................................................................... 17
1.7 Processor Testability .......................................................................................... 17
1.8 Operating Systems Support ................................................................................ 17
1.9 Terminology and Special Marks ........................................................................... 17
1.10 Related Documents ........................................................................................... 21
2 Technologies ........................................................................................................... 22
2.1 Platform Environmental Control Interface (PECI) ................................................... 22
2.1.1 PECI Bus Architecture ............................................................................. 22
2.2 Intel
®
Virtualization Technology (Intel
®
VT) .......................................................... 24
2.2.1 Intel
®
Virtualization Technology (Intel
®
VT) for Intel
®
64 and Intel
®
Architecture
(Intel
®
VT-X)......................................................................................... 24
2.2.2 Intel
®
Virtualization Technology (Intel
®
VT) for Directed I/O (Intel
®
VT-d) .... 27
2.2.3 Intel
®
APIC Virtualization Technology (Intel
®
APICv) .................................. 29
2.3 Security Technologies ........................................................................................ 30
2.3.1 Intel
®
Trusted Execution Technology (Intel
®
TXT) ...................................... 30
2.3.2 Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) ........ 31
2.3.3 Perform Carry-Less Multiplication Quad Word Instruction (PCLMULQDQ) ........ 32
2.3.4 Intel
®
Secure Key .................................................................................. 32
2.3.5 Execute Disable Bit................................................................................. 32
2.3.6 Boot Guard Technology ........................................................................... 33
2.3.7 Intel
®
Supervisor Mode Execution Protection (SMEP) .................................. 33
2.3.8 Intel
®
Supervisor Mode Access Protection (SMAP) ...................................... 33
2.3.9 Intel
®
Software Guard Extensions (Intel
®
SGX).......................................... 33
2.3.10 Intel
®
Secure Hash Algorithm Extensions (Intel
®
SHA Extensions)................ 35
2.3.11 User Mode Instruction Prevention (UMIP)................................................... 35
2.3.12 Read Processor ID (RDPID)...................................................................... 35
2.3.13 Total Memory Encryption (Intel
®
TME) ...................................................... 36
2.3.14 Control-flow Enforcement Technology (Intel
®
CET) ..................................... 36
2.3.14.1 Shadow Stack .......................................................................... 36
2.3.14.2 Indirect Branch Tracking............................................................ 37
2.3.15 KeyLocker Technology ............................................................................ 37
2.3.16 Devil’s Gate Rock (DGR).......................................................................... 37
2.4 Power and Performance Technologies................................................................... 38
2.4.1 Intel
®
Smart Cache Technology ............................................................... 38
2.4.2 IA Core Level 1 and Level 2 Caches .......................................................... 38
2.4.3 Intel
®
Turbo Boost Max Technology 3.0 .................................................... 39
4 Datasheet, Volume 1 of 2
2.4.4 Power Aware Interrupt Routing (PAIR).......................................................39
2.4.5 Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) .........................39
2.4.6 Intel
®
Turbo Boost Technology 2.0............................................................40
2.4.6.1 Intel
®
Turbo Boost Technology 2.0 Power Monitoring .....................40
2.4.6.2 Intel
®
Turbo Boost Technology 2.0 Power Control ..........................40
2.4.6.3 Intel
®
Turbo Boost Technology 2.0 Frequency ...............................40
2.4.7 Enhanced Intel SpeedStep
®
Technology ....................................................41
2.4.8 Intel
®
Speed Shift Technology..................................................................41
2.4.9 Intel
®
Advanced Vector Extensions 2 (Intel
®
AVX2) ....................................41
2.4.10 Advanced Vector Extensions 512 Bit (Intel
®
AVX-512).................................42
2.4.11 Intel
®
64 Architecture x2APIC ..................................................................43
2.4.12 Intel
®
Dynamic Tuning Technology (DTT) ..................................................44
2.4.13 Intel
®
GNA 2.0 (GMM and Neural Network Accelerator)................................45
2.4.14 Cache Line Write Back (CLWB) .................................................................45
2.4.15 Ring Interconnect ...................................................................................45
2.5 Intel
®
Image Processing Unit (Intel
®
IPU6)...........................................................46
2.5.1 Platform Imaging Infrastructure................................................................46
2.5.2 Intel
®
Image Processing Unit (Intel
®
IPU6)................................................46
2.6 Debug Technologies ...........................................................................................47
2.6.1 Intel
®
Processor Trace ............................................................................47
2.6.2 Platform CrashLog ..................................................................................47
2.6.3 Telemetry Aggregator .............................................................................47
2.7 Clock Topology ..................................................................................................49
2.7.1 Integrated Reference Clock PLL ................................................................49
2.8 Intel Volume Management Device (VMD) Technology..............................................49
2.8.1 Intel Volume Management Device Technology Objective...............................49
2.8.2 Intel Volume Management Device Technology ............................................50
2.8.3 Key Features..........................................................................................51
2.9 Deprecated Technologies ....................................................................................51
3 Power Management .................................................................................................52
3.1 Advanced Configuration and Power Interface (ACPI) States Supported ......................55
3.2 Processor IA Core Power Management ..................................................................56
3.2.1 OS/HW Controlled P-states ......................................................................57
3.2.1.1 Enhanced Intel
SpeedStep
®
Technology .......................................57
3.2.1.2 Intel
®
Speed Shift Technology ....................................................57
3.2.2 Low-Power Idle States.............................................................................57
3.2.3 Requesting the Low-Power Idle States .......................................................58
3.2.4 Processor IA Core C-State Rules ...............................................................58
3.2.5 Package C-States ...................................................................................59
3.2.6 Package C-States and Display Resolutions..................................................62
3.3 Processor Graphics Power Management ................................................................63
3.3.1 Memory Power Savings Technologies.........................................................63
3.3.1.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)................63
3.3.2 Display Power Savings Technologies..........................................................64
3.3.2.1 Intel
®
Seamless Display Refresh Rate Switching Technology (Intel
®
SDRRS Technology) with eDP* Port .............................................64
3.3.2.2 Intel
®
Automatic Display Brightness ............................................64
3.3.2.3 Smooth Brightness ....................................................................64
3.3.2.4 Intel
®
Display Power Saving Technology (Intel
®
DPST) 6.3.............64
3.3.2.5 Panel Self-Refresh 2 (PSR 2).......................................................65
3.3.2.6 Low-Power Single Display Pipe (LPSP) ..........................................65
3.3.2.7 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .....................65
3.3.3 Processor Graphics Core Power Savings Technologies ..................................65
3.3.3.1 Intel
®
Graphics Dynamic Frequency.............................................65
3.3.3.2 Intel
®
Graphics Render Standby Technology (Intel
®
GRST) ............66
Datasheet, Volume 1 of 2 5
3.3.3.3 Dynamic FPS (DFPS) ................................................................. 66
3.4 System Agent Enhanced Intel
SpeedStep
®
Technology........................................... 66
3.5 Voltage Optimization.......................................................................................... 66
3.6 ROP (Rest Of Platform) PMIC .............................................................................. 66
3.7 PCI Express* Power Management ........................................................................ 67
4 Thermal Management .............................................................................................. 68
4.1 Processor Thermal Management .......................................................................... 68
4.1.1 Thermal Considerations........................................................................... 68
4.1.1.1 Package Power Control .............................................................. 69
4.1.1.2 Platform Power Control .............................................................. 70
4.1.1.3 Turbo Time Parameter (Tau) ...................................................... 71
4.1.2 Configurable TDP (cTDP) and Low-Power Mode........................................... 71
4.1.2.1 Configurable TDP ...................................................................... 71
4.1.2.2 Low-Power Mode ...................................................................... 72
4.1.3 Thermal Management Features ................................................................ 73
4.1.3.1 Adaptive Thermal Monitor .......................................................... 73
4.1.3.2 Digital Thermal Sensor .............................................................. 75
4.1.3.3 PROCHOT# Signal..................................................................... 76
4.1.3.4 PROCHOT Output Only............................................................... 77
4.1.3.5 Bi-Directional PROCHOT# .......................................................... 77
4.1.3.6 PROCHOT Demotion Algorithm.................................................... 77
4.1.3.7 Voltage Regulator Protection using PROCHOT# ............................. 78
4.1.3.8 Thermal Solution Design and PROCHOT# Behavior ........................ 78
4.1.3.9 Low-Power States and PROCHOT# Behavior ................................. 79
4.1.3.10 THRMTRIP# Signal.................................................................... 79
4.1.3.11 Critical Temperature Detection ................................................... 79
4.1.3.12 On-Demand Mode ..................................................................... 79
4.1.3.13 MSR Based On-Demand Mode..................................................... 79
4.1.3.14 I/O Emulation-Based On-Demand Mode ....................................... 80
4.1.4 Intel
®
Memory Thermal Management........................................................ 80
4.2 Thermal and Power Specifications........................................................................ 81
5 Memory ................................................................................................................... 85
5.1 System Memory Interface .................................................................................. 85
5.1.1 Processor SKU Support Matrix.................................................................. 85
5.1.2 Supported Population.............................................................................. 86
5.1.3 Supported Memory Modules and Devices ................................................... 88
5.1.4 System Memory Timing Support............................................................... 89
5.1.5 System Memory Timing Support............................................................... 89
5.1.6 SAGV Points .......................................................................................... 90
5.1.7 Memory Controller (MC) .......................................................................... 90
5.1.8 System Memory Controller Organization Mode (DDR4) ................................ 91
5.1.9 System Memory Frequency...................................................................... 92
5.1.10 Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA).......... 92
5.1.11 Data Scrambling .................................................................................... 93
5.1.12 ECC DDR4 H-Matrix Syndrome Codes........................................................ 93
5.1.13 Data Swapping ...................................................................................... 94
5.1.14 DDR I/O Interleaving .............................................................................. 94
5.1.15 DRAM Clock Generation........................................................................... 95
5.1.16 DRAM Reference Voltage Generation ......................................................... 95
5.1.17 Data Swizzling ....................................................................................... 95
5.2 Integrated Memory Controller (IMC) Power Management ........................................ 95
5.2.1 Disabling Unused System Memory Outputs ................................................ 95
5.2.2 DRAM Power Management and Initialization ............................................... 96
5.2.2.1 Initialization Role of CKE............................................................ 97
5.2.2.2 Conditional Self-Refresh............................................................. 97
6 Datasheet, Volume 1 of 2
5.2.2.3 Dynamic Power-Down ................................................................97
5.2.2.4 DRAM I/O Power Management ....................................................98
5.2.3 DDR Electrical Power Gating .....................................................................98
5.2.4 Power Training .......................................................................................98
6 USB-C* Sub System .................................................................................................99
6.1 USB-C Sub-System General Capabilities.............................................................. 100
6.2 USB™ 4 Router ............................................................................................... 101
6.2.1 USB 4 Host Router Implementation Capabilities ........................................101
6.3 USB-C Sub-system xHCI/xDCI Controllers........................................................... 102
6.3.1 USB 3 Controllers ................................................................................. 102
6.3.1.1 Extensible Host Controller Interface (xHCI)................................. 102
6.3.1.2 Extensible Device Controller Interface (xDCI).............................. 102
6.3.2 USB-C Sub-System PCIe Interface ..........................................................103
6.4 USB-C Sub-System Display Interface.................................................................. 103
7 PCIe* Interface .....................................................................................................104
7.1 Processor PCI Express* Interface.......................................................................104
7.1.1 PCI Express* Support............................................................................ 104
7.1.2 PCI Express* Lane Polarity Inversion....................................................... 106
7.1.3 PCI Express* Architecture...................................................................... 106
7.1.4 PCI Express* Configuration Mechanism.................................................... 107
7.1.5 PCI Express* Equalization Methodology ................................................... 107
7.1.6 PCI Express* Hot-Plug...........................................................................108
7.1.6.1 Presence Detection..................................................................108
7.1.6.2 SMI/SCI Generation.................................................................108
8 Direct Media Interface (DMI) and On Package Interface (OPI) .............................. 109
8.1 Direct Media Interface (DMI) ............................................................................. 109
8.1.1 DMI Lane Reversal and Polarity Inversion................................................. 109
8.1.2 DMI Error Flow .....................................................................................110
8.1.3 DMI Link Down..................................................................................... 110
8.2 On Package Interface (OPI)............................................................................... 110
8.2.1 OPI Support:........................................................................................ 110
8.2.2 Functional description: .......................................................................... 110
9 Graphics ................................................................................................................ 111
9.1 Processor Graphics...........................................................................................111
9.1.1 Media Support (Intel
®
QuickSync and Clear Video Technology HD) .............. 111
9.1.1.1 Hardware Accelerated Video Decode .......................................... 111
9.1.1.2 Hardware Accelerated Video Encode........................................... 112
9.1.1.3 Hardware Accelerated Video Processing...................................... 113
9.1.1.4 Hardware Accelerated Transcoding ............................................113
9.2 Platform Graphics Hardware Feature ..................................................................114
9.2.1 Hybrid Graphics.................................................................................... 114
10 Display................................................................................................................... 115
10.1 Display Technologies Support ............................................................................ 115
10.2 Display Configuration .......................................................................................115
10.3 Display Features.............................................................................................. 117
10.3.1 General Capabilities ..............................................................................117
10.3.2 Multiple Display Configurations ............................................................... 117
10.3.3 High-bandwidth Digital Content Protection (HDCP) .................................... 117
10.3.4 DisplayPort* ........................................................................................ 118
10.3.4.1 Multi-Stream Transport (MST)................................................... 118
10.3.5 High-Definition Multimedia Interface (HDMI*)........................................... 120
10.3.6 embedded DisplayPort* (eDP*) ..............................................................121
Datasheet, Volume 1 of 2 7
10.3.7 MIPI* DSI ........................................................................................... 122
10.3.8 Integrated Audio .................................................................................. 122
10.3.9 DisplayPort* Input (DP-IN).................................................................... 123
11 Camera/MIPI ........................................................................................................ 125
11.1 Camera Pipe Support ....................................................................................... 125
11.2 MIPI* CSI-2 Camera Interconnect ..................................................................... 125
11.2.1 Camera Control Logic............................................................................ 125
11.2.2 Camera Modules .................................................................................. 125
11.2.3 CSI-2 Lane Configuration ...................................................................... 126
12 Signal Description ................................................................................................. 129
12.1 System Memory Interface ................................................................................ 131
12.1.1 DDR4 Memory Interface ........................................................................ 131
12.1.2 LPDDR4x Memory Interface ................................................................... 134
12.2 PCIe4 Gen4 Interface Signals............................................................................ 135
12.3 Direct Media Interface (DMI) Signals.................................................................. 135
12.4 PCIe16 Gen4 Interface Signals .......................................................................... 136
12.5 Reset and Miscellaneous Signals........................................................................ 136
12.6 Display Interfaces ........................................................................................... 137
12.6.1 Embedded DisplayPort* (eDP*) Signals ................................................... 137
12.6.2 MIPI DSI* Signals ................................................................................ 138
12.6.3 Digital Display Interface (DDI) Signals .................................................... 138
12.6.4 Digital Display Audio Signals .................................................................. 138
12.7 DP-IN Interface Signals.................................................................................... 139
12.8 USB Type-C Signals......................................................................................... 139
12.9 MIPI* CSI-2 Interface Signals ........................................................................... 140
12.10 Processor Clocking Signals................................................................................ 141
12.11 Testability Signals ........................................................................................... 141
12.12 Error and Thermal Protection Signals ................................................................. 142
12.13 Processor Power Rails ..................................................................................... 142
12.14 Ground, Reserved and Non-Critical to Function (NCTF) Signals .............................. 143
12.15 Processor Internal Pull-Up / Pull-Down Terminations ............................................ 144
13 Electrical Specifications ......................................................................................... 145
13.1 Processor Power Rails ..................................................................................... 145
13.1.1 Power and Ground Pins ......................................................................... 145
13.1.2 Full Integrated Voltage Regulator (FIVR) ................................................. 145
13.1.3 V
CC
Voltage Identification (VID) ............................................................. 145
13.2 DC Specifications ............................................................................................ 146
13.2.1 Processor Power Rails DC Specifications .................................................. 146
13.2.1.1 Vcc
IN
DC Specifications............................................................ 146
13.2.1.2 VccIN_AUX DC Specifications.................................................... 148
13.2.1.3 VDD2 DC Specifications ........................................................... 150
13.2.1.4 VccST DC Specifications........................................................... 150
13.2.1.5 Vcc1P8A DC Specifications ....................................................... 152
13.2.1.6 DDR4 DC Specifications ........................................................... 152
13.2.1.7 LPDDR4x DC Specifications ...................................................... 154
13.2.1.8 PCI Express* Graphics (PEG) DC Specifications ........................... 155
13.2.1.9 Digital Display Interface (DDI) DC Specifications ......................... 155
13.2.1.10embedded DisplayPort* (eDP*) DC Specification ......................... 156
13.2.1.11MIPI* CSI-2 D-Phy Receiver DC Specifications ............................ 156
13.2.1.12CMOS DC Specifications........................................................... 157
13.2.1.13GTL and OD DC Specification.................................................... 157
13.2.1.14PECI DC Characteristics ........................................................... 158
14 Package Mechanical Specifications ........................................................................ 161
14.1 Package Mechanical Attributes .......................................................................... 161
8 Datasheet, Volume 1 of 2
14.2 Package Loading and Die Pressure Specifications .................................................161
14.2.1 Package Loading Specifications ...............................................................161
14.2.2 Die Pressure Specifications..................................................................... 162
14.3 Package Storage Specifications..........................................................................163
15 CPU And Device IDs ............................................................................................... 165
15.1 CPUID ............................................................................................................165
15.2 PCI Configuration Header..................................................................................165
Figures
1-1 11
th
Generation Intel
®
Core™ UP3/UP4/H35/UP3-Refresh//H35-Refresh Processor Lines
Platform Diagram ...................................................................................................12
1-2 H Processor Line Platform Diagram ...........................................................................13
2-1 Example for PECI Host-Clients Connection..................................................................23
2-2 Example for PECI EC Connection...............................................................................24
2-3 Device to Domain Mapping Structures .......................................................................28
2-4 Processor Cache Hierarchy.......................................................................................38
2-5 Processor Camera System .......................................................................................46
2-6 Telemetry Aggregator .............................................................................................48
3-1 UP3 and UP4 Processor Lines Power States ................................................................53
3-2 H Processor Line Power States..................................................................................54
3-3 Processor Package and IA Core C-States....................................................................55
3-4 Idle Power Management Breakdown of the Processor IA Cores......................................57
3-5 Package C-State Entry and Exit ................................................................................60
4-1 Package Power Control ............................................................................................70
4-2 PROCHOT Demotion Signal Description ......................................................................78
5-1 Intel
®
DDR4 Flex Memory Technology Operations .......................................................91
5-2 DDR4 Interleave (IL) and Non-Interleave (NIL) Modes Mapping ....................................95
6-1 USB-C* Sub-system Block Diagram...........................................................................99
7-1 PCI Express* Related Register Structures in the Processor ......................................... 107
8-1 Example for DMI Lane Reversal Connection .............................................................. 109
10-1 Processor Display Architecture................................................................................116
10-2 DisplayPort* Overview ..........................................................................................118
10-3 HDMI* Overview .................................................................................................. 120
10-4 MIPI* DSI Overview.............................................................................................. 122
10-5 DP-IN Block Diagram ............................................................................................ 124
13-1 Input Device Hysteresis ........................................................................................159
Tables
1-1 11
th
Generation Intel
®
Core™ Processor Lines............................................................12
1-2 Operating Systems Support .....................................................................................18
1-3 Terminology...........................................................................................................18
1-4 Special marks ........................................................................................................21
3-1 System States........................................................................................................56
3-2 Integrated Memory Controller (IMC) States ................................................................57
3-3 G, S, and C Interface State Combinations ..................................................................57
3-4 Core C-states .........................................................................................................59
3-5 Package C-States ...................................................................................................61
3-6 Deepest Package C-State Available ...........................................................................64
3-7 TCSS Power State...................................................................................................64
3-8 Package C-States with PCIe* Link States Dependencies ...............................................68
Datasheet, Volume 1 of 2 9
4-1 Configurable TDP Modes.......................................................................................... 73
4-2 TDP Specifications .................................................................................................. 82
4-3 Package Turbo Specifications ................................................................................... 84
4-4 Junction Temperature Specifications ......................................................................... 85
5-1 DDR Support Matrix Table ....................................................................................... 86
5-2 Processor DDR Speed Support ................................................................................. 86
5-4 LPDDR4x Channels Population Rules ......................................................................... 87
5-5 DDR4 Memory Down Channels Population Rules ......................................................... 87
5-3 DDR Technology Support Matrix ............................................................................... 87
5-6 H DDR4 SoDIMM Population Configuration ................................................................. 88
5-7 Supported DDR4 SoDIMM Module Configurations........................................................ 89
5-8 Supported DDR4 Memory Down Device Configurations ................................................ 89
5-9 Supported LPDDR4x x32 DRAMs Configurations.......................................................... 89
5-10 Supported LPDDR4x x64 DRAMs Configurations......................................................... 90
5-11 DDR4 System Memory Timing Support...................................................................... 90
5-12 LPDDR4x System Memory Timing Support ................................................................. 91
5-13 System Agent Enhanced Speed Steps (SA-GV) and Gear Mode Frequencies ................... 91
5-14 ECC H-Matrix Syndrome Codes ................................................................................ 94
5-15 Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping........................................ 95
6-1 USB-C* Port Configuration .................................................................................... 101
6-2 USB-C* Lanes Configuration .................................................................................. 102
6-3 USB-C* Non-Supported Lane Configuration ............................................................. 102
6-4 PCIe via USB4 Configuration.................................................................................. 104
7-1 PCI Express* 4 -lane Bifurcation and Lane Reversal Mapping...................................... 105
7-2 PCI Express* 16-lane Bifurcation and Lane Reversal Mapping..................................... 105
7-3 PCI Express* Maximum Transfer Rates and Theoretical Bandwidth.............................. 107
9-1 Hardware Accelerated Video Decoding..................................................................... 113
9-2 Hardware Accelerated Video Encode ....................................................................... 114
10-1 Display Ports Availability and Link Rate ................................................................... 117
10-2 Display Resolutions and Link Bandwidth for Multi-Stream Transport Calculations........... 121
10-3 DisplayPort Maximum Resolution............................................................................ 122
10-4 HDMI Maximum Resolution ................................................................................... 123
10-5 Embedded DisplayPort Maximum Resolution ............................................................ 124
10-6 MIPI* DSI Maximum Resolution ............................................................................ 125
10-7 Processor Supported Audio Formats over HDMI and DisplayPort*................................ 125
11-1 CSI-2 Lane Configuration for UP3-Processor Line ...................................................... 130
11-2 CSI-2 Lane Configuration for UP4-Processor Line ...................................................... 130
11-3 CSI-2 Lane Configuration for H-Processor Line ......................................................... 131
12-1 Signal Tables Terminology..................................................................................... 133
12-2 DDR4 Memory Interface........................................................................................ 135
12-3 LPDDR4x Memory Interface ................................................................................... 138
12-4 DMI Interface Signals ........................................................................................... 139
12-5 Processor Clocking Signals..................................................................................... 145
12-6 Processor Power Rails Signals ................................................................................ 146
12-7 Processor Pull-up Power Rails Signals...................................................................... 147
12-8 GND, RSVD, and NCTF Signals ............................................................................... 148
13-1 Processor Vcc
IN
Active and Idle Mode DC Voltage and Current Specifications ................ 150
13-2 VccIN_AUX Supply DC Voltage and Current Specifications.......................................... 152
13-3 Memory Controller (VDD2) Supply DC Voltage and Current Specifications .................... 154
13-4 Vcc Sustain (VccST) Supply DC Voltage and Current Specifications ............................. 154
13-5 Vcc Sustain Gated (VccSTG) Supply DC Voltage and Current Specifications .................. 155
13-6 Vcc1P8A Supply DC Voltage and Current Specifications ............................................. 156
13-7 DDR4 Signal Group DC Specifications...................................................................... 156
13-8 LPDDR4x Signal Group DC Specifications................................................................. 158
13-10DSI HS Transmitter DC Specifications ..................................................................... 159
10 Datasheet, Volume 1 of 2
13-11DSI LP Transmitter DC Specifications ...................................................................... 159
13-12Digital Display Interface Group DC Specifications (DP/HDMI) ......................................160
13-13DP-IN Group DC Specifications ............................................................................... 160
13-14CMOS Signal Group DC Specifications...................................................................... 161
13-15 GTL Signal Group and Open Drain Signal Group DC Specifications .............................. 161
13-16PECI DC Electrical Limits........................................................................................ 162
13-17System Reference Clocks DC and AC Specifications ...................................................163
14-1 Package Mechanical Attributes................................................................................ 165
14-2 Package Loading Specifications............................................................................... 166
14-3 Package Loading Specifications............................................................................... 166
15-1 CPUID Format ...................................................................................................... 169
15-2 PCI Configuration Header.......................................................................................170
15-3 Host Device ID (DID0) .......................................................................................... 170
15-4 Other Device ID UP3/UP4/H35/UP3-Refresh/H35-Refresh........................................... 170
15-5 Other Device IDs (H Processor Line)........................................................................171
15-6 Graphics Device ID (DID2)..................................................................................... 172
Datasheet, Volume 1 of 2 11
Revision History
§ §
Revision
Number
Description Revision Date
001 Initial Release September 2020
002 Added UP4 SKU information October 2020
003
Chapter 4, “Thermal Management”
• Updated Table 4-2
October 2020
004
Added H35 SKU information
Added Chapter 8, “Direct Media Interface (DMI) and On Package
Interface (OPI)”
January 2021
005
Added H SKU information
Chapter 2, “Technologies”
• Updated Figure 2-5
Chapter 12, “Signal Description”
• Removed the Value column in Section 12.15
Chapter 13, “Electrical Specifications”
• Updated H VCCIN to 2.1V in Table 13-1
May 2021
006 Added H35-Refresh and UP3-Refresh SKU information June 2021
007
Chapter 4, “Thermal Management”
• Updated frequency data
Chapter 13, “Electrical Specifications”
• Updated Table 13-14 and Table 13-16
Updated Chapter 14, “Package Mechanical Specifications”
Chapter 15, “CPU And Device IDs”
• Updated Table 15-1
August 2021
008
Chapter 10, “Display”
• Updated Section 10.3.9
November 2021
009
Chapter 4, “Thermal Management”
• Updated Table 4-2. TDP Specifications
December 2021
010
Chapter 1, “Introduction”
• Added note in Section 1.8, “Operating Systems Support”
February 2022
011
Chapter 1, “Introduction”
• Updated additional support to include Open CL* 3.0 in
Section 1.3.1
• Updated information from “S3 is valid on H only” to “S3 is valid
on both TGL UP3 and TGL H in Linux only.” in Section 1.4.2
• Added new note in Section 1.4.2
May 2022
012
Chapter 10, “Display”
• Updated UP3 and UP4-Processor Line information for DDI A in
Table 10-1
• Updated UP3, UP4 and H-Processor Line information for DP*
with DSC in Table 10-3
• Added new note in Table 10-3
Chapter 12, “Signal Description”
• Updated Dir information for DRAM_RESET#/RESET# in
Table 12-2
• Updated Dir information for DRAM_RESET# in Table 12-3
May 2023
12 Datasheet, Volume 1 of 2
1 Introduction
11
th
Generation Intel
®
Core™ processor is a 64 bit, multi-core processor built on 10
nanometer process technology.
• The UP3-Processor Line and UP4-Processor Line are offered in a 1-Chip Platform
that includes the Intel
®
500 Series Chipset Family On-Package Platform Controller
Hub die on the same package as the processor die.
• The UP3-Refresh is a derivative of the UP3-Processor line. In the rest of this
document, all references to UP3 processor also covers the UP3-Refresh processor
and will be called out separately only when changes exist.
• The H35-processor line and H35-Refresh are derivative of the UP3-Processor line.
H35 processor and H35-Refresh have the same specs as the UP3 processor with the
only change being the PL1 TDP value of 35W as seen in the table below. In the rest
of this document, all references to UP3 processor also covers the H35 processor
and H35-Refresh processor and will not be called out separately.
• The H-processor line is offered in a 2-Chip Platform and connected to a discrete
PCH chipset on the motherboard.
The following table describes the different 11th Generation Intel
®
Core™ processor
lines:
Table 1-1. 11
th
Generation Intel
®
Core™ Processor Lines
Processor Line
1
Package
Base
TDP
3
Processor
IA Cores
Graphics
Configuration
Platform
Type
UP4-Processor Line BGA1598 9W
4
Up to 96EU 1-Chip
2
UP3-Processor Line BGA1449 28W
4
Up to 96EU
1-Chip
2
UP3-Refresh - Processor Line BGA1449 28W
4
Up to 96EU 1-Chip
2
UP3- Pentium/Celeron
Processor Line
BGA1449 15W 2 48EU 1-Chip
H35 Processor Line BGA1449 35W 4 Up to 96EU 1-Chip
H35-Refresh Processor Line BGA1449 35W 4 Up to 96EU 1-Chip
H- Processor Line BGA1787 45W
8
Up to 32EU 2-Chip
6
Note:
1. Processor lines offering may change.
2. For additional TDP Configurations, refer to Chapter 4, “Thermal Management”, for adjustment to the
base TDP required to preserve base frequency associated with the sustained long-term thermal
capability.
3. TDP workload does not reflect I/O connectivity cases such as Thunderbolt™.
Datasheet, Volume 1 of 2 13
Figure 1-1. 11
th
Generation Intel
®
Core™ UP3/UP4/H35/UP3-Refresh//H35-Refresh
Processor Lines Platform Diagram
14 Datasheet, Volume 1 of 2
Figure 1-2. H Processor Line Platform Diagram
Not all processor interfaces and features are presented in all Processor Lines. The
presence of various interfaces and features will be indicated within the relevant
sections and tables.
Note: Throughout this document, the 11
th
Generation Intel
®
Core™ processor may be
referred to as processor andthe Intel
®
500 Series Chipset Family On-Package Platform
Controller Hub (LP) may be referred to as PCH.
1.1 Processor Volatility Statement
11
th
Generation Intel
®
Core™ Processor families do not retain any end-user data when
powered down and/or when the processor is physically removed.
Note: Powered down refers to the state which all processor power rails are off.
1.2 Package Support
The processor is available in the following packages:
• A 26.5 x 18.5 mm, Z= 0.963 +/-0.077 mm (the height from the bottom of the BGA
to the top of the die
), BGA package for 11
th
Generation Intel
®
Core™ UP4-
Processor Line.
Datasheet, Volume 1 of 2 15
• A 45.5 x 25 mm, Z=1.185 +/-0.096 mm (the height from the bottom of the BGA to
the top of the die
), BGA package for 11
th
Generation Intel
®
Core™ UP3-Processor
Line.
• A 50 x 26.5 mm, Z= 1.325 +/- 0.103 mm (
the height from the bottom of the BGA
to the top of the die
), BGA package for H-Processor Line.
1.3 Supported Technologies
• PECI – Platform Environmental Control Interface
• Intel
®
Virtualization Technology (Intel
®
VT)
• Intel
®
Trusted Execution Technology (Intel
®
TXT)
• Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI)
• PCLMULQDQ (Perform Carry-Less Multiplication Quad word) Instruction
• Intel
®
Secure Key
• Execute Disable Bit
• Intel
®
Boot Guard
• SMEP – Supervisor Mode Execution Protection
• SMAP – Supervisor Mode Access Protection
• Intel
®
Software Guard Extensions (Intel
®
SGX)
• May be available on Xeon Processor lines only
• SHA Extensions – Secure Hash Algorithm Extensions
• UMIP – User Mode Instruction Prevention
• RDPID – Read Processor ID
• Total Memory Encryption (Intel
®
TME)
• Availability may vary between different processor lines.
• Control-flow Enforcement Technology (Intel
®
CET)
• KeyLocker Technology
• Intel
®
Smart Cache Technology
• IA Core Level 1 and Level 2 Caches
• Intel
®
Turbo Boost Technology 2.0
• Intel
®
Turbo Boost Max Technology 3.0
• Power Aware Interrupt Routing (PAIR)
• Intel
®
Hyper-Threading Technology (Intel
®
HT Technology)
• Intel
SpeedStep
®
Technology
• Intel
®
Speed Shift Technology
• Intel
®
Advanced Vector Extensions 2 (Intel
®
AVX2)
• Intel
®
Advanced Vector Extensions 512 Bit (Intel
®
AVX-512)
• Intel
®
64 Architecture x2APIC
• Intel
®
Transactional Synchronization Extensions (Intel
®
TSX-NI)
• Intel
®
Dynamic Tuning Technology (Intel
®
DTT)
16 Datasheet, Volume 1 of 2
• Intel
®
GNA 2.0 (Intel
®
GMM and Neural Network Accelerator)
• Cache Line Write Back (CLWB)
• Intel
®
Image Processing Unit (Intel
®
IPU)
• Intel
®
Processor Trace
• Platform CrashLog
• Integrated Reference Clock PLL
Note: The availability of the features above may vary between different processor SKUs.
Refer Chapter 2, “Technologies” for more information.
1.3.1 API Support (Windows*)
• Direct3D* 2015, Direct3D* 12, Direct3D* 11.2, Direct3D* 11.1, Direct3D* 9,
Direct3D* 10, Direct2D*
• OpenGL* 4.5
• Open CL* 2.1, Open CL* 2.0, Open CL* 1.2, Open CL* 3.0
DirectX* extensions:
• PixelSync, Instant Access, Conservative Rasterization, Render Target Reads,
Floating-point De-norms, Shared a Virtual memory, Floating Point atomics, MSAA
sample-indexing, Fast Sampling (Coarse LOD), Quilted Textures, GPU Enqueue
Kernels*, GPU Signals processing unit. Other enhancements include color
compression.
Gen 12 architecture delivers hardware acceleration of Direct X* 12 Render pipeline
comprising of the following stages: Vertex Fetch, Vertex Shader, Hull Shader,
Tessellation, Domain Shader, Geometry Shader, Rasterizer, Pixel Shader, Pixel Output.
1.4 Power Management Support
1.4.1 Processor Core Power Management
• Full support of ACPI C-states as implemented by the following processor C-states:
— C0, C1, C1E, C6, C7, C8, C9, C10
• Enhanced Intel SpeedStep
®
Technology
• Intel
®
Speed Shift
Technology
Refer to Section 3.2, “Processor IA Core Power Management” for more information.
1.4.2 System Power Management
• S0/S0ix, S3, S4, S5
• S3 is valid on both Tiger Lake UP3 and Tiger Lake H in Linux* only.
Note: S3 is not supported in Windows* for both Tiger Lake UP3 and Tiger Lake H.
Refer Chapter 3, “Power Management” for more information.
Datasheet, Volume 1 of 2 17
1.4.3 Memory Controller Power Management
• Disabling Unused System Memory Outputs
• DRAM Power Management and Initialization
• Initialization Role of CKE
• Conditional Self-Refresh
• Dynamic Power Down
• DRAM I/O Power Management
• DDR Electrical Power Gating (EPG)
• Power Training
Refer Section 5.2, “Integrated Memory Controller (IMC) Power Management” for more
information.
1.4.4 Processor Graphics Power Management
1.4.4.1 Memory Power Savings Technologies
• Intel
®
Rapid Memory Power Management (Intel
®
RMPM)
• Intel
®
Smart 2D Display Technology (Intel
®
S2DDT)
1.4.4.2 Display Power Savings Technologies
• Intel
®
(Seamless and Static) Display Refresh Rate Switching (DRRS) with eDP*
port
• Intel
®
Automatic Display Brightness
• Smooth Brightness
• Intel
®
Display Power Saving Technology (Intel
®
DPST 6.3)
• Panel Self-Refresh 2 (PSR 2)
• Low Power Single Pipe (LPSP)
1.4.4.3 Graphics Core Power Savings Technologies
• Intel
®
Graphics Dynamic Frequency
• Intel
®
Graphics Render Standby Technology (Intel
®
GRST)
• Dynamic FPS (Intel
®
DFPS)
Refer Chapter 9, “Graphics” for more information.
1.5 Thermal Management Support
• Digital Thermal Sensor
• Intel
®
Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Open and Closed Loop Throttling
18 Datasheet, Volume 1 of 2
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan Speed Control with DTS
• Intel
®
Turbo Boost Technology 2.0 Power Control
• Intel
®
Dynamic Tuning - Intel
®
Dynamic Platform and Thermal Framework (DPTF).
Refer Chapter 4, “Thermal Management” for more information.
1.6 Ball-out Information
For the PCH ball information, refer to Intel
®
500 Series Chipset Family Platform
Controller Hub BGA Package Ballout.
1.7 Processor Testability
A DCI on-board connector should be placed, to enable full debug capabilities. For 11
th
Generation Intel
®
Core™ processor SKUs, a Direct Connect Interface Tool connector is
highly recommended to enable lower C-state to debug. The processor includes
boundary-scan for board and system level testability.
1.8 Operating Systems Support
Table 1-2. Operating Systems Support
1.9 Terminology and Special Marks
Processor Line Windows* 10 64 bit OS X Linux* OS Chrome* OS
UP4-processor line Yes Yes Yes Yes
UP3-processor line Yes Yes Yes Yes
H35-processor line Yes Yes Yes No
UP3-Refresh processor line Yes Yes Yes Yes
H- processor line Yes Yes Yes No
Note: Refer to OS Vendor site for more information regarding latest OS revision support.
Table 1-3. Terminology (Sheet 1 of 4)
Term Description
4K Ultra High Definition (UHD)
AES Advanced Encryption Standard
AGC Adaptive Gain Control
API Application Programming Interface
AVC Advanced Video Coding
BLT Block Level Transfer
BPP Bits per Pixel
CDR Clock and Data Recovery
Datasheet, Volume 1 of 2 19
CTLE Continuous Time Linear Equalizer
DDC Digital Display Channel (Refer to PCH Datasheet (#631119
) for more details)
DDI Digital Display Interface for DP or HDMI/DVI
DSI Display Serial Interface
DDR4 Fourth-Generation Double Data Rate SDRAM Memory Technology
DFE Decision Feedback Equalizer
D0ix-states
USB controller power states ranging from D0i0 to D0i3, where D0i0 is fully powered on
and D0i3 is primarily powered off. Controlled by SW.
DMA Direct Memory Access
DPPM Dynamic Power Performance Management
DPTF Intel Dynamic Platform and Thermal Framework
DMI Direct Media Interface
DP* DisplayPort*
DSC Display Stream Compression
DSI Display Serial Interface
DTS Digital Thermal Sensor
ECC Error Correction Code - used to fix DDR transactions errors
eDP* Embedded DisplayPort*
EU Execution Unit in the Graphics Processor
FIVR Fully Integrated Voltage Regulator
GSA Graphics in System Agent
GNA Gauss Newton Algorithm
HDCP High-Bandwidth Digital Content Protection
HDMI* High Definition Multimedia Interface
IMC Integrated Memory Controller
Intel
®
64 Technology 64-bit memory extensions to the IA-32 architecture
Intel
®
DPST Intel
®
Display Power Saving Technology
Intel
®
PTT Intel
®
Platform Trust Technology
Intel
®
TSX-NI Intel
®
Transactional Synchronization Extensions
Intel
®
TXT Intel
®
Trusted Execution Technology
Intel
®
VT
Intel
®
Virtualization Technology. Processor Virtualization, when used in conjunction
with Virtual Machine Monitor software, enables multiple, robust independent software
environments inside a single platform.
Intel
®
VT-d
Intel
®
Virtualization Technology (Intel
®
VT) for Directed I/O. Intel
®
VT-d is a hardware
assist, under system software (Virtual Machine Manager or OS) control, for enabling I/
O device Virtualization. Intel
®
VT-d also brings robust security by providing protection
from errant DMAs by using DMA remapping, a key feature of Intel
®
VT-d.
ITH Intel
®
Trace Hub
IOV I/O Virtualization
IPU Image Processing Unit
LFM
Low Frequency Mode. corresponding to the Enhanced Intel SpeedStep
®
Technology’s
lowest voltage/frequency pair. It can be read at MSR CEh [47:40]. For more
information, refer to appropriate BIOS Specification.
LLC Last Level Cache
Table 1-3. Terminology (Sheet 2 of 4)
Term Description
20 Datasheet, Volume 1 of 2
LPDDR4x Low Power Double Data Rate SDRAM memory technology /x- additional power save.
LPM
Low Power Mode.The LPM Frequency is less than or equal to the LFM Frequency. The
LPM TDP is lower than the LFM TDP as the LPM configuration limits the processor to
single thread operation
LPSP Low-Power Single Pipe
LSF
Lowest Supported Frequency.This frequency is the lowest frequency where
manufacturing confirms logical functionality under the set of operating conditions.
LTR
The Latency Tolerance Reporting (LTR) mechanism enables Endpoints to report their
service latency requirements for Memory Reads and Writes to the Root Complex, so
that power management policies for central platform resources (such as main memory,
RC internal interconnects, and snoop resources) can be implemented to consider
Endpoint service requirements.
MCP
Multi-Chip Package - includes the processor and the PCH. In some SKUs, it might have
additional On-Package Cache.
MFM
Minimum Frequency Mode. MFM is the minimum ratio supported by the processor and
can be read from MSR CEh [55:48]. For more information, refer to the appropriate
BIOS specification.
MLC Mid-Level Cache
MPEG
Motion Picture Expert Group, international standard body JTC1/SC29/WG11 under
ISO/IEC that has defined audio and video compression standards such as MPEG-1,
MPEG-2, and MPEG-4, etc.
NCTF
Non-Critical to Function. NCTF locations are typically redundant ground or non-critical
reserved balls/lands, so the loss of the solder joint continuity at end of life conditions
will not affect the overall product functionality.
OPVR On-Package Voltage Regulator
PCH
Platform Controller Hub. The chipset with centralized platform capabilities including the
main I/O interfaces along with display connectivity, audio features, power
management, manageability, security, and storage features. The PCH may also be
referred to as “chipset”.
PECI Platform Environment Control Interface
PEG PCI Express* Graphics
PL1, PL2, PL3 Power Limit 1, Power Limit 2, Power Limit 3
PMIC Power Management Integrated Circuit
Processor The 64 bit multi-core component (package)
Processor Core
The term “processor core” refers to the Si die itself, which can contain multiple
execution cores. Each execution core has an instruction cache, data cache, and 256-KB
L2 cache. All execution cores share the LLC.
Processor Graphics Intel
®
Processor Graphics
PSR Panel Self-Refresh
PSx Power Save States (PS0, PS1, PS2, PS3, PS4)
Rank
A unit of DRAM corresponding to four to eight devices in parallel, ignoring ECC. These
devices are usually, but not always, mounted on a single side of a SoDIMM.
ROP Rest of Platform
SCI System Control Interrupt. SCI is used in the ACPI protocol.
SDP Scenario Design Power
SGX Software Guard Extension
SHA Secure Hash Algorithm
SSC Spread Spectrum Clock
SSIC Super Speed Inter-Chip
Table 1-3. Terminology (Sheet 3 of 4)
Term Description
Datasheet, Volume 1 of 2 21
Storage Conditions Refer Section 14.3, “Package Storage Specifications”
STR Suspend to RAM
S0ix-states Processor residency idle standby power states.
TAC Thermal Averaging Constant
TBT Thunderbolt™ Interface
TCC Thermal Control Circuit
TDP Thermal Design Power
TTV TDP Thermal Test Vehicle TDP
USB-R
The type of storage redirection used from AMT 11.0 onward. In contrast to IDE-R,
which presents remote floppy or CD drives as though they were integrated into the
host machine, USB-R presents remote drives as though they were connected via a USB
port.
V
CC
Processor Core Power Supply
V
CCGT
Processor Graphics Power Supply
VCCIO_OUT I/O Power Supply
V
CCSA
System Agent Power Supply
VLD Variable Length Decoding
VMD Volume Management Device
VPID Virtual Processor ID
V
SS
Processor Ground
Table 1-4. Special marks
Mark Definition
[]
Brackets ([]) sometimes follow a ball, pin, registers or a bit name. These brackets enclose a
range of numbers, for example, TCP[2:0]_TXRX_P[1:0] may refer to four USB-C* pins or
EAX[7:0] may indicate a range that is 8 bits length.
_N / # / B
A suffix of _N or # or B indicates an active low signal. For example, CATERR#
Note: _N does not refer to a differential pair of signals such as CLK_P, CLK_N
0x000
Hexadecimal numbers are identified with an x in the number. All numbers are decimal (base 10)
unless otherwise specified. Non-obvious binary numbers have the ‘b’ enclosed at the end of the
number. For example, 0101b
Table 1-3. Terminology (Sheet 4 of 4)
Term Description
22 Datasheet, Volume 1 of 2
1.10 Related Documents
§ §
Document Document Number
Intel
®
500 Series Chipset Family On-Package Platform Controller Hub Datasheet,
Volume 1 of 2
631119
Intel
®
500 Series Chipset Family On-Package Platform Controller Hub Datasheet,
Volume 2 of 2
631120
11th Gen Intel
®
Core™ Processor Family for IoT Platforms - Datasheet Addendum 632133
11th Generation Intel
®
Core™ Processors Datasheet Volume 2 of 2 631122
11th Generation Intel
®
Core™ Processor Family Datasheet Volume 2b of 2 643524
11th Generation Intel
®
Core™ Processor Family Specification Update 631123
Intel
®
500 Series Chipset Family On- Package Platform Controller Hub (PCH) Speci-
fication Update
630747
Datasheet, Volume 1 of 2 23
2 Technologies
This chapter provides a high-level description of Intel technologies implemented in the
processor.
The implementation of the features may vary between the processor SKUs.
Details on the different technologies of Intel processors and other relevant external
notes are located at the Intel technology web site: http://www.intel.com/technology/
Note: The last section of this chapter is dedicated to deprecated technologies. These
technologies are not supported in this processor but were supported in previous
generations.
2.1 Platform Environmental Control Interface (PECI)
PECI is an Intel proprietary interface that provides a communication channel between
Intel processors and external components such as Super IO (SIO) and Embedded
Controllers (EC) to provide processor temperature, Turbo, Configurable TDP, and
Memory Throttling Control mechanisms and many other services. PECI is used for
platform thermal management and real-time control and configuration of processor
features and performance.
Note: PECI interface can be implemented using a single BI_DIRECTIONAL I/O pin serial
interface or using the eSPI parallel bus
2.1.1 PECI Bus Architecture
The PECI architecture is based on a wired-OR bus that the clients (as processor PECI)
can pull up (with the strong drive).
The idle state on the bus is ‘0’ (logical low) and near zero (Logical voltage level).
Note: PECI supported frequency range is 3.2 KHz - 1 MHz.
The following figures demonstrate PECI design and connectivity:
• PECI Host-Clients Connection: While the host/originator can be third party PECI
host and one of the PECI client is a processor PECI device.
• PECI EC Connection.
24 Datasheet, Volume 1 of 2
Figure 2-1. Example for PECI Host-Clients Connection
VCC
ST
Host / Originator
Q1
nX
Q2
1X
PECI
C
PECI
<10pF/Node
Q3
nX
VCC
ST
PECI Client
Additional
PECI Clients
Datasheet, Volume 1 of 2 25
Figure 2-2. Example for PECI EC Connection
2.2 Intel
®
Virtualization Technology (Intel
®
VT)
Intel
®
Virtualization Technology (Intel
®
VT) makes a single system appear as multiple
independent systems to software. This allows multiple, independent operating systems
to run simultaneously on a single system. Intel
®
VT comprises technology components
to support Virtualization of platforms based on Intel
®
architecture microprocessors and
chipsets.
Intel
®
Virtualization Technology (Intel
®
VT) Intel
®
64 and Intel
®
Architecture (Intel
®
VT-x) added hardware support in the processor to improve the Virtualization
performance and robustness. Intel
®
Virtualization Technology for Directed I/O (Intel
®
VT-d) extends Intel
®
VT-x by adding hardware assisted support to improve I/O device
Virtualization performance.
Intel
®
VT-x specifications and functional descriptions are included in the Intel
®
64
Architectures Software Developer’s Manual, Volume 3 available at:
http://www.intel.com/products/processor/manuals
The Intel
®
VT-d specification and other VT documents can be referenced at:
http://www.intel.com/content/www/us/en/virtualization/virtualization-technology/
intel-virtualization-technology.html
2.2.1 Intel
®
Virtualization Technology (Intel
®
VT) for Intel
®
64
and Intel
®
Architecture (Intel
®
VT-X)
Intel
®
VT-x Objectives
Intel
®
VT-x provides hardware acceleration for virtualization of IA platforms. Virtual
Machine Monitor (VMM) can use Intel
®
VT-x features to provide an improved reliable
Virtualization platform. By using Intel
®
VT-x, a VMM is:
VCCST
VCCST
VCCST
R
In
Out
Processor
PECI
43 Ohm
Embedded
Controller
VCCST
VREF _ CPU
26 Datasheet, Volume 1 of 2
• Robust: VMMs no longer need to use para-virtualization or binary translation. This
means that VMMs will be able to run off-the-shelf operating systems and
applications without any special steps.
• Enhanced: Intel
®
VT enables VMMs to run 64 bit guest operating systems on IA
x86 processors.
• More Reliable: Due to the hardware support, VMMs can now be smaller, less
complex, and more efficient. This improves reliability and availability and reduces
the potential for software conflicts.
• More Secure: The use of hardware transitions in the VMM strengthens the
isolation of VMs and further prevents corruption of one VM from affecting others on
the same system.
Intel
®
VT-x Key Features
The processor supports the following added new Intel
®
VT-x features:
• Mode-based Execute Control for EPT (MBEC)
— A mode of EPT operation which enables different controls for executability of
Guest Physical Address (GPA) based on Guest specified mode (User/
Supervisor) of linear address translating to the GPA. When the mode is
enabled, the executability of a GPA is defined by two bits in EPT entry. One bit
for accesses to user pages and other one for accesses to supervisor pages.
— This mode requires changes in VMCS and EPT entries. VMCS includes a bit
“Mode-based execute control for EPT” which is used to enable/disable the
mode. An additional bit in EPT entry is defined as “execute access for user-
mode linear addresses”; the original EPT execute access bit is considered as
“execute access for supervisor-mode linear addresses”. If the “mode-based
execute control for EPT” VM-execution control is disabled the additional bit is
ignored and the system work with one bit i.e. the original bit, for execute
control for both user and supervisor pages.
— Behavioral changes - Behavioral changes are across three areas:
• Access to GPA - If the “Mode-based execute control for EPT”
VMexecution control is 1, treatment of guest-physical accesses by
instruction fetches depends on the linear address from which an
instruction is being fetched:
a. If the translation of the linear address specifies user mode (the U/S bit
was set in every paging structure entry used to translate the linear
address), the resulting guest-physical address is executable under EPT
only if the XU bit (at position 10) is set in every EPT paging-structure
entry used to translate the guest-physical address.
b. If the translation of the linear address specifies supervisor mode (the U/
S bit was clear in at least one of the paging-structure entries used to
translate the linear address), the resulting guest-physical address is
executable under EPT only if the XS bit is set in every EPT paging-structure
entry used to translate the guest-physical address.
The XU and XS bits are used only when translating linear addresses
for guest code fetches. They do not apply to guest page walks, data
accesses, or A/D-bit updates.
• VMEntry - If the “activate secondary controls” and “Mode-based execute
control for EPT” VM-execution controls are both 1, VM entries ensure that
the “enable EPT” VM-execution control is 1. VM entry fails if this check
fails. When such a failure occurs, control is passed to the next instruction,
Datasheet, Volume 1 of 2 27
• VMExit - The exit qualification due to EPT violation reports clearly
whether the violation was due to User mode access or supervisor mode
access.
— Capability Querying: IA32_VMX_PROCBASED_CTLS2 has bit to indicate the
capability, RDMSR can be used to read and query whether the processor
supports the capability or not.
• Extended Page Table (EPT) Accessed and Dirty Bits
— EPT A/D bits enabled VMMs to efficiently implement memory management and
page classification algorithms to optimize VM memory operations, such as de-
fragmentation, paging, live migration, and check-pointing. Without hardware
support for EPT A/D bits, VMMs may need to emulate A/D bits by marking EPT
paging-structures as not-present or read-only, and incur the overhead of EPT
page-fault VM exits and associated software processing.
• EPTP (EPT Pointer) Switching
— EPTP switching is a specific VM function. EPTP switching allows guest software
(in VMX non-root operation, supported by EPT) to request a different EPT
paging-structure hierarchy. This is a feature by which software in VMX non-root
operation can request a change of EPTP without a VM exit. The software will be
able to choose among a set of potential EPTP values determined in advance by
software in VMX root operation.
• Pause Loop Exiting
— Support VMM schedulers seeking to determine when a virtual processor of a
multiprocessor virtual machine is not performing useful work. This situation
may occur when not all virtual processors of the virtual machine are currently
scheduled and when the virtual processor in question is in a loop involving the
PAUSE instruction. The new feature allows detection of such loops and is thus
called PAUSE-loop exiting.
The processor IA core supports the following Intel
®
VT-x features:
• Extended Page Tables (EPT)
— EPT is hardware assisted page table virtualization
— It eliminates VM exits from guest OS to the VMM for shadow page-table
maintenance
• Virtual Processor IDs (VPID)
— Ability to assign a VM ID to tag processor IA core hardware structures (such as
TLBs)
— This avoids flushes on VM transitions to give a lower-cost VM transition time
and an overall reduction in virtualization overhead.
• Guest Preemption Timer
— The mechanism for a VMM to preempt the execution of a guest OS after an
amount of time specified by the VMM. The VMM sets a timer value before
entering a guest
— The feature aids VMM developers in flexibility and Quality of Service (QoS)
guarantees
• Descriptor-Table Exiting
— Descriptor-table exiting allows a VMM to protect a guest OS from internal
(malicious software based) attack by preventing the relocation of key system
data structures like IDT (interrupt descriptor table), GDT (global descriptor
table), LDT (local descriptor table), and TSS (task segment selector).
— A VMM using this feature can intercept (by a VM exit) attempts to relocate
these data structures and prevent them from being tampered by malicious
software.
28 Datasheet, Volume 1 of 2
2.2.2 Intel
®
Virtualization Technology (Intel
®
VT) for Directed
I/O (Intel
®
VT-d)
Intel
®
VT-d Objectives
The key Intel
®
VT-d objectives are domain-based isolation and hardware-based
virtualization. A domain can be abstractly defined as an isolated environment in a
platform to which a subset of host physical memory is allocated. Intel
®
VT-d provides
accelerated I/O performance for a virtualization platform and provides software with
the following capabilities:
• I/O Device Assignment and Security: for flexibly assigning I/O devices to VMs
and extending the protection and isolation properties of VMs for I/O operations.
• DMA Remapping: for supporting independent address translations for Direct
Memory Accesses (DMA) from devices.
• Interrupt Remapping: for supporting isolation and routing of interrupts from
devices and external interrupt controllers to appropriate VMs.
• Reliability: for recording and reporting to system software DMA and interrupt
errors that may otherwise corrupt memory or impact VM isolation.
Intel
®
VT-d accomplishes address translation by associating transaction from a given
I/O device to a translation table associated with the Guest to which the device is
assigned. It does this by means of the data structure in the following illustration. This
table creates an association between the device's PCI Express* Bus/Device/Function
(B/D/F) number and the base address of a translation table. This data structure is
populated by a VMM to map devices to translation tables in accordance with the device
assignment restrictions above and to include a multi-level translation table (VT-d Table)
that contains Guest specific address translations.
Datasheet, Volume 1 of 2 29
Intel
®
VT-d functionality often referred to as an Intel
®
VT-d Engine, has typically been
implemented at or near a PCI Express* host bridge component of a computer system.
This might be in a chipset component or in the PCI Express functionality of a processor
with integrated I/O. When one such VT-d engine receives a PCI Express transaction
from a PCI Express bus, it uses the B/D/F number associated with the transaction to
search for an Intel
®
VT-d translation table. In doing so, it uses the B/D/F number to
traverse the data structure shown in the above figure. If it finds a valid Intel
®
VT-d
table in this data structure, it uses that table to translate the address provided on the
PCI Express bus. If it does not find a valid translation table for a given translation, this
results in an Intel
®
VT-d fault. If Intel
®
VT-d translation is required, the Intel
®
VT-d
engine performs an N-level table walk.
For more information, refer Intel
®
Virtualization Technology for Directed I/O
Architecture Specification at http://www.intel.com/content/dam/www/public/us/en/
documents/product-specifications/vt-directed-io-spec.pdf
Figure 2-3. Device to Domain Mapping Structures
30 Datasheet, Volume 1 of 2
Intel
®
VT-d Key Features
The processor supports the following Intel
®
VT-d features:
• Memory controller and processor graphics comply with the Intel
®
VT-d 2.1
Specification.
• Two Intel
®
VT-d DMA remap engines.
— iGFX DMA remap engine
— Default DMA remap engine (covers all devices except iGFX)
• Support for root entry, context entry, and the default context
• 39 bit guest physical address and host physical address widths
• Support for 4 K page sizes only
• Support for register-based fault recording only (for single entry only) and support
for MSI interrupts for faults
• Support for both leaf and non-leaf caching
• Support for boot protection of default page table
• Support for non-caching of invalid page table entries
• Support for hardware-based flushing of translated but pending writes and pending
reads, on IOTLB invalidation
• Support for Global, Domain-specific and Page specific IOTLB invalidation
• MSI cycles (MemWr to address FEEx_xxxxh) not translated Translation faults result
in cycle forwarding to VBIOS region (byte enables masked for writes). Returned
data may be bogus for internal agents, PEG/DMI interfaces return unsupported
request status
• Interrupt Remapping is supported
• Queued invalidation is supported
• Intel
®
VT-d translation bypass address range is supported (Pass Through)
The processor supports the following added new Intel
®
VT-d features:
• 4-level Intel
®
VT-d Page walk – both default Intel
®
VT-d engine, as well as the
Processor Graphics VT-d engine are upgraded to support 4-level Intel
®
VT-d tables
(adjusted guest address width of 48 bits)
• Intel
®
VT-d super-page – support of Intel
®
VT-d super-page (2 MB, 1 GB) for
default Intel
®
VT-d engine (that covers all devices except IGD)
IGD Intel
®
VT-d engine does not support super-page and BIOS should disable
super-page in default Intel
®
VT-d engine when iGfx is enabled.
Note: Intel
®
VT-d Technology may not be available on all SKUs.
2.2.3 Intel
®
APIC Virtualization Technology (Intel
®
APICv)
APIC Virtualization is a collection of features that can be used to support the
Virtualization of interrupts and the Advanced Programmable Interrupt Controller
(APIC).
Datasheet, Volume 1 of 2 31
When APIC Virtualization is enabled, the processor emulates many accesses to the
APIC, tracks the state of the virtual APIC, and delivers virtual interrupts — all in VMX
non-root operation without a VM exit.
The following are the VM-execution controls relevant to APIC Virtualization and virtual
interrupts:
• Virtual-interrupt Delivery. This controls enable the evaluation and delivery of
pending virtual interrupts. It also enables the emulation of writes (memory-
mapped or MSR-based, as enabled) to the APIC registers that control interrupt
prioritization.
• Use TPR Shadow. This control enables emulation of accesses to the APIC’s task-
priority register (TPR) via CR8 and, if enabled, via the memory-mapped or MSR-
based interfaces.
• Virtualize APIC Accesses. This control enables virtualization of memory-mapped
accesses to the APIC by causing VM exits on accesses to a VMM-specified APIC-
access page. Some of the other controls, if set, may cause some of these accesses
to be emulated rather than causing VM exits.
• Virtualize x2APIC Mode. This control enables virtualization of MSR-based
accesses to the APIC.
• APIC-register Virtualization. This control allows memory-mapped and MSR-
based reads of most APIC registers (as enabled) by satisfying them from the
virtual-APIC page. It directs memory-mapped writes to the APIC-access page to
the virtual-APIC page, following them by VM exits for VMM emulation.
• Process Posted Interrupts. This control allows software to post virtual interrupts
in a data structure and send a notification to another logical processor; upon
receipt of the notification, the target processor will process the posted interrupts by
copying them into the virtual-APIC page.
Note: Intel
®
APIC Virtualization Technology may not be available on all SKUs.
http://www.intel.com/products/processor/manuals
2.3 Security Technologies
2.3.1 Intel
®
Trusted Execution Technology (Intel
®
TXT)
Intel
®
Trusted Execution Technology (Intel
®
TXT) defines platform-level enhancements
that provide the building blocks for creating trusted platforms.
The Intel
®
TXT platform helps to provide the authenticity of the controlling
environment such that those wishing to rely on the platform can make an appropriate
trust decision. The Intel
®
TXT platform determines the identity of the controlling
environment by accurately measuring and verifying the controlling software.
Another aspect of the trust decision is the ability of the platform to resist attempts to
change the controlling environment. The Intel
®
TXT platform will resist attempts by
software processes to change the controlling environment or bypass the bounds set by
the controlling environment.
Intel
®
TXT is a set of extensions designed to provide a measured and controlled launch
of system software that will then establish a protected environment for itself and any
additional software that it may execute.
32 Datasheet, Volume 1 of 2
These extensions enhance two areas:
• The launching of the Measured Launched Environment (MLE).
• The protection of the MLE from potential corruption.
The enhanced platform provides these launch and control interfaces using Safer Mode
Extensions (SMX).
The SMX interface includes the following functions:
• Measured/Verified launch of the MLE.
• Mechanisms to ensure the above measurement is protected and stored in a secure
location.
• Protection mechanisms that allow the MLE to control attempts to modify itself.
The processor also offers additional enhancements to System Management Mode
(SMM) architecture for enhanced security and performance. The processor provides
new MSRs to:
• Enable a second SMM range
• Enable SMM code execution range checking
• Select whether SMM Save State is to be written to legacy SMRAM or to MSRs
• Determine if a thread is going to be delayed entering SMM
• Determine if a thread is blocked from entering SMM
• Targeted SMI, enable/disable threads from responding to SMIs, both VLWs, and IPI
For the above features, BIOS should test the associated capability bit before attempting
to access any of the above registers.
For more information, refer the Intel
®
Trusted Execution Technology Measured
Launched Environment Programming Guide at:
http://www.intel.com/content/www/us/en/software-developers/intel-txt-software-
development-guide.html
Note: Intel
®
TXT Technology may not be available on all SKUs.
2.3.2 Intel
®
Advanced Encryption Standard New Instructions
(Intel
®
AES-NI)
The processor supports Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) that are a set of Single Instruction Multiple Data (SIMD) instructions that
enable fast and secure data encryption and decryption based on the Advanced
Encryption Standard (AES). Intel
®
AES-NI is valuable for a wide range of cryptographic
applications, such as applications that perform bulk encryption/decryption,
authentication, random number generation, and authenticated encryption. AES is
broadly accepted as the standard for both government and industrial applications and
is widely deployed in various protocols.
Intel
®
AES-NI consists of six Intel
®
SSE instructions. Four instructions, AESENC,
AESENCLAST, AESDEC, and AESDELAST facilitate high-performance AES encryption
and decryption. The other two, AESIMC and AESKEYGENASSIST, support the AES key
expansion procedure. Together, these instructions provide full hardware for supporting
AES;
• Offering security,
Datasheet, Volume 1 of 2 33
• High performance, and
• Flexibility.
This generation of the processor has increased the performance of the Intel
®
AES-NI
significantly compared to previous products.
The Intel
®
AES-NI specifications and functional descriptions are included in http://
www.intel.com/products/processor/manuals
Note: Intel
®
AES-NI Technology may not be available on all SKUs.
2.3.3 Perform Carry-Less Multiplication Quad Word Instruction
(PCLMULQDQ)
The processor supports the carry-less multiplication instruction, PCLMULQDQ.
PCLMULQDQ is a Single Instruction Multiple Data (SIMD) instruction that computes the
128 bit carry-less multiplication of two 64 bit operands without generating and
propagating carries. Carry-less multiplication is an essential processing component of
several cryptographic systems and standards. Hence, accelerating carry-less
multiplication can significantly contribute to achieving high-speed secure computing
and communication.
PCLMULQDQ specifications and functional descriptions are included in
http://www.intel.com/products/processor/manuals
2.3.4 Intel
®
Secure Key
The processor supports Intel
®
Secure Key (formerly known as Digital Random Number
Generator or DRNG), a software visible random number generation mechanism
supported by a high-quality entropy source. This capability is available to programmers
through the RDRAND instruction. The resultant random number generation capability is
designed to comply with existing industry standards in this regard (ANSI X9.82 and
NIST SP 800-90).
Some possible usages of the RDRAND instruction include cryptographic key generation
as used in a variety of applications, including communication, digital signatures, secure
storage, and so on.
RDRAND specifications and functional descriptions are included in
http://www.intel.com/products/processor/manuals
2.3.5 Execute Disable Bit
The Execute Disable Bit allows memory to be marked as non-executable when
combined with a supporting operating system. If code attempts to run in non-
executable memory, the processor raises an error to the operating system. This feature
can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities
and can, thus, help improve the overall security of the system.
34 Datasheet, Volume 1 of 2
2.3.6 Boot Guard Technology
Boot Guard technology is a part of boot integrity protection technology. Boot Guard can
help protect the platform boot integrity by preventing the execution of unauthorized
boot blocks. With Boot Guard, platform manufacturers can create boot policies such
that invocation of an unauthorized (or untrusted) boot block will trigger the platform
protection per the manufacturer's defined policy.
With verification based in the hardware, Boot Guard extends the trust boundary of the
platform boot process down to the hardware level.
Boot Guard accomplishes this by:
• Providing of hardware-based Static Root of Trust for Measurement (S-RTM) and the
Root of Trust for Verification (RTV) using Intel architectural components.
• Providing of architectural definition for platform manufacturer Boot Policy.
• Enforcing of manufacture provided Boot Policy using Intel architectural
components.
Benefits of this protection are that Boot Guard can help maintain platform integrity by
preventing re-purposing of the manufacturer’s hardware to run an unauthorized
software stack.
Note: Boot Guard availability may vary between the different SKUs.
2.3.7 Intel
®
Supervisor Mode Execution Protection (SMEP)
Intel
®
Supervisor Mode Execution Protection (SMEP) is a mechanism that provides the
next level of system protection by blocking malicious software attacks from user mode
code when the system is running in the highest privilege level. This technology helps to
protect from virus attacks and unwanted code from harming the system. For more
information, refer:
http://www.intel.com/products/processor/manuals
2.3.8 Intel
®
Supervisor Mode Access Protection (SMAP)
Intel
®
Supervisor Mode Access Protection (SMAP) is a mechanism that provides next
level of system protection by blocking a malicious user from tricking the operating
system into branching off user data. This technology shuts down very popular attack
vectors against operating systems.
For more information, refer:
http://www.intel.com/products/processor/manuals
2.3.9 Intel
®
Software Guard Extensions (Intel
®
SGX)
Software Guard Extensions (SGX) is a processor enhancement designed to help protect
application integrity and confidentiality of secrets and withstands software and certain
hardware attacks.
Software Guard Extensions (SGX) architecture provides the capability to create isolated
execution environments named Enclaves that operate from a protected region of
memory.
Datasheet, Volume 1 of 2 35
Enclave code can be accessed using new special ISA commands that jump into per
Enclave predefined addresses. Data within an Enclave can only be accessed from that
same Enclave code.
The latter security statements hold under all privilege levels including supervisor mode
(ring-0), System Management Mode (SMM) and other Enclaves.
Intel
®
SGX features a memory encryption engine that both encrypt Enclave memory as
well as protect it from corruption and replay attacks.
Intel
®
SGX benefits over alternative Trusted Execution Environments (TEEs) are:
• Enclaves are written using C/C++ using industry standard build tools.
• High processing power as they run on the processor.
• Large amount of memory are available as well as non-volatile storage (such as disk
drives).
• Simple to maintain and debug using standard IDEs (Integrated Development
Environment)
• Scalable to a larger number of applications and vendors running concurrently
• Dynamic memory allocation:
— Heap and thread-pool management
— On-demand stack growth
— Dynamic module/library loading
— Concurrency management in applications such as garbage collectors
— Write-protection of EPC pages (Enclave Page Cache - Enclave protected
memory) after initial relocation
— On-demand creation of code pages (JIT, encrypted code modules)
• Allow Launch Enclaves other than the one currently provided by Intel
• Maximum protected memory size has increased to 256 MB.
— Supports 64, 128 and 256 MB protected memory sizes.
• VMM Over-subscription. The VMM over-subscription mechanism allows a VMM to
make more resources available to virtual machines than what is actually available
on the platform. The initial Intel
®
SGX architecture was optimized for EPC
partitioning/ballooning model for VMMs, where a VMM assigns a static EPC partition
to each SGX guest OS without over-subscription and guests are free to manage
(i.e. oversubscribe) their own EPC partitions. The Intel
®
SGX EPC Over subscription
Extensions architecture provides a set of new instructions allowing VMMs to
efficiently oversubscribe EPC memory for its guest operating systems.
For more information, refer Intel
®
SGX website at:
https://software.intel.com/en-us/sgx.
For more information, refer:
http://www.intel.com/products/processor/manuals:
Note: Intel
®
SGX may be available in Xeon SKUs only.
36 Datasheet, Volume 1 of 2
2.3.10 Intel
®
Secure Hash Algorithm Extensions (Intel
®
SHA
Extensions)
The Secure Hash Algorithm (SHA) is one of the most commonly employed
cryptographic algorithms. Primary usages of SHA include data integrity, message
authentication, digital signatures, and data de-duplication. As the pervasive use of
security solutions continues to grow, SHA can be seen in more applications now than
ever. The Intel
®
SHA Extensions are designed to improve the performance of these
compute-intensive algorithms on Intel
®
architecture-based processors.
The Intel
®
SHA Extensions are a family of seven instructions based on the Intel
®
Streaming SIMD Extensions (Intel
®
SSE) that are used together to accelerate the
performance of processing SHA-1 and SHA-256 on Intel architecture-based processors.
Given the growing importance of SHA in our everyday computing devices, the new
instructions are designed to provide a needed boost of performance to hashing a single
buffer of data. The performance benefits will not only help improve responsiveness and
lower power consumption for a given application, but they may also enable developers
to adopt SHA in new applications to protect data while delivering to their user
experience goals. The instructions are defined in a way that simplifies their mapping
into the algorithm processing flow of most software libraries, thus enabling easier
development.
More information on Intel
®
SHA can be found at:
http://software.intel.com/en-us/artTGLes/intel-sha-extensions
2.3.11 User Mode Instruction Prevention (UMIP)
User Mode Instruction Prevention (UMIP) provides additional hardening capability to
the OS kernel by allowing certain instructions to execute only in supervisor mode (Ring
0).
If the OS opt-in to use UMIP, the following instruction are enforced to run in supervisor
mode:
• SGDT - Store the GDTR register value
• SIDT - Store the IDTR register value
• SLDT - Store the LDTR register value
• SMSW - Store Machine Status Word
• STR - Store the TR register value
An attempt at such execution in user mode causes a general protection exception
(#GP).
UMIP specifications and functional descriptions are included in:
http://www.intel.com/products/processor/manuals
2.3.12 Read Processor ID (RDPID)
A companion instruction that returns the current logical processor's ID and provides a
faster alternative to using the RDTSCP instruction.
RDPID specifications and functional descriptions are included in:
Datasheet, Volume 1 of 2 37
http://www.intel.com/products/processor/manuals
2.3.13 Total Memory Encryption (Intel
®
TME)
This technology encrypts the platform’s entire memory with a single key. TME, when
enabled via BIOS configuration, ensures that all memory accessed from the Intel
processor is encrypted.
TME encrypts memory accesses using the AES XTS algorithm with 128-bit keys. The
encryption key used for memory encryption is generated using a hardened random
number generator in the processor and is not exposed to software.
Data in-memory and on the external memory buses is encrypted and exists in plain
text only inside the processor. This allows existing software to operate without any
modification while protecting memory using TME. TME does not protect memory from
modifications.
TME allows the BIOS to specify a physical address range to remain unencrypted.
Software running on a TME enabled system has full visibility into all portions of memory
that are configured to be unencrypted by reading a configuration register in the
processor.
Note: Memory access to nonvolatile memory (Optane) is encrypted as well.
More information on Intel
®
TME can be found at:
https://software.intel.com/sites/default/files/managed/a5/16/Multi-Key-Total-Memory-
Encryption-Spec.pdf
Note: Multi-Key Total Memory Encryption (MKTME) is not supported.
2.3.14 Control-flow Enforcement Technology (Intel
®
CET)
Return-oriented Programming (ROP), and similarly CALL/JMP-oriented programming
(COP/JOP), have been the prevalent attack methodology for stealth exploit writers
targeting vulnerabilities in programs.
CET provides the following components to defend against ROP/JOP style control-flow
subversion attacks:
2.3.14.1 Shadow Stack
A shadow stack is a second stack for the program that is used exclusively for control
transfer operations. This stack is separate from the data stack and can be enabled for
operation individually in user mode or supervisor mode.
The shadow stack is protected from tamper through the page table protections such
that regular store instructions cannot modify the contents of the shadow stack. To
provide this protection the page table protections are extended to support an additional
attribute for pages to mark them as “Shadow Stack” pages. When shadow stacks are
enabled, control transfer instructions/flows such as near call, far call, call to interrupt/
exception handlers, and so on. store their return addresses to the shadow stack. The
RET instruction pops the return address from both stacks and compares them. If the
38 Datasheet, Volume 1 of 2
return addresses from the two stacks do not match, the processor signals a control
protection exception (#CP). Stores from instructions such as MOV, XSAVE, and so on
are not allowed to the shadow stack.
2.3.14.2 Indirect Branch Tracking
The ENDBR32 and ENDBR64 (collectively ENDBRANCH) are two new instructions that
are used to mark valid indirect CALL/JMP target locations in the program. This
instruction is a NOP on legacy processors for backward compatibility.
The processor implements a state machine that tracks indirect JMP and CALL
instructions. When one of these instructions is seen, the state machine moves from
IDLE to WAIT_FOR_ENDBRANCH state. In WAIT_FOR_ENDBRANCH state the next
instruction in the program stream must be an ENDBRANCH. If an ENDBRANCH is not
seen the processor causes a control protection fault (#CP), otherwise the state
machine moves back to IDLE state.
More information on Intel
®
CET can be found at:
https://software.intel.com/sites/default/files/managed/4d/2a/control-flow-
enforcement-technology-preview.pdf
2.3.15 KeyLocker Technology
A method to make long-term keys short-lived without exposing them. This protects
against vulnerabilities when keys can be exploited and used to attack encrypted data
such as disk drives.
An instruction (LOADIWKEY) allows the OS to load a random wrapping value (IWKey).
The IWKey can be backed up and restored by the OS to/from the PCH in a secure
manner.
The Software can wrap it own key via the ENCODEKEY instruction and receive a handle.
The handle is used with the AES*KL instructions to handle encrypt and decrypt
operations. Once a handle is obtained, the software can delete the original key from
memory.
2.3.16 Devil’s Gate Rock (DGR)
DGR is a BIOS hardening technology that splits SMI (System Management Interrupts)
handlers into Ring 3 and Ring 0 portions.
Supervisor/user paging on the smaller Ring 0 portion will enforce access policy for all
the ring 3 code with regard to the SMM state save, MSR registers, IO ports and other
registers.
The Ring 0 portion can perform save/restore of register context to allow the Ring 3
section to make use of those registers without having access to the OS context or the
ability to modify the OS context.
The Ring 0 portion is signed and provided by Intel. This portion is attested by the
processor.
Datasheet, Volume 1 of 2 39
2.4 Power and Performance Technologies
2.4.1 Intel
®
Smart Cache Technology
The Intel
®
Smart Cache Technology is a shared Last Level Cache (LLC).
• The LLC is non-inclusive.
• The LLC may also be referred to as a 3
rd
level cache.
• The LLC is shared between all IA cores as well as the Processor Graphics.
• The 1
st
and 2
nd
level caches are not shared between physical cores and each
physical core has a separate set of caches.
• The size of the LLC is SKU specific with a maximum of 3 MB per physical core and is
a 12-way associative cache.
2.4.2 IA Core Level 1 and Level 2 Caches
The 1
st
level cache is divided into a data cache (DFU) and an instruction cache (IFU).
The processor 1
st
level cache size is 48 KB for data and 32 KB for instructions. The 1
st
level cache is an 8-way associative cache.
The 2
nd
level cache holds both data and instructions. It is also referred to as mid-level
cache or MLC.
The processor 2
nd
level cache size is 1.25 MB and is a 20-way non-inclusive associative
cache.
Figure 2-4. Processor Cache Hierarchy
CORE
MLC
Non-inclusive
DCU IFU
CORE
MLC
Non-inclusive
DCU IFU
CORE
MLC
Non-inclusive
DCU IFU
CORE
MLC
Non-inclusive
DCU IFU
LLC - Last Level Cache
Non-inclusive, shared cache
Local Memory
Other
Devices
L1
L2
L3
System
Agent
PCIe
40 Datasheet, Volume 1 of 2
2.4.3 Intel
®
Turbo Boost Max Technology 3.0
The Intel
®
Turbo Boost Max Technology 3.0 (ITBMT 3.0) grants a different maximum
Turbo frequency for individual processor cores.
To enable ITBMT 3.0 the processor exposes individual core capabilities; including
diverse maximum turbo frequencies.
An operating system that allows for varied per core frequency capability can then
maximize power savings and performance usage by assigning tasks to the faster cores,
especially on low core count workloads.
Processors enabled with these capabilities can also allow software (most commonly a
driver) to override the maximum per-core Turbo frequency limit and notify the
operating system via an interrupt mechanism.
For more information on the Intel
®
Turbo Boost Max 3.0 Technology, refer to http://
www.intel.com/content/www/us/en/architecture-and-technology/turbo-boost/turbo-
boost-max-technology.html
Intel
®
Turbo Boost Max 3.0 Technology is only supported by H/H35 processor lines.
2.4.4 Power Aware Interrupt Routing (PAIR)
The processor includes enhanced power-performance technology that routes interrupts
to threads or processor IA cores based on their sleep states. As an example, for energy
savings, it routes the interrupt to the active processor IA cores without waking the
deep idle processor IA cores. For performance, it routes the interrupt to the idle (C1)
processor IA cores without interrupting the already heavily loaded processor IA cores.
This enhancement is most beneficial for high-interrupt scenarios like Gigabit LAN,
WLAN peripherals, and so on.
2.4.5 Intel
®
Hyper-Threading Technology (Intel
®
HT
Technology)
The processor supports Intel
®
Hyper-Threading Technology (Intel
®
HT Technology)
that allows an execution processor IA core to function as two logical processors. While
some execution resources such as caches, execution units, and buses are shared, each
logical processor has its own architectural state with its own set of general-purpose
registers and control registers. This feature should be enabled using the BIOS and
requires operating system support.
Intel recommends enabling Intel
®
Hyper-Threading Technology with Microsoft*
Windows* 7 or newer and disabling Intel
®
Hyper-Threading Technology using the BIOS
for all previous versions of Windows* operating systems.
Note: Intel
®
HT Technology may not be available on all SKUs.
Notes:
1. L1 Data cache (DCU) - 48 KB (per core)
2. L1 Instruction cache (IFU) - 32 KB (per core)
3. MLC - Mid Level Cache - 1.25 MB (per core)
Figure 2-4. Processor Cache Hierarchy
Datasheet, Volume 1 of 2 41
2.4.6 Intel
®
Turbo Boost Technology 2.0
The Intel
®
Turbo Boost Technology 2.0 allows the processor IA core/processor graphics
core to opportunistically and automatically run faster than the processor IA core base
frequency/processor graphics base frequency if it is operating below power,
temperature, and current limits. The Intel
®
Turbo Boost Technology 2.0 feature is
designed to increase the performance of both multi-threaded and single-threaded
workloads.
Compared with previous generation products, Intel
®
Turbo Boost Technology 2.0 will
increase the ratio of application power towards TDP and also allows to increase power
above TDP as high as PL2 for short periods of time. Thus, thermal solutions and
platform cooling that are designed to less than thermal design guidance might
experience thermal and performance issues since more applications will tend to run at
the maximum power limit for significant periods of time.
Note: Intel
®
Turbo Boost Technology 2.0 may not be available on all SKUs.
2.4.6.1 Intel
®
Turbo Boost Technology 2.0 Power Monitoring
When operating in turbo mode, the processor monitors its own power and adjusts the
processor and graphics frequencies to maintain the average power within limits over a
thermally significant time period. The processor estimates the package power for all
components on the package. In the event that a workload causes the temperature to
exceed program temperature limits, the processor will protect itself using the Adaptive
Thermal Monitor.
2.4.6.2 Intel
®
Turbo Boost Technology 2.0 Power Control
Illustration of Intel
®
Turbo Boost Technology 2.0 power control is shown in the
following sections and figures. Multiple controls operate simultaneously allowing
customization for multiple systems thermal and power limitations. These controls allow
for turbo optimizations within system constraints and are accessible using MSR, MMIO,
and PECI interfaces.
2.4.6.3 Intel
®
Turbo Boost Technology 2.0 Frequency
To determine the highest performance frequency amongst active processor IA cores,
the processor takes the following into consideration:
• The number of processor IA cores operating in the C0 state.
• The estimated processor IA core current consumption and I
CCMax
settings.
• The estimated package prior and present power consumption and turbo power
limits.
• The package temperature.
Any of these factors can affect the maximum frequency for a given workload. If the
power, current, or thermal limit is reached, the processor will automatically reduce the
frequency to stay within its TDP limit. Turbo processor frequencies are only active if the
operating system is requesting the P0 state. For more information on P-states and C-
states, refer Power Management.
42 Datasheet, Volume 1 of 2
2.4.7 Enhanced Intel SpeedStep
®
Technology
Enhanced Intel SpeedStep
®
Technology enables OS to control and select P-state. The
following are the key features of Enhanced Intel SpeedStep
®
Technology:
• Multiple frequencies and voltage points for optimal performance and power
efficiency. These operating points are known as P-states.
• Frequency selection is software controlled by writing to processor MSRs. The
voltage is optimized based on the selected frequency and the number of active
processors IA cores.
— Once the voltage is established, the PLL locks on to the target frequency.
— All active processor IA cores share the same frequency and voltage. In a multi-
core processor, the highest frequency P-state requested among all active IA
cores is selected.
— Software-requested transitions are accepted at any time. If a previous
transition is in progress, the new transition is deferred until the previous
transition is completed.
• The processor controls voltage ramp rates internally to ensure glitch-free
transitions.
Note: Because there is low transition latency between P-states, a significant number of
transitions per-second are possible.
2.4.8 Intel
®
Speed Shift Technology
Intel
®
Speed Shift Technology is an energy efficient method of frequency control by the
hardware rather than relying on OS control. OS is aware of available hardware P-states
and requests the desired P-state or it can let the hardware determine the P-state. The
OS request is based on its workload requirements and awareness of processor
capabilities. Processor decision is based on the different system constraints for example
Workload demand, thermal limits while taking into consideration the minimum and
maximum levels and activity window of performance requested by the Operating
System.
2.4.9 Intel
®
Advanced Vector Extensions 2 (Intel
®
AVX2)
Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2) is the latest expansion of the
Intel instruction set. Intel
®
AVX2 extends the Intel
®
Advanced Vector Extensions
(Intel
®
AVX) with 256 bit integer instructions, floating-point fused multiply-add (FMA)
instructions, and gather operations. The 256 bit integer vectors benefit math, codec,
image, and digital signal processing software. FMA improves performance in face
detection, professional imaging, and high-performance computing. Gather operations
increase vectorization opportunities for many applications. In addition to the vector
extensions, this generation of Intel processors adds new bit manipulation instructions
useful in compression, encryption, and general purpose software.
For more information on Intel
®
AVX, refer http://www.intel.com/software/avx
Intel
®
Advanced Vector Extensions (Intel
®
AVX) are designed to achieve higher
throughput to certain integer and floating point operation. Due to varying processor
power characteristics, utilizing AVX instructions may cause a) parts to operate below
the base frequency b) some parts with Intel
®
Turbo Boost Technology 2.0 to not
Datasheet, Volume 1 of 2 43
achieve any or maximum turbo frequencies. Performance varies depending on
hardware, software and system configuration and you should consult your system
manufacturer for more information.
Intel
®
Advanced Vector Extensions refers to Intel
®
AVX, Intel
®
AVX2 or Intel
®
AVX-
512.
For more information on Intel
®
AVX, refer https://software.intel.com/en-us/isa-
extensions/intel-avx.
Note: Intel
®
AVX and AVX2 Technologies may not be available on all SKUs.
2.4.10 Advanced Vector Extensions 512 Bit (Intel
®
AVX-512)
Intel
®
AVX support is widened to 512 bit SIMD operations. Programs can pack eight
double precision and sixteen single precision floating numbers within the 512 bit
vectors, as well as eight 64 bit and sixteen 32 bit integers. This enables processing of
twice the number of data elements that Intel
®
AVX/AVX2 can process with a single
instruction and four times the capabilities of Intel
®
SSE.
Intel
®
AVX-512 instructions are important because they open up higher performance
capabilities for the most demanding computational tasks. Intel
®
AVX-512 instructions
offer the highest degree of compiler support by including an unprecedented level of
richness in the design of the instruction capabilities.
Intel
®
AVX-512 features include 32 vector registers each 512 bit wide and eight
dedicated mask registers. Intel
®
AVX-512 is a flexible instruction set that includes
support for broadcast, embedded masking to enable prediction, embedded floating
point rounding control, embedded floating-point fault suppression, scatter instructions,
high-speed math instructions, and compact representation of large displacement
values.
Intel
®
AVX-512 offers a level of compatibility with Intel
®
AVX which is stronger than
prior transitions to new widths for SIMD operations. Unlike Intel
®
SSE and Intel
®
AVX
which cannot be mixed without performance penalties, the mixing of Intel
®
AVX and
Intel
®
AVX-512 instructions is supported without penalty. Intel
®
AVX registers YMM0-
YMM15 map into Intel
®
AVX-512 registers ZMM0-ZMM15 (in x86-64 mode), very much
like Intel
®
SSE registers map into Intel
®
AVX registers. Therefore, in processors with
Intel
®
AVX-512 support, Intel
®
AVX and Intel
®
AVX2 instructions operate on the lower
128 or 256 bits of the first 16 ZMM registers.
For more information, refer:
http://www.intel.com/products/processor/manuals
Intel
®
AVX-512 has multiple extensions that CPUID has been enhanced to expose.
• AVX512F (Foundation): expands most 32 bit and 64 bit based AVX instructions
with EVEX coding scheme to support 512 bit registers, operation masks, parameter
broadcasting, and embedded rounding and exception control
• AVX512CD (Conflict Detection): efficient conflict detection to allow more loops
to be vectorized
• AVX512BW (Byte and Word): extends AVX-512 to cover 8 bit and 16 bit integer
operations
44 Datasheet, Volume 1 of 2
• AVX512DQ (Doubleword and Quadword): extends AVX-512 to cover 32 bit and
64 bit integer operations
• AVX512VL (Vector Length): extends most AVX-512 operations to also operate
on XMM (128 bit) and YMM (256 bit) registers
• AVX512IFMA (Integer Fused Multiply-Add): fused multiply-add of integers
using 52 bit precision
• AVX512VBMI (Vector Byte Manipulation Instructions): adds vector byte
permutation instructions which were not present in AVX-512BW
• AVX512VBMI2 (Vector Byte Manipulation Instructions 2): adds byte/word
load, store and concatenation with shift
• VPOPCNTDQ: count of bits set to 1
• VPCLMULQDQ: carry-less multiplication of quadwords
• AVX-512VNNI (Vector Neural Network Instructions): vector instructions for
deep learning
• AVX512GFNI (Galois Field New Instructions): vector instructions for
calculating Galois Fields
• AVX512VAES (Vector AES instructions): vector instructions for AES coding
• AVX512BITALG (Bit Algorithms): byte/word bit manipulation instructions
expanding VPOPCNTDQ
• AVX512VP2INTERSECT: Compute Intersection Between DWORDS/QUADWORDS
to a Pair of Mask Registers
Note: Intel
®
AVX-512 may not be available on all SKUs.
2.4.11 Intel
®
64 Architecture x2APIC
The x2APIC architecture extends the xAPIC architecture that provides key mechanisms
for interrupt delivery. This extension is primarily intended to increase processor
addressability.
Specifically, x2APIC:
• Retains all key elements of compatibility to the xAPIC architecture:
— Delivery modes
— Interrupt and processor priorities
— Interrupt sources
— Interrupt destination types
• Provides extensions to scale processor addressability for both the logical and
physical destination modes
• Adds new features to enhance the performance of interrupt delivery
• Reduces the complexity of logical destination mode interrupt delivery on link based
architectures
The key enhancements provided by the x2APIC architecture over xAPIC are the
following:
• Support for two modes of operation to provide backward compatibility and
extensibility for future platform innovations:
Datasheet, Volume 1 of 2 45
— In xAPIC compatibility mode, APIC registers are accessed through memory
mapped interface to a 4 KByte page, identical to the xAPIC architecture.
— In the x2APIC mode, APIC registers are accessed through the Model Specific
Register (MSR) interfaces. In this mode, the x2APIC architecture provides
significantly increased processor addressability and some enhancements on
interrupt delivery.
• Increased range of processor addressability in x2APIC mode:
— Physical xAPIC ID field increases from 8 bits to 32 bits, allowing for interrupt
processor addressability up to 4G-1 processors in physical destination mode. A
processor implementation of x2APIC architecture can support fewer than 32
bits in a software transparent fashion.
— Logical xAPIC ID field increases from 8 bits to 32 bits. The 32 bit logical x2APIC
ID is partitioned into two sub-fields – a 16 bit cluster ID and a 16 bit logical ID
within the cluster. Consequently, ((2^20) - 16) processors can be addressed in
logical destination mode. Processor implementations can support fewer than
16 bits in the cluster ID sub-field and logical ID sub-field in a software agnostic
fashion.
• More efficient MSR interface to access APIC registers:
— To enhance inter-processor and self-directed interrupt delivery as well as the
ability to virtualize the local APIC, the APIC register set can be accessed only
through MSR-based interfaces in x2APIC mode. The Memory Mapped IO
(MMIO) interface used by xAPIC is not supported in x2APIC mode.
• The semantics for accessing APIC registers have been revised to simplify the
programming of frequently-used APIC registers by system software. Specifically,
the software semantics for using the Interrupt Command Register (ICR) and End Of
Interrupt (EOI) registers have been modified to allow for more efficient delivery
and dispatching of interrupts.
• The x2APIC extensions are made available to system software by enabling the local
x2APIC unit in the “x2APIC” mode. To benefit from x2APIC capabilities, a new
operating system and a new BIOS are both needed, with special support for the
x2APIC mode.
• The x2APIC architecture provides backward compatibility to the xAPIC architecture
and forwards extensible for future Intel platform innovations.
Note: Intel
®
x2APIC Technology may not be available on all SKUs.
For more information, refer:
http://www.intel.com/products/processor/manuals/.
2.4.12 Intel
®
Dynamic Tuning Technology (DTT)
Intel Dynamic Tuning consists of a set of software drivers and applications that allow a
system manufacturer to optimize system performance and usability by:
• Dynamically optimize turbo settings of IA processors, power and thermal states of
the platform for optimal performance
• Dynamically adjust the processor’s peak power based on the current power delivery
capability for optimal system usability
• Dynamically mitigate radio frequency interference for better RF throughput.
• Refer https://www.intel.com/content/www/us/en/architecture-and-technology/
adaptix.html
46 Datasheet, Volume 1 of 2
2.4.13 Intel
®
GNA 2.0 (GMM and Neural Network Accelerator)
GNA stands for Gaussian Mixture Model and Neural Network Accelerator.
The GNA is used to process speech recognition without user training sequence. The
GNA is designed to unload the processor cores and the system memory with complex
speech recognition tasks and improve the speech recognition accuracy. The GNA is
designed to compute millions of Gaussian probability density functions per second
without loading the processor cores while maintaining low power consumption.
2.4.14 Cache Line Write Back (CLWB)
Writes back to memory the cache line (if dirty) that contains the linear address
specified with the memory operand from any level of the cache hierarchy in the cache
coherence domain. The line may be retained in the cache hierarchy in the non-modified
state. Retaining the line in the cache hierarchy is a performance optimization (treated
as a hint by hardware) to reduce the possibility of a cache miss on a subsequent
access. Hardware may choose to retain the line at any of the levels in the cache
hierarchy, and in some cases, may invalidate the line from the cache hierarchy. The
source operand is a byte memory location.
For more information, refer:
http://www.intel.com/products/processor/manuals
2.4.15 Ring Interconnect
The Ring is a high speed, wide interconnect that links the processor cores, processor
graphics and the System Agent.
The Ring shares frequency and voltage with the Last Level Cache (LLC).
CPU
Core0
CPU
Core2
SRAM GNA
DSP
Memory Bus
DRAM
Memory Bus
CPU
Core3
CPU
Core1
Datasheet, Volume 1 of 2 47
The Ring's frequency dynamically changes. Its frequency is relative to both processor
cores and processor graphics frequencies.
2.5 Intel
®
Image Processing Unit (Intel
®
IPU6)
2.5.1 Platform Imaging Infrastructure
The platform imaging infrastructure is based on the following hardware components:
• Camera Subsystem: Located in the lid of the system and contains CMOS sensor,
flash, LED, I/O interface (MIPI* CSI-2 and I
2
C*), focus control and other
components.
• Camera I/O Controller: The I/O controller is located in the processor and
contains a MIPI-CSI2 host controller. The host controller is a PCI device
(independent of the IPU device). The CSI-2 HCI brings imaging data from an
external image into the system and provides a command and control channel for
the image using I
2
C.
• Intel
®
IPU (Image Processing Unit): The IPU processes raw images captured
by Bayer sensors. The result images are used by still photography and video
capture applications (JPEG, H.264, and so on.).
2.5.2 Intel
®
Image Processing Unit (Intel
®
IPU6)
IPU6 is Intel's 6th generation solution for an Imaging Processing Unit, providing
advanced imaging functionality for Intel
®
Core™ branded processors, as well as more
specialized functionality for High Performance Mobile Phones, Automotive, Digital
Surveillance Systems (DSS), and other market segments.
IPU6 is a continuing evolution of the architecture introduced in IPU4 and enhanced in
IPU5. Additional image quality improvements are introduced, as well as hardware
accelerated support for temporal de-noising and new sensor technologies such as
Spatially Variant Exposure HDR and Dual Photo Diode, among others.
Figure 2-5. Processor Camera System
48 Datasheet, Volume 1 of 2
IPU6 provides a complete high quality hardware accelerated pipeline, and is therefore
not dependent on algorithms running on the vector processors to provide the highest
quality output.
UP4/UP3 processot has the most advance IPU6, H has a lighter version of the IPU.
2.6 Debug Technologies
2.6.1 Intel
®
Processor Trace
Intel
®
Processor Trace (Intel
®
PT) is a tracing capability added to Intel
®
Architecture,
for use in software debug and profiling. Intel
®
PT provides the capability for more
precise software control flow and timing information, with limited impact on software
execution. This provides an enhanced ability to debug software crashes, hangs, or
other anomalies, as well as responsiveness and short-duration performance issues.
Intel
®
VTune™ Amplifier for Systems and the Intel
®
System Debugger are part of
Intel
®
System Studio (2015 and newer) product, which includes updates for the new
debug and trace features, including Intel
®
PT and Intel
®
Trace Hub.
Intel
®
System Studio is available for download at https://software.intel.com/en-us/
system-studio.
An update to the Linux* performance utility, with support for Intel
®
PT, is available for
download at https://github.com/virtuoso/linux-perf/tree/intel_pt. It requires rebuilding
the kernel* and the perf utility.
2.6.2 Platform CrashLog
The CrashLog feature is intended for use by system builders (OEMs) as a means to
triage and perform first level debug of failures.
Additionally, CrashLog enables the BIOS or the OS to collect data on failures with the
intent to collect and classify the data as well as analyze failure trends.
CrashLog is a mechanism to collect debug information into a single location and then
allow access to that data via multiple methods, including the BIOS and OS of the failing
system.
CrashLog is initiated by a Crash Data Detector on observation of error conditions (TCO
watchdog timeout, machine check exceptions, and so on).
Crash Data Detector notifies the Crash Data Requester of the error condition in order
for the Crash Data Requester to collect Crash Data from several different IPs and/or
Crash Nodes and stores the data to the Crash Data Storage (on-die SRAM) prior to the
reset.
After the system has rebooted, the Crash Data Collector reads the Crash Data from the
Crash Data Storage and makes the data available to either to software and/or back to a
central server to track error frequency and trends.
2.6.3 Telemetry Aggregator
The Telemetry Aggregator serves as an architectural and discoverable interface to
hardware telemetry:
Datasheet, Volume 1 of 2 49
• Standardized PCIe discovery solution that enables software to discover and
manage telemetry across products
• Standardized definitions for telemetry decode, including data type definitions
• Exposure of commonly used telemetry for power and performance debug including:
— P-State status, residency and counters
— C-State status, residency and counters
— Energy monitoring
— Device state monitoring (for example, PCIe L1)
— Interconnect/bus bandwidth counters
— Thermal monitoring
Exposure of SoC state snapshot for atomic monitoring of package power states,
uninterrupted by software that reads.
The Telemetry Aggregator is also a companion to the CrashLog feature where data is
captured about the SoC at the point of a crash. These counters can provide insights
into the nature of the crash.
Figure 2-6. Telemetry Aggregator
50 Datasheet, Volume 1 of 2
2.7 Clock Topology
The processor has 3 reference clocks that drive the various components within the
SoC:
• Processor reference clock or base clock (BCLK). 100 MHz with SSC.
• PCIe reference clock (PCTGLK). 100 MHz with SSC.
• Fixed clock. 38.4 MHz without SSC (crystal clock).
BCLK drives the following clock domains:
• Core
• Ring
• Graphics (GT)
• Memory Controller (MC)
• System Agent (SA)
PCTGLK drives the following clock domains:
• PCIe Controller(s)
• DMI/OPIO
Fixed clock drives the following clock domains:
• Display
• SVID controller
• Time Stamp Counters (TSC)
• Type C subsystem
2.7.1 Integrated Reference Clock PLL
The processor includes a phase lock loop (PLL) that generates the reference clock for
the processor from a fixed crystal clock. The processor reference clock is also referred
to as Base Clock or BCLK.
By integrating the BCLK PLL into the processor die, a cleaner clock is achieved at a
lower power compared to the legacy PCH BCLK PLL solution.
The BCLK PLL has controls for RFI/EMI mitigations as well as Over-clocking capabilities.
2.8 Intel Volume Management Device (VMD)
Technology
2.8.1 Intel Volume Management Device Technology Objective
Standard Operating Systems generally recognize individual PCIe Devices and load
individual drivers. This is undesirable in some cases such as, for example, when there
are several PCIe-based hard-drives connected to a platform where the user wishes to
configure them as part of a RAID array. The Operating System current treats individual
hard-drives as separate volumes and not part of a single volume.
Datasheet, Volume 1 of 2 51
In other words, the Operating System requires multiple PCIe devices to have multiple
driver instances, making volume management across multiple host bus adapters
(HBAs) and driver instances difficult.
Intel Volume Management Device (VMD) technology provides a means to provide
volume management across separate PCI Express HBAs and SSDs without requiring
operating system support or communication between drivers. For example, the OS will
see a single RAID volume instead of multiple storage volumes, when Volume
Management Device is used.
2.8.2 Intel Volume Management Device Technology
Intel Volume Management Device technology does this by obscuring each storage
controller from the OS, while allowing a single driver to be loaded that would control
each storage controller.
Intel Volume Management technology requires support in BIOS and driver, memory and
configuration space management.
A Volume Management Device (VMD) exposes a single device to the operating system,
which will load a single storage driver. The VMD resides in the processor's PCIe root
complex and it appears to the OS as a root bus integrated endpoint. In the processor,
the VMD is in a central location to manipulate access to storage devices which may be
attached directly to the processor or indirectly through the PCH. Instead of allowing
individual storage devices to be detected by the OS and therefore causing the OS to
load a separate driver instance for each, VMD provides configuration settings to allow
specific devices and root ports on the root bus to be invisible to the OS.
Access to these hidden target devices is provided by the VMD to the single, unified
driver.
52 Datasheet, Volume 1 of 2
2.8.3 Key Features
Supports MMIO mapped Configuration Space (CFGBAR):
• Supports MMIO Low
• Supports MMIO High
• Supports Register Lock or Restricted Access
• Supports Device Assign
• Function Assign
• MSI Remapping Disable
2.9 Deprecated Technologies
The processor has deprecated the following technologies and they are not longer
supported:
• Intel
®
Memory Protection Extensions (Intel
®
MPX)
• Branch Monitoring Counters
• Intel
®
Transactional Synchronization Extensions (Intel
®
TSX-NI)
§ §
Datasheet, Volume 1 of 2 53
3 Power Management
This chapter provides information on the following Power Management topics:
• Advanced Configuration and Power Interface (ACPI) States
• Processor IA Core Power Management
• Integrated Memory Controller (IMC) Power Management
• PCI Express* Power Management
• Direct Media Interface (DMI) Power Management
• Processor Graphics Power Management
54 Datasheet, Volume 1 of 2
Figure 3-1. UP3 and UP4 Processor Lines Power States
Datasheet, Volume 1 of 2 55
Figure 3-2. H Processor Line Power States
56 Datasheet, Volume 1 of 2
Notes:
1. PkgC2/C3 are Non-architectural: Software cannot request to enter these states
explicitly. These states are intermediate states between PkgC0 and PkgC6.
2. There are constraints that prevent the system to go deeper.
3. The “core state” relates to the core which is in the HIGEST power state in the
package (most active).
3.1 Advanced Configuration and Power Interface
(ACPI) States Supported
This section describes the ACPI states supported by the processor.
Figure 3-3. Processor Package and IA Core C-States
Table 3-1. System States (Sheet 1 of 2)
State Description
G0/S0/C0
Full On: CPU operating. Individual devices may be shut to save power. The different CPU
operating levels are defined by Cx states.
GO/S0/Cx Cx state: CPU manages C-states by itself and can be in low power state
Datasheet, Volume 1 of 2 57
3.2 Processor IA Core Power Management
While executing code, Enhanced Intel SpeedStep
®
Technology and Intel
®
Speed Shift
technology optimizes the processor’s IA core frequency and voltage based on workload.
Each frequency and voltage operating point is defined by ACPI as a P-state. When the
processor is not executing code, it is idle. A low-power idle state is defined by ACPI as a
C-state. In general, deeper power C-states have longer entry and exit latencies.
G1/S3
Suspend-To-RAM (STR): The system context is maintained in system DRAM, but power is
shut to non-critical circuits. Memory is retained, and refreshes continue. All external clocks
are shut off; RTC clock and internal ring oscillator clocks are still toggling.
In S3 (H only), SLP_S3 signal stays asserted, SLP_S4 and SLP_S5 are inactive until a wake
occurs.
G1/S4
Suspend-To-Disk (STD): The context of the system is maintained on the disk. All power is
then shut to the system except to the logic required to resume. Externally appears same as
S5 but may have different wake events.
In S4, SLP_S3 and SLP_S4 both stay asserted and SLP_S5 is inactive until a wake occurs.
G2/S5
Soft Off: System context not maintained. All power is shut except for the logic required to
restart. A full boot is required when waking.
Here, SLP_S3, SLP_S4, and SLP_S5 are all active until a wake occurs.
G3
Mechanical OFF: System context not maintained. All power shut except for the RTC. No
“Wake” events are possible because the system does not have any power. This state occurs
if the user removes the batteries, turns off a mechanical switch, or if the system power
supply is at a level that is insufficient to power the “waking” logic. When system power
returns the transition will depend on the state just prior to the entry to G3.
Table 3-2. Integrated Memory Controller (IMC) States
State Description
Power-Up CKE asserted. Active mode.
Pre-Charge Power Down CKE de-asserted (not self-refresh) with all banks closed.
Active Power Down CKE de-asserted (not self-refresh) with minimum one bank active.
Self-Refresh CKE de-asserted using device self-refresh.
Table 3-3. G, S, and C Interface State Combinations
Global (G)
State
Sleep (S)
State
Processor
Package (C)
State
Processor
State
System Clocks Description
G0 S0 C0 Full On On Full On
G0 S0 C2 Deep Sleep On Deep Sleep
G0 S0 C3 Deep Sleep On Deep Sleep
G0 S0 C6/C7
Deep Power
Down
On Deep Power Down
G0 S0 C8/C9/C10 Off On Deeper Power Down
G1 S3 Power off Off Off, except RTC
Suspend to RAM.
S3 valid for H only.
G1 S4 Power off Off Off, except RTC Suspend to Disk
G2 S5 Power off Off Off, except RTC Soft Off
G3 N/A Power off Off Power off Hard off
Table 3-1. System States (Sheet 2 of 2)
State Description
58 Datasheet, Volume 1 of 2
3.2.1 OS/HW Controlled P-states
3.2.1.1 Enhanced Intel
SpeedStep
®
Technology
Enhanced Intel SpeedStep
®
Technology enables OS to control and select P-state. For
more information, refer Section 2.4.7, “Enhanced Intel SpeedStep
® Technology”
.
3.2.1.2 Intel
®
Speed Shift Technology
Intel
®
Speed Shift Technology is an energy efficient method of frequency control by the
hardware rather than relying on OS control. For more details, refer Section 2.4.8,
“Intel
® Speed Shift Technology”
.
3.2.2 Low-Power Idle States
When the processor is idle, low-power idle states (C-states) are used to save power.
More power savings actions are taken for numerically higher C-states. However, deeper
C-states have longer exit and entry latencies. Resolution of C-states occurs at the
thread, processor IA core, and processor package level. Thread-level C-states are
available if Intel Hyper-Threading Technology is enabled.
Caution: Long-term reliability cannot be assured unless all the Low-Power Idle States are
enabled.
While individual threads can request low-power C-states, power saving actions only
take place once the processor IA core C-state is resolved. processor IA core C-states
are automatically resolved by the processor. For thread and processor IA core C-states,
a transition to and from C0 state is required before entering any other C-state.
Figure 3-4. Idle Power Management Breakdown of the Processor IA Cores
Thread 0 Thread 1
Core 0 State
Thread 0 Thread 1
Core N State
Processor Package State
Datasheet, Volume 1 of 2 59
3.2.3 Requesting the Low-Power Idle States
The primary software interfaces for requesting low-power idle states are through the
MWAIT instruction with sub-state hints and the HLT instruction (for C1 and C1E).
However, the software may make C-state requests using the legacy method of I/O
reads from the ACPI-defined processor clock control registers, referred to as P_LVLx.
This method of requesting C-states provides legacy support for operating systems that
initiate C-state transitions using I/O reads.
For legacy operating systems, P_LVLx I/O reads are converted within the processor to
the equivalent MWAIT C-state request. Therefore, P_LVLx reads do not directly result in
I/O reads to the system. The feature, known as I/O MWAIT redirection, should be
enabled in the BIOS.
The BIOS can write to the C-state range field of the PMG_IO_CAPTURE MSR to restrict
the range of I/O addresses that are trapped and emulate MWAIT like functionality. Any
P_LVLx reads outside of this range do not cause an I/O redirection to MWAIT(Cx) like
the request. They fall through like a normal I/O instruction.
When P_LVLx I/O instructions are used, MWAIT sub-states cannot be defined. The
MWAIT sub-state is always zero if I/O MWAIT redirection is used. By default, P_LVLx I/
O redirections enable the MWAIT 'break on EFLAGS.IF’ feature that triggers a wake up
on an interrupt, even if interrupts are masked by EFLAGS.IF.
3.2.4 Processor IA Core C-State Rules
The following are general rules for all processor IA core C-states unless specified
otherwise:
• A processor IA core C-State is determined by the lowest numerical thread state
(such as Thread 0 requests C1E while Thread 1 requests C6 state, resulting in a
processor IA core C1E state). Refer to the G, S, and C Interface State Combinations
table.
• A processor IA core transitions to C0 state when:
— An interrupt occurs
— There is an access to the monitored address if the state was entered using an
MWAIT/Timed MWAIT instruction
— The deadline corresponding to the Timed MWAIT instruction expires
• An interrupt directed toward a single thread wakes up only that thread.
• If any thread in a processor IA core is active (in C0 state), the core’s C-state will
resolve to C0.
• Any interrupt coming into the processor package may wake any processor IA core.
• A system reset re-initializes all processor IA cores.
Table 3-4. Core C-states (Sheet 1 of 2)
Core C-
State
C-State Request
Instruction
Description
C0 N/A
The normal operating state of a processor IA core where a code is being
executed
C1 MWAIT(C1)
AutoHALT - core execution stopped, autonomous clock gating (package in
C0 state)
60 Datasheet, Volume 1 of 2
Core C-State Auto-Demotion
In general, deeper C-states, such as C6 or C7, have long latencies and have higher
energy entry/exit costs. The resulting performance and energy penalties become
significant when the entry/exit frequency of a deeper C-state is high. Therefore,
incorrect or inefficient usage of deeper C-states have a negative impact on battery life
and idle power. To increase residency and improve battery life and idle power in deeper
C-states, the processor supports C-state auto-demotion.
C-State auto-demotion:
• C7/C6 to C1/C1E
The decision to demote a processor IA core from C6/C7 to C1/C1E is based on each
processor IA core’s immediate residency history. Upon each processor IA core C6/C7
request, the processor IA core C-state is demoted to C1 until a sufficient amount of
residency has been established. At that point, a processor IA core is allowed to go into
C6 or C7. If the interrupt rate experienced on a processor IA core is high and the
processor IA core is rarely in a deep C-state between such interrupts, the processor IA
core can be demoted to a C1 state.
This feature is disabled by default. BIOS should enable it in the
PMG_CST_CONFIG_CONTROL register. The auto-demotion policy is also configured by
this register.
3.2.5 Package C-States
The processor supports C0, C2, C3, C6, C7, C8, C9, and C10 package states. The
following is a summary of the general rules for package C-state entry. These apply to
all package C-states, unless specified otherwise:
• A package C-state request is determined by the lowest numerical processor IA core
C-state amongst all processor IA cores.
• A package C-state is automatically resolved by the processor depending on the
processor IA core idle power states and the status of the platform components.
— Each processor IA core can be at a lower idle power state than the package if
the platform does not grant the processor permission to enter a requested
package C-state.
— The platform may allow additional power savings to be realized in the
processor.
— For package C-states, the processor is not required to enter C0 before entering
any other C-state.
— Entry into a package C-state may be subject to auto-demotion – that is, the
processor may keep the package in a deeper package C-state then requested
by the operating system if the processor determines, using heuristics, that the
deeper C-state results in better power/performance.
C1E MWAIT(C1E)
Core C1 + lowest frequency and voltage operating point (package in C0
state)
C6-C10
MWAIT(C6/7/7s/
C8/9/10) or IO
read=P_LVL3/4/5/
6/7/8
Processor IA, flush their L1 instruction cache, the L1 data cache, and L2
cache to the LLC shared cache cores save their architectural state to an
SRAM before reducing IA cores voltage, if possible may also be reduced to
0V. Core clocks are off.
C7s is C7 with an additional PLL off.
Table 3-4. Core C-states (Sheet 2 of 2)
Datasheet, Volume 1 of 2 61
The processor exits a package C-state when a break event is detected. Depending on
the type of break event, the processor does the following:
• If a processor IA core break event is received, the target processor IA core is
activated and the break event message is forwarded to the target processor IA
core.
— If the break event is not masked, the target processor IA core enters the
processor IA core C0 state and the processor enters package C0.
— If the break event is masked, the processor attempts to re-enter its previous
package state.
• If the break event was due to a memory access or snoop request,
— But the platform did not request to keep the processor in a higher package C-
state, the package returns to its previous C-state.
— And the platform requests a higher power C-state, the memory access or snoop
request is serviced and the package remains in the higher power C-state.
Figure 3-5. Package C-State Entry and Exit
Table 3-5. Package C-States (Sheet 1 of 2)
Package
C state
Description Dependencies
PKG C0
Processor active state.
At least one IA core in C0 or
Processor Graphic in RC0 (Graphics active state).
-
PKG C2
Cannot be requested explicitly by the Software.
All processor IA cores in C6 or deeper + Processor Graphic cores in RC6,
memory path may be open.
The processor will enter Package C2 when:
• Transitioning from Package C0 to deep Package C state or from deep
Package C state to Package C0.
• All IA cores requested C6 or deeper + Processor Graphic cores in RC6
but there are constraints (LTR, programmed timer events in the near
future and so forth) prevent entry to any state deeper than C2 state.
• All IA cores requested C6 or deeper + Processor Graphic cores in RC6
but a device memory access request is received. Upon completion of all
outstanding memory requests, the processor transitions back into a
deeper package C-state.
All processor IA cores in C6 or
deeper.
Processor Graphic cores in RC6.
62 Datasheet, Volume 1 of 2
PKG C3
All cores in C6 or deeper + Processor Graphics in RC6, LLC may be flushed
and turned off, memory in self refresh, memory clock stopped.
The processor will enter Package C3 when:
• All IA cores in C6 or deeper + Processor Graphic cores in RC6.
• The platform components/devices allows proper LTR for entering
Package C3.
All processor IA cores in C6 or
deeper.
Processor Graphics in RC6.
memory in self refresh, memory
clock stopped.
LLC may be flushed and turned
off.
PKG C6
Package C3 + BCLK is off + IMVP VRs voltage reduction/PSx state is possible.
The processor will enter Package C6 when:
• All IA cores in C6 or deeper + Processor Graphic cores in RC6.
• The platform components/devices allow proper LTR for entering Package
C6.
Package C3.
BCLK is off.
IMVP VRs voltage reduction/PSx
state is possible.
PKG C7
Package C6 + If all IA cores requested C7, LLC ways may be flushed until it is
cleared. If the entire LLC is flushed, voltage will be removed from the LLC.
The processor will enter Package C7 when:
• All IA cores in C7 or deeper + Processor Graphic cores in RC6.
• The platform components/devices allow proper LTR for entering Package
C7.
Package C6.
If all IA cores requested C7.
LLC ways may be flushed until it is
cleared.
If the entire LLC is flushed,
voltage will be removed from the
LLC.
PKG C7S
Package C6 + If all IA cores requested C7S, LLC is flushed in a single step,
voltage will be removed from the LLC.
The processor will enter Package C7 when:
• All IA cores in C7S or deeper + Processor Graphic cores in RC6.
• The platform components/devices allow proper LTR for entering Package
C7S.
Package C6
If all IA cores requested C7S, LLC
is flushed in a single step, voltage
will be removed from the LLC.
PKG C8
Package C7 + LLC should be flushed at once.
The processor will enter Package C8 when:
• All IA cores in C8 or deeper + Processor Graphic cores in RC6.
• The platform components/devices allow proper LTR for entering Package
C8.
Package C7 + LLC should be
flushed at once.
PKG C9
Package C8 + display in PSR or powered off + most Uncore voltages at 0V.
IA, GT and SA voltages are reduced to 0 V, while VCC
IO_OUT
stays on.
The processor will enter Package C9 when:
• All IA cores in C9 or deeper + Processor Graphic cores in RC6.
• The platform components/devices allow proper LTR for entering Package
C9.
Package C8.
All IA cores in C9 or deeper.
Display in PSR or powered off
1
.
VCC
IO_OUT
stays on.
PKG C10
Package C9 + all VRs at PS4 or LPM + crystal clock off.
The processor will enter Package C10 when:
• All IA cores in C10 + Processor Graphic cores in RC6.
• The platform components/devices allow proper LTR for entering Package
C10.
Package C9.
All VRs at PS4 or LPM.
Crystal clock off.
Notes:
• Display In PSR is only on single embedded panel configuration and panel support PSR feature.
• TCSS may enter lowest power state (TC Cold) when no device attached to any of the TCSS ports.
Table 3-5. Package C-States (Sheet 2 of 2)
Package
C state
Description Dependencies
Datasheet, Volume 1 of 2 63
Package C-State Auto-Demotion
The Processor may demote the Package C state to a shallower C state, for example
instead of going into package C10, it will demote to package C8 (and so on as
required). The processor decision to demote the package C state is based on the
required C states latencies, entry/exit energy/power and devices LTR.
Modern Standby
Modern Standby is a platform state. On display time out the OS requests the processor
to enter package C10 and platform devices at RTD3 (or disabled) in order to attain low
power in idle. Modern Standby requires proper BIOS (refer BIOS specification in
Section 1.10, “Related Documents”) and OS configuration.
Dynamic LLC Sizing
When all processor IA cores request C7 or deeper C-state, internal heuristics
dynamically flushes the LLC. Once the processor IA cores enter a deep C-state,
depending on their MWAIT sub-state request, the LLC is either gradually flushed N-
ways at a time or flushed all at once. Upon the processor IA cores exiting to C0 state,
the LLC is gradually expanded based on internal heuristics.
C6DRAM
The C6DRAM feature saves the processor internal state at Package C6 and deeper to
DRAM instead of on-die SRAM.
When the processor state has been saved to DRAM, the dedicated save/restore SRAM
modules are power gated, enabling idle power savings. The SRAM modules operate on
the sustained voltage rail (VccST).
The memory region used for C6DRAM resides in the Processor Reserved Memory region
(PRMRR) which is encrypted and replay protected. The processor issues a Machine
Check exception (#MC) if the processor state has been corrupted.
Note: The availability of C6DRAM may vary between processor lines offers.
3.2.6 Package C-States and Display Resolutions
The integrated graphics engine has the frame buffer located in system memory. When
the display is updated, the graphics engine fetches display data from system memory.
Different screen resolutions and refresh rates have different memory latency
requirements. These requirements may limit the deepest Package C-state the
processor can enter. Other elements that may affect the deepest Package C-state
available are the following:
• Display is on or off
• Single or multiple displays
• Native or non-native resolution
• Panel Self Refresh (PSR) technology
Note: Display resolution is not the only factor influencing the deepest Package C-state the
processor can get into. Device latencies, interrupt response latencies, and core C-states
are among other factors that influence the final package C-state the processor can
enter.
64 Datasheet, Volume 1 of 2
The following table lists display resolutions and deepest available package C-State.The
display resolutions are examples using common values for blanking and pixel rate.
Actual results will vary. The table shows the deepest possible Package C-state. System
workload, system idle, and AC or DC power also affect the deepest possible Package C-
state.
3.3 Processor Graphics Power Management
3.3.1 Memory Power Savings Technologies
3.3.1.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)
Intel
®
Rapid Memory Power Management (Intel
®
RMPM) conditionally places memory
into self-refresh when the processor is in package C3 or deeper power state to allow
the system to remain in the deeper power states longer for memory not reserved for
graphics memory. Intel
®
RMPM functionality depends on graphics/display state
(relevant only when processor graphics is being used), as well as memory traffic
patterns generated by other connected I/O devices.
Table 3-6. Deepest Package C-State Available
Resolution Number of Displays PSR Enabled
4
PSR Disabled
4
Up to 5120x3200 60 Hz
3
Single PC10 PC8
Notes:
1. All Deep states are with Display on.
2. The deepest C-state has variance, dependent various parameters such as SW and Platform Devices.
3. Relevant to all Processor lines.
Table 3-7. TCSS Power State
TCSS
Power
State
Allowed Package C
States
Device
Attached
Description
TC0 PC0-PC3 Yes
xHCI, xDCI, USB4 controllers may be active.
USB4 DMA / PCIE may be active.
TC7 PC6-PC10 Yes
xHCI and xDCI are in D3.
USB4 controller is in D3 or D0 idle.
USB4 PCIe is inactive.
TC-Cold PC3-PC10 No
xHCI/xDCI/TBT DMA/TBT PCIe are in D3.
IOM is active.
TC10 PC6-PC10 No
Deepest power state.
xHCI and xDCI are in D3. USB4 is in D3 or D0 idle.
USB4 PCIe is inactive.
IOM is inactive.
IOM - TCSS Input Output Manager:
• The IOM interacts with the SoC to perform power management, boot, reset, connect, and disconnect
devices to Type-C sub-system.
TCSS Devices (XHCI/XDCI/TBT Controller) - power state:
• D0 - Device at Active state.
• D3 - Device at lowest-powered state.
Datasheet, Volume 1 of 2 65
3.3.2 Display Power Savings Technologies
3.3.2.1 Intel
®
Seamless Display Refresh Rate Switching Technology (Intel
®
SDRRS Technology) with eDP* Port
Intel
®
DRRS provides a mechanism where the monitor is placed in a slower refresh rate
(the rate at which the display is updated). The system is smart enough to know that
the user is not displaying either 3D or media like a movie where specific refresh rates
are required. The technology is very useful in an environment such as a plane where
the user is in battery mode doing e-mail, or other standard office applications. It is also
useful where the user may be viewing web pages or social media sites while in battery
mode.
3.3.2.2 Intel
®
Automatic Display Brightness
Intel
®
Automatic Display Brightness feature dynamically adjusts the back-light
brightness based upon the current ambient light environment. This feature requires an
additional sensor to be on the panel front. The sensor receives the changing ambient
light conditions and sends the interrupts to the Intel Graphics driver. As per the change
in Lux, (current ambient light luminance), the new back-light setting can be adjusted
through BLC (Back Light Control). The converse applies for a brightly lit environment.
Intel
®
Automatic Display Brightness increases the back-light setting.
3.3.2.3 Smooth Brightness
The Smooth Brightness feature is the ability to make fine grained changes to the screen
brightness. All Windows* 10 system that support brightness control are required to
support Smooth Brightness control and it should be supporting 101 levels of brightness
control. Apart from the Graphics driver changes, there may be few System BIOS
changes required to make this feature functional.
3.3.2.4 Intel
®
Display Power Saving Technology (Intel
®
DPST) 6.3
The Intel
®
DPST technique achieves back-light power savings while maintaining a good
visual experience. This is accomplished by adaptively enhancing the displayed image
while decreasing the back-light brightness simultaneously. The goal of this technique is
to provide equivalent end-user-perceived image quality at a decreased back-light
power level.
1. The original (input) image produced by the operating system or application is
analyzed by the Intel
®
DPST subsystem. An interrupt to Intel
®
DPST software is
generated whenever a meaningful change in the image attributes is detected. (A
meaningful change is when the Intel
®
DPST software algorithm determines that
enough brightness, contrast, or color change has occurred to the displaying images
that the image enhancement and back-light control needs to be altered.)
2. Intel
®
DPST subsystem applies an image-specific enhancement to increase image
contrast, brightness, and other attributes.
3. A corresponding decrease to the back-light brightness is applied simultaneously to
produce an image with similar user-perceived quality (such as brightness) as the
original image.
Intel
®
DPST 6.3 has improved power savings without adversely affecting the
performance.
66 Datasheet, Volume 1 of 2
3.3.2.5 Panel Self-Refresh 2 (PSR 2)
Panel Self-Refresh feature allows the Processor Graphics core to enter low-power state
when the frame buffer content is not changing constantly. This feature is available on
panels capable of supporting Panel Self-Refresh. Apart from being able to support, the
eDP* panel should be eDP 1.4 compliant. PSR 2 adds partial frame updates and
requires an eDP 1.4 compliant panel.
3.3.2.6 Low-Power Single Display Pipe (LPSP)
Low-power single display pipe is a power conservation feature that helps save power by
keeping the inactive display pipes powered OFF. This feature is enabled only in a single
display configuration without any scaling functionalities. This feature is supported from
4th Generation Intel
®
Core™ processor family onwards. LPSP is achieved by keeping a
single display pipe enabled during eDP* only with minimal display pipeline support. This
feature is panel independent and works with any eDP panel (port A) in single display
mode.
3.3.2.7 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT)
Intel
®
S2DDT reduces display refresh memory traffic by reducing memory reads
required for display refresh. Power consumption is reduced by less accesses to the IMC.
Intel S2DDT can be enabled in single pipe mode only.
Intel
®
S2DDT is the most effective with:
• Display images well suited to compression such as text windows, slide shows, and
so on. Poor examples are 3D games.
• Static screens such as screens with significant portions of the background showing
2D applications, processor benchmarks, or conditions when the processor is idle.
Poor examples are full-screen 3D games and benchmarks that flip the display
image at or near display refresh rates.
3.3.3 Processor Graphics Core Power Savings Technologies
3.3.3.1 Intel
®
Graphics Dynamic Frequency
Intel
®
Turbo Boost Technology 2.0 is the ability of the processor IA cores and graphics
(Graphics Dynamic Frequency) cores to opportunistically increase frequency and/or
voltage above the guaranteed processor and graphics frequency for the given part.
Intel
®
Graphics Dynamic Frequency is a performance feature that makes use of unused
package power and thermals to increase application performance. The increase in
frequency is determined by how much power and thermal budget is available in the
package, and the application demand for additional processor or graphics performance.
The processor IA core control is maintained by an embedded controller. The graphics
driver dynamically adjusts between P-States to maintain optimal performance, power,
and thermals. The graphics driver will always place the graphics engine in its lowest
possible P-State. Intel
®
Graphics Dynamic Frequency requires BIOS support. Additional
power and thermal budget should be available.
Datasheet, Volume 1 of 2 67
3.3.3.2 Intel
®
Graphics Render Standby Technology (Intel
®
GRST)
Intel
®
Graphics Render Standby Technology is a technique designed to optimize the
average power of the graphics part. The Graphics Render engine will be put in a sleep
state, or Render Standby (RS), during times of inactivity or basic video modes. While in
Render Standby state, the graphics part will place the VR (Voltage Regulator) into a low
voltage state. Hardware will save the render context to the allocated context buffer
when entering RS state and restore the render context upon exiting RS state.
3.3.3.3 Dynamic FPS (DFPS)
Dynamic FPS (DFPS) or dynamic frame-rate control is a runtime feature for improving
power-efficiency for 3D workloads. Its purpose is to limit the frame-rate of full screen
3D applications without compromising on user experience. By limiting the frame rate,
the load on the graphics engine is reduced, giving an opportunity to run the Processor
Graphics at lower speeds, resulting in power savings. This feature works in both AC/DC
modes.
3.4 System Agent Enhanced Intel
SpeedStep
®
Technology
System Agent Enhanced Intel SpeedStep
®
Technology is a dynamic voltage frequency
scaling of the System Agent clock based on memory utilization. Unlike processor core
and package Enhanced Intel SpeedStep
®
Technology, System Agent Enhanced Intel
SpeedStep
®
Technology has four valid operating points. When running light workload
and SA Enhanced Intel SpeedStep
®
Technology is enabled, the DDR data rate may
change as follows:
Before changing the DDR data rate, the processor sets DDR to self-refresh and changes
the needed parameters. The DDR voltage remains stable and unchanged.
BIOS/MRC DDR training at maximum, mid and minimum frequencies sets I/O and
timing parameters.
Refer Table 5-13, “System Agent Enhanced Speed Steps (SA-GV) and Gear Mode
Frequencies”.
3.5 Voltage Optimization
Voltage Optimization opportunistically provides reduction in power consumption, i.e., a
boost in performance at a given PL1. Over time the benefit is reduced. There is no
change to base frequency or turbo frequency. During system validation and tuning, this
feature should be disabled to reflect processor power and performance that is expected
over time.
This feature is available on selected SKUs.
3.6 ROP (Rest Of Platform) PMIC
In addition to discrete voltage regulators, Intel supports specific PMIC (Power
Management Integrated Circuit) models to power the ROP rails. Intel supports ROP
PMIC as part of UP3/UP4 - Processor Lines only.
68 Datasheet, Volume 1 of 2
3.7 PCI Express* Power Management
• Active power management support using L1 Substates (L1.1,L1.2)
• L0s power state is not supported on 11th Generation Intel
®
Core™ processor
platform.
• All inputs and outputs disabled in L2/L3 Ready state.
• Processor PCIe* interface supports Hot-Plug.
Note: An increase in power consumption may be observed when PCI Express* ASPM
capabilities are disabled.
§ §
Table 3-8. Package C-States with PCIe* Link States Dependencies
L-State Description Package C-State
L0s
L0s is not supported on 11th Generation Intel
®
Core™
Processor platform.
N/A
L0 or deeper L0 is an active state. C0-C3
L1.0 or deeper L1- Higher latency, lower power state. C3-C8
L1.2 or deeper Lower power state. C9-C10
L2 RTD3/Modern standby state. C10
Datasheet, Volume 1 of 2 69
4 Thermal Management
4.1 Processor Thermal Management
The thermal solution provides both component-level and system-level thermal
management. To allow optimal operation and long-term reliability of Intel processor-
based systems, the system/processor thermal solution should be designed so that the
processor:
• Remains below the maximum junction temperature (Tj
MAX
) specification at the
maximum thermal design power (TDP).
• Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution: Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
4.1.1 Thermal Considerations
The processor TDP is the maximum sustained power that should be used for the design
of the processor thermal solution. TDP is a power dissipation and junction temperature
operating condition limit, specified in this document, that is validated during
manufacturing for the base configuration when executing a near worst case
commercially available workload as specified by Intel for the SKU segment. TDP may be
exceeded for short periods of time or if running a very high power workload.
The processor integrates multiple processing IA cores, graphics cores and for some
SKUs a PCH on a single package. This may result in power distribution differences
across the package and should be considered when designing the thermal solution.
Intel
®
Turbo Boost Technology 2.0 allows processor IA cores to run faster than the base
frequency. It is invoked opportunistically and automatically as long as the processor is
conforming to its temperature, power delivery, and current control limits. When Intel
®
Turbo Boost Technology 2.0 is enabled:
• Applications are expected to run closer to TDP more often as the processor will
attempt to maximize performance by taking advantage of estimated available
energy budget in the processor package.
• The processor may exceed the TDP for short durations to utilize any available
thermal capacitance within the thermal solution. The duration and time of such
operation can be limited by platform runtime configurable registers within the
processor.
• Graphics peak frequency operation is based on the assumption of only one of the
graphics domains (GT/GTx) being active. This definition is similar to the IA core
Turbo concept, where peak turbo frequency can be achieved when only one IA core
is active. Depending on the workload being applied and the distribution across the
graphics domains the user may not observe peak graphics frequency for a given
workload or benchmark.
70 Datasheet, Volume 1 of 2
• Thermal solutions and platform cooling that is designed to less than thermal design
guidance may experience thermal and performance issues.
Note: Intel
®
Turbo Boost Technology 2.0 availability may vary between the different SKUs.
4.1.1.1 Package Power Control
The package power control settings of PL1, PL2, PL3, PL4, and Tau allow the designer to
configure Intel
®
Turbo Boost Technology 2.0 to match the platform power delivery and
package thermal solution limitations.
• Power Limit 1 (PL1): A threshold for average power that will not exceed -
recommend to set to equal TDP power. PL1 should not be set higher than thermal
solution cooling limits.
• Power Limit 2 (PL2): A threshold that if exceeded, the PL2 rapid power limiting
algorithms will attempt to limit the spike above PL2.
• Power Limit 3 (PL3): A threshold that if exceeded, the PL3 rapid power limiting
algorithms will attempt to limit the duty cycle of spikes above PL3 by reactively
limiting frequency. This is an optional setting
• Power Limit 4 (PL4): A limit that will not be exceeded, the PL4 power limiting
algorithms will preemptively limit frequency to prevent spikes above PL4.
• Turbo Time Parameter (Tau): An averaging constant used for PL1 exponential
weighted moving average (EWMA) power calculation.
Notes:
1. Implementation of Intel
®
Turbo Boost Technology 2.0 only requires configuring
PL1, PL1, Tau and PL2.
2. PL3 and PL4 are disabled by default.
Datasheet, Volume 1 of 2 71
4.1.1.2 Platform Power Control
The processor introduces Psys (Platform Power) to enhance processor power
management. The Psys signal needs to be sourced from a compatible charger circuit
and routed to the IMVP9 (voltage regulator). This signal will provide the total thermally
relevant platform power consumption (processor and rest of platform) via SVID to the
processor.
When the Psys signal is properly implemented, the system designer can utilize the
package power control settings of PsysPL1/Tau, PsysPL2, and PsysPL3 for additional
manageability to match the platform power delivery and platform thermal solution
limitations for Intel
®
Turbo Boost Technology 2.0. The operation of the PsysPL1/tau,
PsysPL2 and PsysPL3 are analogous to the processor power limits described.
• Platform Power Limit 1 (PsysPL1): A threshold for average platform power that
will not be exceeded - recommend to set to equal platform thermal capability.
• Platform Power Limit 2 (PsysPL2): A threshold that if exceeded, the PsysPL2
rapid power limiting algorithms will attempt to limit the spikes above PsysPL2.
• Platform Power Limit 3 (PsysPL3): A threshold that if exceeded, the PsysPL3
rapid power limiting algorithms will attempt to limit the duty cycle of spikes above
PsysPL3 by reactively limiting frequency.
• PsysPL1 Tau: An averaging constant used for PsysPL1 exponential weighted
moving average (EWMA) power calculation.
• The Psys signal and associated power limits / Tau are optional for the system
designer and disabled by default.
Figure 4-1. Package Power Control
SOC/Platform Power Limiting Knobs Options Visual
PL4
1
PL1/PsysPL1
1
PL2/PsysPL2
1
Å
Power could
sustain here up to
~100s seconds
(Average power)
Time
Power
PL3
1
/PsysPL3
1
Å
Power could
sustain here
forever
Note1: Optional Feature, default is disabled
Power in this region can be configured
via PL1 Tau/PsysPL1 Tau
Powe
r
r
coul
d
d
pea
k
k
for u
p
p
t
o
o
10ms
Duty cycles of power peaks in
this region can be configurable
via PL3/PsysPL3
72 Datasheet, Volume 1 of 2
• The Psys data will not include power consumption for charging.
• The Intel Dynamic Tuning (DTT/DPTF) is recommended for performance
improvement in mobile platforms. Dynamic Tuning is configured by system
manufacturers dynamically optimizing the processor power based on the currently
platform thermal and power delivery conditions. Contact Intel Representatives for
enabling details.
4.1.1.3 Turbo Time Parameter (Tau)
Turbo Time Parameter (Tau) is a mathematical parameter (units of seconds) that
controls the Intel
®
Turbo Boost Technology 2.0 algorithm. During a maximum power
turbo event, the processor could sustain PL2 for a duration longer than the Turbo Time
Parameter. If the power value and/or Turbo Time Parameter is changed during runtime,
it may take some time based on the new Turbo Time Parameter level for the algorithm
to settle at the new control limits. The time varies depending on the magnitude of the
change, power limits and other factors. There is an individual Turbo Time Parameter
associated with Package Power Control and Platform Power Control.
4.1.2 Configurable TDP (cTDP) and Low-Power Mode
Configurable TDP (cTDP) and Low-Power Mode (LPM) form a design option where the
processor's behavior and package TDP are dynamically adjusted to a desired system
performance and power envelope. Configurable TDP and Low-Power Mode technologies
offer opportunities to differentiate system design while running active workloads on
select processor SKUs through scalability, configuration and adaptability. The scenarios
or methods by which each technology is used are customizable but typically involve
changes to PL1 and associated frequencies for the scenario with a resultant change in
performance depending on system's usage. Either technology can be triggered by (but
are not limited to) changes in OS power policies or hardware events such as docking a
system, flipping a switch or pressing a button. cTDP and LPM are designed to be
configured dynamically and do not require an operating system reboot.
Note: Configurable TDP and Low-Power Mode technologies are not battery life improvement
technologies.
4.1.2.1 Configurable TDP
Note: Configurable TDP availability may vary between the different SKUs.
With cTDP (Configurable TDP), the processor is now capable of altering the maximum
sustained power with an alternate processor IA core base frequency. Configurable TDP
allows operation in situations where extra cooling is available or situations where a
cooler and quieter mode of operation is desired. The requirements for developing a
non-driver approach can be found by referencing the appropriate processor
Configurable TDP and LPM Implementation Guide (refer ).
cTDP consists of three modes as shown in the following table:
Datasheet, Volume 1 of 2 73
In each mode, the Intel
®
Turbo Boost Technology 2.0 power limits are reprogrammed
along with a new OS controlled frequency range. The Intel Dynamic Tuning driver
assists in TDP operation by adjusting processor PL1 dynamically. The cTDP mode does
not change the maximum per-processor IA core turbo frequency.
4.1.2.2 Low-Power Mode
Low-Power Mode (LPM) can provide cooler and quieter system operation. By combining
several active power limiting techniques, the processor can consume less power while
running at equivalent low frequencies. Active power is defined as processor power
consumed while a workload is running and does not refer to the power consumed
during idle modes of operation. LPM is only available using the Intel Dynamic tuning
(DTT/DPTF) driver.
Through the Dynamic tuning (DTT/DPTF) driver, LPM can be configured to use each of
the following methods to reduce active power:
• Restricting package power control limits and Intel
®
Turbo Boost Technology
availability
• Off-Lining processor IA core activity (Move processor traffic to a subset of cores)
• Placing a processor IA Core at LFM or LSF (Lowest Supported Frequency)
• Utilizing IA clock modulation
• LPM power as listed in the TDP Specifications table is defined at a point which
processor IA core working at LSF, GT = RPn and 1 IA core active
Off-lining processor IA core activity is the ability to dynamically scale a workload to a
limited subset of cores in conjunction with a lower turbo power limit. It is one of the
main vectors available to reduce active power. However, not all processor activity is
ensured to be able to shift to a subset of cores. Shifting a workload to a limited subset
of cores allows other processor IA cores to remain idle and save power. Therefore,
when LPM is enabled, less power is consumed at equivalent frequencies.
Table 4-1. Configurable TDP Modes
Mode Description
Base The average power dissipation and junction temperature operating condition limit,
specified in Table 4-2, “TDP Specifications” and Table 4-4, “Junction Temperature
Specifications” for the SKU Segment and Configuration, for which the processor is
validated during manufacturing when executing an associated Intel-specified high-
complexity workload at the processor IA core frequency corresponding to the
configuration and SKU.
TDP-Up The SKU-specific processor IA core frequency where manufacturing confirms logical
functionality within the set of operating condition limits specified for the SKU segment
and Configurable TDP-Up configuration in Table 4-2, “TDP Specifications” and Table 4-4,
“Junction Temperature Specifications”. The Configurable TDP-Up Frequency and
corresponding TDP is higher than the processor IA core Base Frequency and SKU
Segment Base TDP.
TDP-Down The processor IA core frequency where manufacturing confirms logical functionality
within the set of operating condition limits specified for the SKU segment and
Configurable TDP-Down configuration in Table 4-2, “TDP Specifications” and Table 4-4,
“Junction Temperature Specifications”. The Configurable TDP-Down Frequency and
corresponding TDP is lower than the processor IA core Base Frequency and SKU Segment
Base TDP.
74 Datasheet, Volume 1 of 2
Minimum Frequency Mode (MFM) of operation, which is the Lowest Supported
Frequency (LSF) at the LFM voltage, has been made available for use under LPM for
further reduction in active power beyond LFM capability to enable cooler and quieter
modes of operation.
4.1.3 Thermal Management Features
Occasionally the processor may operate in conditions that are near to its maximum
operating temperature. This can be due to internal overheating or overheating within
the platform. In order to protect the processor and the platform from thermal failure,
several thermal management features exist to reduce package power consumption and
thereby temperature in order to remain within normal operating limits. Furthermore,
the processor supports several methods to reduce memory power.
4.1.3.1 Adaptive Thermal Monitor
The purpose of the Adaptive Thermal Monitor is to reduce processor IA core power
consumption and temperature until it operates below its maximum operating
temperature. Processor IA core power reduction is achieved by:
• Adjusting the operating frequency (using the processor IA core ratio multiplier) and
voltage.
• Modulating (starting and stopping) the internal processor IA core clocks (duty
cycle).
The Adaptive Thermal Monitor can be activated when the package temperature,
monitored by any Digital Thermal Sensor (DTS), meets its maximum operating
temperature. The maximum operating temperature implies maximum junction
temperature Tj
MAX
.
Reaching the maximum operating temperature activates the Thermal Control Circuit
(TCC). When activated the TCC causes both the processor IA core and graphics core to
reduce frequency and voltage adaptively. The Adaptive Thermal Monitor will remain
active as long as the package temperature remains at its specified limit. Therefore, the
Adaptive Thermal Monitor will continue to reduce the package frequency and voltage
until the TCC is de-activated.
Tj
MAX
is factory calibrated and is not user configurable. The default value is software
visible in the TEMPERATURE_TARGET (0x1A2) MSR, bits [23:16].
The Adaptive Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines. It is not intended as a mechanism to maintain
processor thermal control to PL1 = TDP. The system design should provide a thermal
solution that can maintain normal operation when PL1 = TDP within the intended usage
range.
Adaptive Thermal Monitor protection is always enabled.
4.1.3.1.1 TCC Activation Offset
TCC Activation Offset can be set as an offset from Tj
MAX
to lower the onset of TCC and
Adaptive Thermal Monitor. In addition, there is an optional time window (Tau) to
manage processor performance at the TCC Activation offset value via an EWMA
(Exponential Weighted Moving Average) of temperature.
Datasheet, Volume 1 of 2 75
TCC Activation Offset with Tau=0
An offset (degrees Celsius) can be written to the TEMPERATURE_TARGET (0x1A2) MSR,
bits [29:24], the offset value will be subtracted from the value found in bits [23:16].
When the time window (Tau) is set to zero, there will be no averaging, the offset, will
be subtracted from the Tj
MAX
value and used as a new maximum temperature set point
for Adaptive Thermal Monitoring. This will have the same behavior as in prior products
to have TCC activation and Adaptive Thermal Monitor to occur at this lower target
silicon temperature.
If enabled, the offset should be set lower than any other passive protection such as
ACPI _PSV trip points
TCC Activation Offset with Tau
To manage the processor with the EWMA (Exponential Weighted Moving Average) of
temperature, an offset (degrees Celsius) is written to the TEMPERATURE_TARGET
(0x1A2) MSR, bits [29:24], and the time window (Tau) is written to the
TEMPERATURE_TARGET (0x1A2) MSR [6:0]. The Offset value will be subtracted from
the value found in bits [23:16] and be the temperature.
The processor will manage to this average temperature by adjusting the frequency of
the various domains. The instantaneous Tj can briefly exceed the average temperature.
The magnitude and duration of the overshoot is managed by the time window value
(Tau).
This averaged temperature thermal management mechanism is in addition, and not
instead of Tj
MAX
thermal management. That is, whether the TCC activation offset is 0 or
not, TCC Activation will occur at Tj
MAX
.
4.1.3.1.2 Frequency / Voltage Control
Upon Adaptive Thermal Monitor activation, the processor attempts to dynamically
reduce processor temperature by lowering the frequency and voltage operating point.
The operating points are automatically calculated by the processor IA core itself and do
not require the BIOS to program them as with previous generations of Intel processors.
The processor IA core will scale the operating points such that:
• The voltage will be optimized according to the temperature, the processor IA core
bus ratio and the number of processor IA cores in deep C-states.
• The processor IA core power and temperature are reduced while minimizing
performance degradation.
Once the temperature has dropped below the trigger temperature, the operating
frequency and voltage will transition back to the normal system operating point.
Once a target frequency/bus ratio is resolved, the processor IA core will transition to
the new target automatically.
• On an upward operating point transition, the voltage transition precedes the
frequency transition.
• On a downward transition, the frequency transition precedes the voltage transition.
• The processor continues to execute instructions. However, the processor will halt
instruction execution for frequency transitions.
76 Datasheet, Volume 1 of 2
If a processor load-based Enhanced Intel SpeedStep Technology/P-state transition
(through MSR write) is initiated while the Adaptive Thermal Monitor is active, there are
two possible outcomes:
• If the P-state target frequency is higher than the processor IA core optimized
target frequency, the P-state transition will be deferred until the thermal event has
been completed.
• If the P-state target frequency is lower than the processor IA core optimized target
frequency, the processor will transition to the P-state operating point.
4.1.3.1.3 Clock Modulation
If the frequency/voltage changes are unable to end an Adaptive Thermal Monitor event,
the Adaptive Thermal Monitor will utilize clock modulation. Clock modulation is done by
alternately turning the clocks off and on at a duty cycle (ratio between clock “on” time
and total time) specific to the processor. The duty cycle is factory configured to 25% on
and 75% off and cannot be modified. The period of the duty cycle is configured to 32
microseconds when the Adaptive Thermal Monitor is active. Cycle times are
independent of processor frequency. A small amount of hysteresis has been included to
prevent excessive clock modulation when the processor temperature is near its
maximum operating temperature. Once the temperature has dropped below the
maximum operating temperature, and the hysteresis timer has expired, the Adaptive
Thermal Monitor goes inactive and clock modulation ceases. Clock modulation is
automatically engaged as part of the Adaptive Thermal Monitor activation when the
frequency/voltage targets are at their minimum settings. Processor performance will be
decreased when clock modulation is active. Snooping and interrupt processing are
performed in the normal manner while the Adaptive Thermal Monitor is active.
Clock modulation will not be activated by the Package average temperature control
mechanism.
4.1.3.1.4 Thermal Throttling
As the processor approaches TJ
Max
a throttling mechanisms will engage to protect the
processor from over-heating and provide control thermal budgets.
Achieving this is done by reducing IA and other subsystem agent's voltages and
frequencies in a gradual and coordinated manner that varies depending on the
dynamics of the situation. IA frequencies and voltages will be directed down as low as
LFM (Lowest Frequency Mode). Further restricts are possible via Thermal Trolling point
(TT1) under conditions where thermal budget cannot be re-gained fast enough with
voltages and frequencies reduction alone. TT1 keeps the same processor voltage and
clock frequencies the same yet skips clock edges to produce effectively slower clocking
rates. This will effectively result in observed frequencies below LFM on the Windows
PERF monitor.
4.1.3.2 Digital Thermal Sensor
Each processor has multiple on-die Digital Thermal Sensor (DTS) that detects the
processor IA, GT and other areas of interest instantaneous temperature.
Temperature values from the DTS can be retrieved through:
• A software interface using processor Model Specific Register (MSR).
• A processor hardware interface.
Datasheet, Volume 1 of 2 77
When the temperature is retrieved by the processor MSR, it is the instantaneous
temperature of the given DTS. When the temperature is retrieved using PECI, it is the
average of the highest DTS temperature in the package over a 256 ms time window.
Intel recommends using the PECI reported temperature for platform thermal control
that benefits from averaging, such as fan speed control. The average DTS temperature
may not be a good indicator of package Adaptive Thermal Monitor activation or rapid
increases in temperature that triggers the Out of Specification status bit within the
PACKAGE_THERM_STATUS (0x1B1) MSR and IA32_THERM_STATUS (0x19C) MSR.
Code execution is halted in C1 or deeper C-states. Package temperature can still be
monitored through PECI in lower C-states.
Unlike traditional thermal devices, the DTS outputs a temperature relative to the
maximum supported operating temperature of the processor (Tj
MAX
), regardless of TCC
activation offset. It is the responsibility of software to convert the relative temperature
to an absolute temperature. The absolute reference temperature is readable in the
TEMPERATURE_TARGET (0x1A2) MSR. The temperature returned by the DTS is an
implied negative integer indicating the relative offset from Tj
MAX
. The DTS does not
report temperatures greater than Tj
MAX
. The DTS-relative temperature readout directly
impacts the Adaptive Thermal Monitor trigger point. When a package DTS indicates
that it has reached the TCC activation (a reading of 0x0, except when the TCC
activation offset is changed), the TCC will activate and indicate an Adaptive Thermal
Monitor event. A TCC activation will lower both processor IA core and graphics core
frequency, voltage, or both. Changes to the temperature can be detected using two
programmable thresholds located in the processor thermal MSRs. These thresholds
have the capability of generating interrupts using the processor IA core's local APIC.
4.1.3.2.1 Digital Thermal Sensor Accuracy (T_accuracy)
The error associated with DTS measurements will not exceed ±5 °C within the entire
operating range.
4.1.3.2.2 Fan Speed Control with Digital Thermal Sensor
Digital Thermal Sensor based fan speed control (T
FAN
) is a recommended feature to
achieve optimal thermal performance. At the T
FAN
temperature, Intel recommends full
cooling capability before the DTS reading reaches Tj
MAX
.
4.1.3.3 PROCHOT# Signal
The PROCHOT# (processor hot) signal is asserted by the processor when the TCC is
active. Only a single PROCHOT# pin exists at a package level. When any DTS
temperature reaches the TCC activation temperature, the PROCHOT# signal will be
asserted. PROCHOT# assertion policies are independent of Adaptive Thermal Monitor
enabling.
The PROCHOT# signal can be configured to the following modes:
• Input Only: PROCHOT is driven by an external device.
• Output Only: PROCHOT is driven by processor.
• Bi-Directional: Both Processor and external device can drive PROCHOT signal
78 Datasheet, Volume 1 of 2
4.1.3.3.1 PROCHOT Input Only
The PROCHOT# signal should be set to input only by default. In this state, the
processor will only monitor PROCHOT# assertions and respond by setting the
maximum frequency to 10Khz.
The following two features are enabled when PROCHOT is set to Input only:
• Fast PROCHOT: Respond to PROCHOT# within 10 uS of PROCHOT# pin assertion,
reducing the processor frequency by 50 %.
• PROCHOT Demotion Algorithm: designed to improve system performance
during multiple PROCHOT assertions (refer Section 4.1.3.6, “PROCHOT Demotion
Algorithm”).
4.1.3.4 PROCHOT Output Only
Legacy state, PROCHOT is driven by the processor to external device.
4.1.3.5 Bi-Directional PROCHOT#
By default, the PROCHOT# signal is set to input only. When configured as an input or
bi-directional signal, PROCHOT# can be used for thermally protecting other platform
components should they overheat as well. When PROCHOT# is driven by an external
device:
• The package will immediately transition to the lowest P-State (Pn) supported by the
processor IA cores and graphics cores. This is contrary to the internally-generated
Adaptive Thermal Monitor response.
• Clock modulation is not activated.
The processor package will remain at the lowest supported P-state until the system de-
asserts PROCHOT#. The processor can be configured to generate an interrupt upon
assertion and de-assertion of the PROCHOT# signal.
When PROCHOT# is configured as a bi-directional signal and PROCHOT# is asserted by
the processor, it is impossible for the processor to detect a system assertion of
PROCHOT#. The system assertion will have to wait until the processor de-asserts
PROCHOT# before PROCHOT# action can occur due to the system assertion. While the
processor is hot and asserting PROCHOT#, the power is reduced but the reduction rate
is slower than the system PROCHOT# response of < 100 us. The processor thermal
control is staged in smaller increments over many milliseconds. This may cause several
milliseconds of delay to a system assertion of PROCHOT# while the output function is
asserted.
4.1.3.6 PROCHOT Demotion Algorithm
PROCHOT demotion algorithm designed to improve system performance following
multiple EC PROCHOT consecutive assertions. During each PROCHOT assertion
processor will immediately transition to the lowest P-State (Pn) supported by the
processor IA cores and graphics cores (LFM). When detecting several PROCHOT
consecutive assertions the processor will reduce the max frequency in order to reduce
the PROCHOT assertions events. The processor will keep reducing the frequency until
Datasheet, Volume 1 of 2 79
no consecutive assertions detected. The processor will raise the frequency if no
consecutive PROCHOT assertion events will occur. PROCHOT demotion algorithm
enabled only when the PROCHOT is configured as input.
Figure 4-2. PROCHOT Demotion Signal Description
4.1.3.7 Voltage Regulator Protection using PROCHOT#
PROCHOT# may be used for thermal protection of voltage regulators (VR). System
designers can create a circuit to monitor the VR temperature and assert PROCHOT#
and, if enabled, activate the TCC when the temperature limit of the VR is reached.
When PROCHOT# is configured as a bi-directional or input only signal, if the system
assertion of PROCHOT# is recognized by the processor, it will result in an immediate
transition to the lowest P-State (Pn) supported by the processor IA cores and graphics
cores. Systems should still provide proper cooling for the VR and rely on bi-directional
PROCHOT# only as a backup in case of system cooling failure. Overall, the system
thermal design should allow the power delivery circuitry to operate within its
temperature specification even while the processor is operating at its TDP.
4.1.3.8 Thermal Solution Design and PROCHOT# Behavior
With a properly designed and characterized thermal solution, it is anticipated that
PROCHOT# will only be asserted for very short periods of time when running the most
power intensive applications. The processor performance impact due to these brief
periods of TCC activation is expected to be so minor that it would be immeasurable.
However, an under-designed thermal solution that is not able to prevent excessive
assertion of PROCHOT# in the anticipated ambient environment may:
• Cause a noticeable performance loss.
• Result in prolonged operation at or above the specified maximum junction
temperature and affect the long-term reliability of the processor.
• May be incapable of cooling the processor even when the TCC is active continuously
(in extreme situations).
80 Datasheet, Volume 1 of 2
4.1.3.9 Low-Power States and PROCHOT# Behavior
Depending on package power levels during package C-states, outbound PROCHOT#
may de-assert while the processor is idle as power is removed from the signal. Upon
wake up, if the processor is still hot, the PROCHOT# will re-assert, although typically
package idle state residency should resolve any thermal issues. The PECI interface is
fully operational during all C-states and it is expected that the platform continues to
manage processor IA core and package thermals even during idle states by regularly
polling for thermal data over PECI.
PECI can be implemented using either the single bit bidirectional I/O pin or using the
eSPI interface
4.1.3.10 THRMTRIP# Signal
Regardless of enabling the automatic or on-demand modes, in the event of a
catastrophic cooling failure, the package will automatically shut down when the silicon
has reached an elevated temperature that risks physical damage to the product. At this
point, the THRMTRIP# signal will go active.
4.1.3.11 Critical Temperature Detection
Critical Temperature detection is performed by monitoring the package temperature.
This feature is intended for graceful shutdown before the THRMTRIP# is activated.
However, the processor execution is not guaranteed between critical temperature and
THRMTRIP#. If the Adaptive Thermal Monitor is triggered and the temperature remains
high, a critical temperature status and sticky bit are latched in the
PACKAGE_THERM_STATUS (0x1B1) MSR and the condition also generates a thermal
interrupt, if enabled.
4.1.3.12 On-Demand Mode
The processor provides an auxiliary mechanism that allows system software to force
the processor to reduce its power consumption using clock modulation. This
mechanism is referred to as “On-Demand” mode and is distinct from Adaptive Thermal
Monitor and bi-directional PROCHOT#. The processor platforms should not rely on
software usage of this mechanism to limit the processor temperature. On-Demand
Mode can be accomplished using processor MSR or chipset I/O emulation. On-Demand
Mode may be used in conjunction with the Adaptive Thermal Monitor. However, if the
system software tries to enable On-Demand mode at the same time the TCC is
engaged, the factory configured the duty cycle of the TCC will override the duty cycle
selected by the On-Demand mode. If the I/O based and MSR-based On-Demand modes
are in conflict, the duty cycle selected by the I/O emulation-based On-Demand mode
will take precedence over the MSR-based On-Demand Mode.
4.1.3.13 MSR Based On-Demand Mode
If Bit 4 of the IA32_CLOCK_MODULATION MSR is set to 1, the processor will
immediately reduce its power consumption using modulation of the internal processor
IA core clock, independent of the processor temperature. The duty cycle of the clock
modulation is programmable using bits [3:1] of the same IA32_CLOCK_MODULATION
Datasheet, Volume 1 of 2 81
MSR. In this mode, the duty cycle can be programmed in either 12.5% or 6.25%
increments (discoverable using CPUID). Thermal throttling using this method will
modulate each processor IA core's clock independently.
4.1.3.14 I/O Emulation-Based On-Demand Mode
I/O emulation-based clock modulation provides legacy support for operating system
software that initiates clock modulation through I/O writes to ACPI defined processor
clock control registers on the chipset (PROC_CNT). Thermal throttling using this
method will modulate all processor IA cores simultaneously.
4.1.4 Intel
®
Memory Thermal Management
DRAM Thermal Aggregation
Punit firmware is responsible for aggregating DRAM temperature sources into a per-
DIMM reading as well as an aggregated virtual 'max' sensor reading. At reset, MRC
communicates to the MC the valid channels and ranks as well as DRAM type. At that
time, Punit firmware sets up a valid channel and rank mask that is then used in the
thermal aggregation algorithm to produce a single maximum temperature
DRAM Thermal Monitoring
• DRAM thermal sensing Periodic DDR thermal reads from DDR
• DRAM thermal calculation Punit reads of DDR thermal information direct from the
memory controller (MR4 or MPR) Punit estimation of a virtual maximum DRAM
temperature based on per-rank readings. Application of thermal filter to the virtual
maximum temperature.
• Thermal Monitoring Collection of inputs from software for thermal interrupt
management. Calculation of thermal threshold status and log bits as well as
interrupt delivery.
• DRAM thermal reporting Writing out of filtered, virtual maximum DDR temperature
to software visible registers.
DRAM Refresh Rate Control
• The new interface provides a direct override to refresh rate management,
regardless of MR4 or MPR readings. From both in-band software and PECI/ESPI.
DRAM Bandwidth Throttling
• Software and PECI/ESPI control for throttling the memory controller and DRAM
maximum bandwidth.
82 Datasheet, Volume 1 of 2
4.2 Thermal and Power Specifications
The following notes apply to the tables below, Table 4-2, “TDP Specifications”,
Table 4-3, “Package Turbo Specifications”, and Table 4-4, “Junction Temperature
Specifications”
Note Note Definition
1
The TDP and Configurable TDP values are the average power dissipation in junction temperature
operating condition limit, for the SKU Segment and Configuration, for which the processor is validated
during manufacturing when executing an associated Intel-specified high-complexity workload at the
processor IA core frequency corresponding to the configuration and SKU.
2
TDP workload may consist of a combination of processor IA core intensive and graphics core intensive
applications.
3 Can be modified at runtime by MSR writes, with MMIO and with PECI commands.
4
'Turbo Time Parameter' is a mathematical parameter (units of seconds) that controls the processor
turbo algorithm using a moving average of energy usage. Do not set the Turbo Time Parameter to a
value less than 0.1 seconds. refer to Section 4.1.1.2, “Platform Power Control” for further
information.
5
The shown limit is a time averaged-power, based upon the Turbo Time Parameter. Absolute product
power may exceed the set limits for short durations or under virus or uncharacterized workloads.
6
The Processor will be controlled to a specified power limit as described in Section 2.4.6.1, “Intel
®
Turbo Boost Technology 2.0 Power Monitoring”
. If the power value and/or 'Turbo Time Parameter' is changed
during runtime, it may take a short period of time (approximately 3 to 5 times the 'Turbo Time
Parameter') for the algorithm to settle at the new control limits.
7 This is a hardware default setting and not a behavioral characteristic of the part.
8 For controllable turbo workloads, the PL2 limit may be exceeded for up to 10 ms.
9
LPM power level is an opportunistic power and is not a guaranteed value as usages and
implementations may vary.
10
Power limits may vary depending on if the product supports the 'TDP-up' and/or 'TDP-down' modes.
Default power limits can be found in the PKG_PWR_SKU MSR (614h).
11
The processor die do not reach maximum sustained power simultaneously since the sum of the 2
die's estimated power budget is controlled to be equal to or less than the package TDP (PL1) limit.
12
cTDP down power is based on GT2 equivalent graphics configuration. cTDP down does not decrease
the number of active Processor Graphics EUs but relies on Power Budget Management (PL1) to
achieve the specified power level.
13 May vary based on SKU.
14
• The formula of PL2=PL1*1.25 is the hardware default.
• PL2- SoC opportunistic higher Average Power with limited duration controlled by Tau_PL1 setting,
the larger the Tau, the longer the PL2 duration.
16
Hardware default of PL1 Tau=1 s, By including the benefits available from power and thermal
management features the recommended is to use PL1 Tau=28 s.
Table 4-2. TDP Specifications (Sheet 1 of 3)
Segment
and
Package
Processor IA
Cores,
Graphics
Configuration
and TDP
Configuration
Processor IA
Core
Frequency
Graphics
Core
Frequency
Thermal
Design Power
(TDP) [W]
Notes
(from table
above)
H-Processor
Line
8- Core GT1
45W
Configurable
TDP-Up
3.3GHz
1.45GHz
65
2
1,9,10,15
Base
2.6GHz
45
1
LFM 0.8GHz 0.35GHz N/A
Datasheet, Volume 1 of 2 83
H-Processor
Line
8- Core GT1
45W
Base
2.3GHz up to
2.6GHz
1.45GHz
45
1
1,9,10,15
Configurable
TDP-Down
1.9GHz up to
2.1GHz
35
2
LFM 0.8GHz 0.35GHz N/A
H-Processor
Line
6- Core GT1
45W
Base
2.6GHz up to
3.2GHz
1.4GHz up to
1.45GHz
45
1
1,9,10,15
Configurable
TDP-Down
2.1GHz up to
2.6GHz
35
2
LFM 0.8GHz 0.35GHz N/A
UP3-
Processor
Line
4- Core GT2
28W
Base
2.4GHz to
3.0GHz
1.3GHz up to
1.35GHz
28
1,9,10,15
Configurable
TDP-Down 1
2.4GHz up to
3.0GHz
15
Configurable
TDP-Down 2
0.9GHz up to
1.2GHz
12
LFM 0.4GHz 0.1GHz N/A
UP3-
Processor
Line
2- Core GT2
28W
Base 3.0GHz
1.25GHz
28
1,9,10,15
Configurable
TDP-Down 1
2.2GHz 15
Configurable
TDP-Down 2
1.7GHz 12
LFM 0.4GHz 0.1GHz N/A
UP3-
Pentium/
Celeron
Processor
Line
2- Core GT2
15W
Base 1.8GHz-2.0Ghz
1.25GHz
15
1,9,10,15
LFM 0.4GHz N/A
UP4-
Processor
Line
4- Core GT2
9W
Base
1.1GHz to
1.2GHz
1.1GHz
9
1,9,10,11,15
Configurable
TDP-Up
1.5GHz up to
2.1Ghz
15
Configurable
TDP-Down
0.8GHz up to
0.9GHz
7
LFM 0.4GHz 0.1GHz N/A
UP4-
Processor
Line
2- Core GT2
9W
Base 1.8GHz
1.1GHz
9
1,9,10,11,15
Configurable
TDP-Up
2.5GHz 15
Configurable
TDP-Down
1.5GHz 7
LFM 0.4GHz 0.1GHz N/A
H35-
Processor
Line
4- Core GT2
35W
Base
3.1GHz up to
3.3GHz
1.35GHz
35
1
1,9,10,15Configurable
TDP-Down
2.6GHz up to
3.0GHz
28
1
LFM 0.4GHz 0.1GHz N/A
Table 4-2. TDP Specifications (Sheet 2 of 3)
Segment
and
Package
Processor IA
Cores,
Graphics
Configuration
and TDP
Configuration
Processor IA
Core
Frequency
Graphics
Core
Frequency
Thermal
Design Power
(TDP) [W]
Notes
(from table
above)
84 Datasheet, Volume 1 of 2
H35-Refresh
Processor
Line
4- Core GT2
35W
Base
3.4GHz
1.4GHz
35
1,9,10,11,15
Configurable
TDP-Down
2.9GHz 28
LFM 0.4GHz 0.1GHz N/A
UP3-Refresh
Processor
Line
4- Core GT2
28W
Base
2.9 GHz
1.4GHz
28
1,9,10,15
Configurable
TDP-Down_1
1.8 GHz 15
Configurable
TDP-Down_2
1.3 GHz 12
LFM 0.4GHz 0.1GHz N/A
Table 4-3. Package Turbo Specifications (Sheet 1 of 2)
Segment
and
Package
Processor IA
Cores,
Graphics
Configuration
and TDP
Parameter Minimum
Hardware
Default
MSR
Max
Value
Recommendation
Value Units Notes
H-Processor
Line
8- Core GT1
45W
Power Limit 1
Time (PL1 Tau)
0.01 1 448 56 S
3,4,5,6
,7,8,14
,16,17
Power Limit 1
(PL1)
N/A 45 N/A N/A W
Power Limit 2
(PL2)
N/A PL1*1.25 N/A N/A W
H-Processor
Line
6 - Core GT1
45W
Power Limit 1
Time (PL1 Tau)
0.01 1 448 28 S
3,4,5,6
,7,8,14
,16,17
Power Limit 1
(PL1)
N/A 45 N/A N/A W
Power Limit 2
(PL2)
N/A PL1*1.25 N/A N/A W
UP3/ UP3-
Refresh -
Processor
Line
4/2- Core GT2
28W
Power Limit 1
Time (PL1 Tau)
0.01 1 448 28 S
3,4,5,6
,7,8,14
,16
Power Limit 1
(PL1)
N/A 28 N/A N/A W
Power Limit 2
(PL2)
N/A PL1*1.25 N/A N/A W
UP3-Pentium/
Celeron
Processor
Line
2- Core GT2
15W
Power Limit 1
Time (PL1 Tau)
0.01 1 448 28 S
3,4,5,6
,7,8,14
,16
Power Limit 1
(PL1)
N/A 15 N/A N/A W
Power Limit 2
(PL2)
N/A PL1*1.25 N/A N/A W
Table 4-2. TDP Specifications (Sheet 3 of 3)
Segment
and
Package
Processor IA
Cores,
Graphics
Configuration
and TDP
Configuration
Processor IA
Core
Frequency
Graphics
Core
Frequency
Thermal
Design Power
(TDP) [W]
Notes
(from table
above)
Datasheet, Volume 1 of 2 85
§ §
UP4-
Processor
Line
4/2- Core GT2
9W
Power Limit 1
Time (PL1 Tau)
0.01 1 448 28 S
3,4,5,6
,7,8,14
,16
Power Limit 1
(PL1)
N/A 9 N/A N/A W
Power Limit 2
(PL2)
N/A PL1*1.25 N/A N/A W
H35/ H35
Refresh -
Processor
Line
4- Core GT2
35W
Power Limit 1
Time (PL1 Tau)
0.01 1 448 28 S
3,4,5,6
,7,8,14
,16,17
Power Limit 1
(PL1)
N/A 35 N/A N/A W
Power Limit 2
(PL2)
N/A PL1*1.25 N/A N/A W
Notes:
1. For the notes, refer to the 1st page of Chapter 4, “Thermal Management”.
2. No Specifications for Min/Max PL1/PL2 values.
3. Hardware default of PL1 Tau=1 s, By including the benefits available from power and thermal management features the
recommended is to use PL1 Tau=28 s.
Table 4-4. Junction Temperature Specifications
Segment Symbol
Package Turbo
Parameter
Temperature Range
TDP Specification
Temperature Range
Units Notes
Minimum Maximum Minimum Maximum
H-Processor
Line BGA
T
j
Junction
temperature limit
0 100 0 100 ºC 1, 2
UP3/UP3-
Refresh//
H35-H35
Refresh
Processor
Line BGA
T
j
Junction
temperature limit
0 100 35 100 ºC 1, 2
UP4-
Processor
Line BGA
T
j
Junction
temperature limit 0 100 0 90 ºC 1, 2, 3
Notes:
1. The thermal solution needs to ensure that the processor temperature does not exceed the TDP Specification Temperature.
2. The processor junction temperature is monitored by Digital Temperature Sensors (DTS). For DTS accuracy, refer Section
4.1.3.2.1, “Digital Thermal Sensor Accuracy (T_accuracy)”.
3. UP4 specification need to be compliance with the 90ºC TDP specification temperature, TCC Offset = 10 and Tau value should be
programed into MSR 1A2h. The recommended TCC_Offset averaging Tau value is 5 s.
Table 4-3. Package Turbo Specifications (Sheet 2 of 2)
Segment
and
Package
Processor IA
Cores,
Graphics
Configuration
and TDP
Parameter Minimum
Hardware
Default
MSR
Max
Value
Recommendation
Value Units Notes
86 Datasheet, Volume 1 of 2
5 Memory
5.1 System Memory Interface
5.1.1 Processor SKU Support Matrix
Table 5-1. DDR Support Matrix Table
Technology DDR4
5
LPDDR4x
4
Processor UP3/H
9,10
UP3/UP4
Maximum Frequency [MT/s] 3200 4266
VDDQ [V]
5
1.2 0.6
VDD2 [V]
57
1.2 1.1
DPC
1,2
1, (2 is for H only) -
RPC 1,2 1,2
Die Density [Gb] 8, 16 8, 16
Ballmap Mode IL
3
/NIL NIL
ECC H
8
only N/A
Notes:
1. 1DPC refer to when only 1DIMM slot per channel is routed.
2. 2DPC refers to when 2 DIMM slots per Channel are routed and are fully populated or partially
populated with 1 DIMM only. 2DPC supported in H segment only.
3. An Interleave SoDIMM/MD placements like butterfly or back-to-back supported with a
Non-Interleave Ballout mode at UP3.
4. LPDDR4x technology should be implemented homogeneous means that all DRAM devices in the
system should be from the same vendor and have the same part number. Implementing a mix of
DRAM devices may cause serious signal integrity and functional issues.
5. DDR4 supports asymmetric channel memory capacity. For best IA and GFx performance it is
recommended to use symmetric channels capacity
.
6. There is no support for memory modules with different technologies or capacities on opposite
sides of the same memory module. If one side of a memory module is populated, the other side
is either identical or empty.
7. VDD2 is Processor and DRAM voltage, and VDDQ is DRAM voltage.
8. H-processor supports ECC with Interleave Ballout only. ECC with non-interleave is not supported.
9. H-processor DDR4 DIMM0 (Rank[1:0]) must be populated in case DIMM1 (Rank[3:2]) is
populated.
Processor will not boot in case DIMM1 (Rank[3:2]) is populated and DIMM0 (Rank[1:0]) is not
populated.
10. Some SKUs may configured to run up to 2933 MT/s
Table 5-2. Processor DDR Speed Support
Processor Line
DDR4 Memory
Down [MT/s]
DDR4 1DPC
[MT/s]
DDR4 2DPC
[MT/s]
LPDDR4x
[MT/s]
H-Processor Line
1
3200 3200 3200 N/A
UP3-Processor Line 3200 3200 N/A 4266
UP4-Processor Line N/A N/A N/A 4266
UP3-Refresh
Processor Line
3200 3200 N/A 4266
Note:
1. H-Processor DDR4 2DPC is supported when the channel is populated with the same
SoDIMM part number.
Datasheet, Volume 1 of 2 87
5.1.2 Supported Population
Table 5-3. DDR Technology Support Matrix
Technology Form Factor Ball count Processor
DDR4 SoDIMM 260 UP3/H
DDR4 x8 SDP (1R) 78 UP3/H
DDR4 x16 SDP (1R) 96 UP3/H
DDR4 x16 DDP (1R) 96 UP3/H
LPDDR4x x32 (1R, 2R) 200 UP4
1
/UP3
LPDDR4x x64 (1R, 2R) 432 UP4/UP3
LPDDR4x х64 (1R, 2R) 556 UP4
Notes:
1. Non POR configuration only
Table 5-4. LPDDR4x Channels Population Rules
Configuration
Memory Controller 0 Memory Controller 1
CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7
# of Chs PKG Width # of DQs x16 x16 x16 x16 x16 x16 x16 x16
8 64 128 x64 x64
8 32 128 x32 x32 x32 x32
4 64 64 x64
4 32 64 x32 x32
Note: White blank means not populated
88 Datasheet, Volume 1 of 2
Table 5-6. H DDR4 SoDIMM Population Configuration
Configuration
Memory Controller 0 Memory Controller 1
Channel 0 Channel 1
DIMM 0 DIMM 1 DIMM 0 DIMM 1
Rank[1:0] Rank[3:2] Rank[1:0] Rank[3:2]
2 DIMM per
channel
x64 x64 x64 x64
X X X X
X X X
X X X
X X
X X
X X
X
X
1 DIMM per
channel
X
X
X X
Notes:
1. X means SoDIMM populated, White blank means SoDIMM not populated, Gray blank means no slot
2. DDR4 DIMM0(Rank[1:0]) must be populated as a default DIMM, DDR4 DIMM1(Rank[3:2]) is optional. Populating
Slot1(Ranks[3:2]) when Slot0(Ranks[1:0]) is not populate may cause system not to boot.
3. 2DPC required populated DIMM have same part number within each channel.
4. DDR4 Memory Down Channel must use Rank[0]
Datasheet, Volume 1 of 2 89
5.1.3 Supported Memory Modules and Devices
Table 5-7. Supported DDR4 SoDIMM Module Configurations
Raw
Card
Version
DIMM
Capacity
DRAM Device
Technology
DRAM
Organization
# of
DRAM
Devices
# of
Ranks
# of Row/Col
Address Bits
# of Banks
Inside
DRAM
Page
Size
ECC
A 8 GB 8 Gb 1024M x 8 8 1 16/10 16 8 K No
A 16 GB 16 Gb 2048M x 8 8 1 17/10 16 8 K No
C 4 GB 8 Gb 512M x 16 4 1 16/10 8 8 K No
C 8 GB 16 Gb 1024M x 16 4 1 17/10 8 8 K No
E 16 GB 8 Gb 1024M x 8 16 2 16/10 16 8 K No
E 32 GB 16 Gb 2048M x 8 16 2 17/10 16 8 K No
D 8 GB 8 Gb 1024M x 8 9 1 16/10 16 8 K Yes
D 16 GB 16 Gb 2048M x 8 9 1 17/10 16 8 K Yes
G 16 GB 8 Gb 1024M x 8 18 2 16/10 16 8 K Yes
G 32 GB 16 Gb 2048M x 8 18 2 17/10 16 8 K Yes
H 16 GB 8 Gb 1024M x 8 18 2 16/10 16 8 K Yes
H 32 GB 16 Gb 2048M x 8 18 2 17/10 16 8 K Yes
Table 5-8. Supported DDR4 Memory Down Device Configurations
Maximum
System
Capacity
3
PKG Type
(Die bits x
Package
bits)
DRAM
Organization
/ Package
Type
Package
Density
Die
Density
Dies Per
Channel
Rank Per
Channel
PKGs
Per
channel
Physical
Device
Rank
Banks
Inside
DRAM
Page
Size
16 GB SDP 8x8 1024M x 8 8 Gb 8 Gb 8 1 8 1 16 8 K
32 GB SDP 8x8 2048M x 8 16 Gb 16 Gb 8 1 8 1 16 8 K
8 GB SDP 16x16 512M x 16 8 Gb 8 Gb 4 1 4 1 8 8 K
16 GB
1
SDP 16x16 1024M x 16 16 Gb 16 Gb 4 1 4 1 8 8 K
16 GB DDP 8x16 1024M x 16 16 Gb 8 Gb 8 1 4 1 16 8 K
32 GB
2,3
DDP 8x16 2048M x 16 32 Gb 16 Gb 8 1 4 1 16 8 K
Notes:
1. For SDP: 1Rx16 using 16Gb die density - the maximum system capacity is 16 GB
2. For DDP: 1Rx16 using 16Gb die density - the maximum system capacity is 32 GB.
3. Pending DRAM samples availability.
4. Maximum system capacity refer to system with 2 channels populated
Table 5-9. Supported LPDDR4x x32 DRAMs Configurations (Sheet 1 of 2)
Maximum System Capacity
4
PKG Type (Die bits per Ch x PKG bits)
2
Die Density PKG Density Rank Per PKGs
8 GB DDP 16x32 8 Gb 16 Gb 1
16 GB QDP 16x32 8 Gb 32 Gb 2
32 GB ODP 8x32(Byte mode) 8 Gb 64 Gb 2
16 GB DDP 16x32 16 Gb 32 Gb 1
32 GB QDP 16x32 16 Gb 64 Gb 2
64 GB
5
ODP 8x32(Byte mode) 16 Gb 128 Gb 2
90 Datasheet, Volume 1 of 2
5.1.4 System Memory Timing Support
The IMC supports the following DDR Speed Bin, CAS Write Latency (CWL), and
command signal mode timings on the main memory interface:
• tCL = CAS Latency
• tRCD = Activate Command to READ or WRITE Command delay
• tRP = PRECHARGE Command Period
• tRPb = per-bank PRECHARGE time
• tRPab = all-bank PRECHARGE time
• CWL = CAS Write Latency
• Command Signal modes:
— 2N indicates a new DDR4/LPDDR4x command may be issued every 2 clocks
— 1N indicates a new DDR4/LPDDR4x command may be issued every clock.
5.1.5 System Memory Timing Support
Notes:
1. x32 BGA devices are 200 balls
2. QDP = Quad Die Package, ODP-Octal Die Package
3. Each LPDDR4x channel include two sub-channels
4. Maximum system capacity refers to system with all 8 sub-channels populated
5. Pending DRAM samples availability.
Table 5-10. Supported LPDDR4x x64 DRAMs Configurations
Maximum
System
Capacity
4
PKG
Type
(Die bits per
Ch x PKG
bits)
2
Die
Density
Ball Count
Per PKG
PKG
Density
DRAM
Channels
Per PKGs
Processor
Line
Rank
Per
PKGs
8 GB QDP 16x64 8 Gb 432 32 Gb 4 UP3/UP4 1
16 GB ODP 16x64 8 Gb 432 64 Gb 4 UP3/UP4 2
16 GB QDP 16x64 16 Gb 432 64 Gb 4 UP3/UP4 1
8 GB
QDP 16x64 8 Gb 556 32 Gb 4 UP4 1
16 GB
ODP 16x64 8 Gb 556 64 Gb 4 UP4 2
16 GB
1
QDP 16x64 16 Gb 556 64 Gb 4 UP4 1
Notes:
1. Maximum system capacity refers to system with all 8 sub-channels populated
2. QDP = Quad Die Package, ODP-Octal Die Package
3. Each LPDDR4x channel include two sub-channels
Table 5-9. Supported LPDDR4x x32 DRAMs Configurations (Sheet 2 of 2)
Maximum System Capacity
4
PKG Type (Die bits per Ch x PKG bits)
2
Die Density PKG Density Rank Per PKGs
Table 5-11. DDR4 System Memory Timing Support
DRAM Device
Transfer Rate
(MT/s)
tCL (tCK) tRCD (ns) tRP (ns) CWL (tCK) DPC
CMD
Mode
DDR4 3200 22 13.75 13.75
9-12,
14,16,18,20
2 2N
Datasheet, Volume 1 of 2 91
5.1.6 SAGV Points
SAGV (System Agent Geyserville) is a way by which they SoC can dynamically scale the
work point (V/F), by applying DVFS (Dynamic Voltage Frequency Scaling) based on
memory bandwidth utilization and/or the latency requirement of the various workloads
for better energy efficiency at System-Agent. Pcode heuristics are in charge of
providing request for Qclock work points by periodically evaluating the utilization of the
memory and IA stalls.
11th Generation Intel
®
Core™ processor adds support for a 4
th
point for SAGV. A 4
th
GV point allows Pcode to select a more optimal frequency so that SA and Qclk region
are operating at a lower voltage/frequency but still providing the required BW.
5.1.7 Memory Controller (MC)
The integrated memory controller is responsible of transferring data between the
processor and the DRAM as well as the DRAM maintenance. In this, there are two
instances of MC, one per memory slice. Each controller is capable of supporting up to
four channels of LPDDR4x and one channel of DDR4.
The two controllers are independent and have no means of communicating with each
other, so they need to be configured separately.
In a symmetric memory population, each controller only view half of the total physical
memory address space.
Table 5-12. LPDDR4x System Memory Timing Support
DRAM
Device
Transfer Rate (MT/s) tCL (tCK) tRCD (ns) tRPpb (ns) tRPab (ns)
WL (tCK)
Set B
LPDDR4x 4266 36 18 18 21 34
Table 5-13. System Agent Enhanced Speed Steps (SA-GV) and Gear Mode Frequencies
Processor
Line
Technology
DDR Maximum
Rate [MT/s]
SAGV-LowBW SAGV-MedBW SAGV-HighBW
SAGV- High
Performance
H
DDR4 3200 2133, G2 2133, G2 3200, G2 2933, G1
UP3 DDR4 3200 2133, G2 2133, G2 3200, G2 2666, G1
UP3 LPDDR4x 4266 2133, G2 3200, G2 4266, G2 2666, G1
UP4 LPDDR4x 4266 2133, G2 3200, G2 4266, G2 4266, G2
Notes:
1. 11
th
Generation Intel
®
Core™ Processor supports dynamic gearing technology where the Memory Controller can run at 1:1
(Gear-1, Legacy mode) or 1:2 (Gear-2 mode) ratio of DRAM speed. The gear ratio is the ratio of DRAM speed to Memory
Controller Clock.
MC Channel Width equal to DDR Channel width multiply by Gear Ratio
2. SA-GV operating points
a. LowBW- Low frequency point, Minimum Power point. Characterized by low power, low BW, high latency. The
system will stay at this point during low to moderate BW consumption.
b. MedBW - this point is tuned for balance between power & performance (BW demand) Characterized by moderate
power and latency, moderate BW. Only during IA performance workloads, the system will to switch to this point and
only in case this point can provide enough BW
c. HighBW Maximum Bandwidths Point, minimum memory latency point, Characterized by high power, low latency
and high BW. This point intended for high GT and moderate-high IA BW
d. High Performance - Lowest Latency point, low BW and highest power
3. Refer to Section 3.4, “System Agent Enhanced Intel
SpeedStep® Technology”
for more details
92 Datasheet, Volume 1 of 2
Both MC support only one technology in a system DDR4, LPDDR4x mix of technologies
in one system is not allowed.
5.1.8 System Memory Controller Organization Mode (DDR4)
The IMC supports two memory organization modes, single-channel and dual-channel.
Depending upon how the DDR Schema and DIMM Modules are populated in each
memory channel, a number of different configurations can exist.
Single-Channel Mode
In this mode, all memory cycles are directed to a single channel. Single-Channel mode
is used when either the Channel A or Channel B DIMM connectors are populated in any
order, but not both.
Dual-Channel Mode – Intel
®
Flex Memory Technology Mode
The IMC supports Intel
®
Flex Memory Technology Mode. Memory is divided into a
symmetric and asymmetric zone. The symmetric zone starts at the lowest address in
each channel and is contiguous until the asymmetric zone begins or until the top
address of the channel with the smaller capacity is reached. In this mode, the system
runs with one zone of dual-channel mode and one zone of single-channel mode,
simultaneously, across the whole memory array.
Note: Channels A and B can be mapped for physical channel 0 and 1 respectively or vice
versa; however, channel A size should be greater or equal to channel B size.
Figure 5-1. Intel
®
DDR4 Flex Memory Technology Operations
MC BMC A
B B
C
B
B
C
Non interleaved
access
Dual channel
interleaved access
TOM
MC A and MC B can be configured to be physical channels 0 or 1
B – The largest physical mem ory am ount of the sm aller size mem ory module
C – The remaining physical memory amount of the larger size memory m odule
Datasheet, Volume 1 of 2 93
Dual-Channel Symmetric Mode (Interleaved Mode)
Dual-Channel Symmetric mode, also known as interleaved mode, provides maximum
performance on real world applications. Addresses are ping-ponged between the
channels after each cache line (64-byte boundary). If there are two requests, and the
second request is to an address on the opposite channel from the first, that request can
be sent before data from the first request has returned. If two consecutive cache lines
are requested, both may be retrieved simultaneously, since they are ensured to be on
opposite channels. Use Dual-Channel Symmetric mode when both Channel A and
Channel B DIMM connectors are populated in any order, with the total amount of
memory in each channel being the same.
When both channels are populated with the same memory capacity and the boundary
between the dual channel zone and the single channel zone is the top of memory, IMC
operates completely in Dual-Channel Symmetric mode.
Notes:
1. The DRAM device technology and width may vary from one channel to another.
Different memory size between channels are relevant to DDR4 only.
5.1.9 System Memory Frequency
In all modes, the frequency of system memory is the lowest frequency of all memory
modules placed in the system, as determined through the SPD registers on the
memory modules. The system memory controller supports a single DIMM connector per
channel. If DIMMs with different latency are populated across the channels, the BIOS
will use the slower of the two latencies for both channels. For Dual-Channel modes,
both channels should have a DIMM connector populated. For Single-Channel mode,
only a single channel can have a DIMM connector populated.
5.1.10 Technology Enhancements of Intel
®
Fast Memory Access
(Intel
®
FMA)
The following sections describe the Just-in-Time Scheduling, Command Overlap, and
Out-of-Order Scheduling Intel FMA technology enhancements.
Just-in-Time Command Scheduling
The memory controller has an advanced command scheduler where all pending
requests are examined simultaneously to determine the most efficient request to be
issued next. The most efficient request is picked from all pending requests and issued
to system memory Just-in-Time to make optimal use of Command Overlapping. Thus,
instead of having all memory access requests go individually through an arbitration
mechanism forcing requests to be executed one at a time, they can be started without
interfering with the current request allowing for concurrent issuing of requests. This
allows for optimized bandwidth and reduced latency while maintaining appropriate
command spacing to meet system memory protocol.
Command Overlap
Command Overlap allows the insertion of the DRAM commands between the Activate,
Pre-charge, and Read/Write commands normally used, as long as the inserted
commands do not affect the currently executing command. Multiple commands can be
issued in an overlapping manner, increasing the efficiency of system memory protocol.
94 Datasheet, Volume 1 of 2
Out-of-Order Scheduling
While leveraging the Just-in-Time Scheduling and Command Overlap enhancements,
the IMC continuously monitors pending requests to system memory for the best use of
bandwidth and reduction of latency. If there are multiple requests to the same open
page, these requests would be launched in a back to back manner to make optimum
use of the open memory page. This ability to reorder requests on the fly allows the IMC
to further reduce latency and increase bandwidth efficiency.
5.1.11 Data Scrambling
The system memory controller incorporates a Data Scrambling feature to minimize the
impact of excessive di/dt on the platform system memory VRs due to successive 1 s
and 0 s on the data bus. Past experience has demonstrated that traffic on the data bus
is not random and can have energy concentrated at specific spectral harmonics
creating high di/dt which is generally limited by data patterns that excite resonance
between the package inductance and on die capacitances. As a result, the system
memory controller uses a data scrambling feature to create pseudo-random patterns
on the system memory data bus to reduce the impact of any excessive di/dt.
5.1.12 ECC DDR4 H-Matrix Syndrome Codes
Table 5-14. ECC H-Matrix Syndrome Codes
Syndrome
Value
Flipped
Bit
Syndrome
Value
Flipped Bit
Syndrome
Value
Flipped Bit
Syndrome
Value
Flipped Bit
0 No Error
1 64 37 26 81 2 146 53
2 65 38 46 82 18 148 4
4 66 41 61 84 34 152 20
7 60 42 9 88 50 161 49
8 67 44 16 97 21 162 1
11 36 47 23 98 38 164 17
13 27 49 63 100 54 168 33
14 3 50 47 104 5 176 44
16 68 52 14 112 52 193 8
19 55 56 30 128 71 194 24
21 10 64 70 131 22 196 40
22 29 67 6 133 58 200 56
25 45 69 42 134 13 208 19
26 57 70 62 137 28 224 11
28 0 73 12 138 41 241 7
31 15 74 25 140 48 242 31
32 69 76 32 143 43 244 59
35 39 79 51 145 37 248 35
Notes:
1. All other syndrome values indicate unrecoverable error (more than one error).
2. This table is relevant only for H-Processor ECC supported SKUs.
Datasheet, Volume 1 of 2 95
5.1.13 Data Swapping
By default, the processor supports on-board data swapping in two manners (for all
segments and DRAM technologies):
• Bit swapping is allowed within each Byte for all DDR technologies.
• LPDDR4x: Byte swapping is allowed within each x16 sub channel.
• LPDDR4x: Upper/Lower four x16 sub channels to be connected to x64 DRAM or
two x32 DRAMs. Swapping between four upper to four lower x16 sub channels is
not allowed.
• DDR4: Byte swapping is allowed within each x64 channel.
• ECC bits swap is allowed within DDR4 ECC[7...0].
5.1.14 DDR I/O Interleaving
Note: The processor supports I/O interleaving, which has the ability to swap DDR bytes for
routing considerations. BIOS configures the I/O interleaving mode before DDR training.
UP4/ UP3-Processor line packages are optimized only for Non-Interleaving mode (NIL).
There are two supported modes:
• Interleave (IL)
• Non-Interleave (NIL)
The following table and figure describe the pin mapping between the IL and NIL modes.
Table 5-15. Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping
Notes: UP4-processor line supports NIL only.
IL (DDR4) NIL (DDR4) NIL (LPDDR4x)
Channel Byte Channel Byte Sub Channel Byte
DDR0 Byte0 DDR0 Byte0 DDR7 Byte1
DDR0 Byte1 DDR0 Byte2 DDR6 Byte0
DDR0 Byte2 DDR0 Byte4 DDR7 Byte1
DDR0 Byte3 DDR0 Byte6 DDR6 Byte0
DDR0 Byte4 DDR1 Byte0 DDR5 Byte1
DDR0 Byte5 DDR1 Byte2 DDR4 Byte0
DDR0 Byte6 DDR1 Byte4 DDR5 Byte1
DDR0 Byte7 DDR1 Byte6 DDR4 Byte0
DDR1 Byte0 DDR0 Byte1 DDR3 Byte1
DDR1 Byte1 DDR0 Byte3 DDR2 Byte0
DDR1 Byte2 DDR0 Byte5 DDR3 Byte1
DDR1 Byte3 DDR0 Byte7 DDR2 Byte0
DDR1 Byte4 DDR1 Byte1 DDR1 Byte1
DDR1 Byte5 DDR1 Byte3 DDR0 Byte0
DDR1 Byte6 DDR1 Byte5 DDR1 Byte1
DDR1 Byte7 DDR1 Byte7 DDR0 Byte0
96 Datasheet, Volume 1 of 2
5.1.15 DRAM Clock Generation
Each support rank has a differential clock pair for DDR4. Each sub-channel has a
differential clock pair for LPDDR4x.
5.1.16 DRAM Reference Voltage Generation
Read Vref is generated by the memory controller in all technologies. Write Vref is
generated by the DRAM in all technologies. Command Vref is generated by the DRAM in
LPDDR4x while the memory controller generates VrefCA per DIMM for DDR4. In all
cases, it has small step sizes and is trained by MRC.
5.1.17 Data Swizzling
All Processor Lines does not have die-to-package DDR swizzling.
5.2 Integrated Memory Controller (IMC) Power
Management
The main memory is power managed during normal operation and in low-power ACPI
C-states.
5.2.1 Disabling Unused System Memory Outputs
Any system memory (SM) interface signal that goes to a memory in which it is not
connected to any actual memory devices (such as SoDIMM connector is unpopulated,
or is single-sided) is tri-stated. The benefits of disabling unused SM signals are:
• Reduced power consumption.
Figure 5-2. DDR4 Interleave (IL) and Non-Interleave (NIL) Modes Mapping
Datasheet, Volume 1 of 2 97
• Reduced possible overshoot/undershoot signal quality issues seen by the processor
I/O buffer receivers caused by reflections from potentially unterminated
transmission lines.
When a given rank is not populated, the corresponding control signals (CLK_P/CLK_N/
CKE/ODT/CS) are not driven.
At reset, all rows should be assumed to be populated, until it can be proven that they
are not populated. This is due to the fact that when CKE is tri-stated with a DRAMs
present, the DRAMs are not ensured to maintain data integrity. CKE tri-state should be
enabled by BIOS where appropriate, since at reset all rows should be assumed to be
populated.
5.2.2 DRAM Power Management and Initialization
The processor implements extensive support for power management on the memory
interface. Each channel drives 4 CKE pins, one per rank.
The CKE is one of the power-saving means. When CKE is off, the internal DDR clock is
disabled and the DDR power is reduced. The power-saving differs according to the
selected mode and the DDR type used. For more information, refer to the IDD table in
the DDR specification.
The processor supports three different types of power-down modes in package C0
state. The different power-down modes can be enabled through configuring PM PDWN
config register. The type of CKE power-down can be configured through PDWN_mode
(bits 15:12) and the idle timer can be configured through PDWN_idle_counter (bits
11:0).
The different power-down modes supported are:
• No Power-down (CKE disable)
• Active Power-down (APD): This mode is entered if there are open pages when
de-asserting CKE. In this mode the open pages are retained. Power-saving in this
mode is the lowest. Power consumption of DDR is defined by IDD3P. Exiting this
mode is fined by tXP – a small number of cycles.
• Pre-charged Power-down (PPD): This mode is entered if all banks in DDR are
pre-charged when de-asserting CKE. Power-saving in this mode is intermediate –
better than APD. Power consumption is defined by IDD2P. Exiting this mode is
defined by tXP. The difference from APD mode is that when waking-up, all page-
buffers are empty.)
The CKE is determined per rank, whenever it is inactive. Each rank has an idle counter.
The idle-counter starts counting as soon as the rank has no accesses, and if it expires,
the rank may enter power-down while no new transactions to the rank arrive to
queues. The idle-counter begins counting at the last incoming transaction arrival. It is
important to understand that since the power-down decision is per rank, the IMC can
find many opportunities to power down ranks, even while running memory intensive
applications; the savings are significant (may be few Watts, according to DDR
specification). This is significant when each channel is populated with more ranks.
Selection of power modes should be according to power-performance or a thermal
trade-off of a given system:
• When trying to achieve maximum performance and power or thermal consideration
is not an issue: use no power-down
98 Datasheet, Volume 1 of 2
• In a system which tries to minimize power-consumption, try using the deepest
power-down mode possible
• In high-performance systems with dense packaging (that is, tricky thermal design)
the power-down mode should be considered in order to reduce the heating and
avoid DDR throttling caused by the heating.
The idle timer expiration count defines the # of DCLKs that a rank is idle that causes
entry to the selected power mode. As this timer is set to a shorter time the IMC will
have more opportunities to put the DDR in power-down. There is no BIOS hook to set
this register. Customers choosing to change the value of this register can do it by
changing it in the BIOS. For experiments, this register can be modified in real time if
BIOS does not lock the IMC registers.
5.2.2.1 Initialization Role of CKE
During power-up, CKE is the only input to the SDRAM that has its level recognized
(other than the reset pin) once power is applied. It should be driven LOW by the DDR
controller to make sure the SDRAM components float DQ and DQS during power-up.
CKE signals remain LOW (while any reset is active) until the BIOS writes to a
configuration register. Using this method, CKE is ensured to remain inactive for much
longer than the specified 200 microseconds after power and clocks to SDRAM devices
are stable.
5.2.2.2 Conditional Self-Refresh
During S0 idle state, system memory may be conditionally placed into self-refresh state
when the processor is in package C3 or deeper power state. Refer Section 3.3.1.1,
“Intel
® Rapid Memory Power Management (Intel® RMPM)”
for more details on conditional self-
refresh with Intel HD Graphics enabled.
When entering the S0 conditional self-refresh, the processor IA core flushes pending
cycles and then enters SDRAM ranks that are not used by the processor graphics into
self-refresh. The CKE signals remain LOW so the SDRAM devices perform self-refresh.
The target behavior is to enter self-refresh for package C3 or deeper power states as
long as there are no memory requests to service.
5.2.2.3 Dynamic Power-Down
Dynamic power-down of memory is employed during normal operation. Based on idle
conditions, a given memory rank may be powered down. The IMC implements
aggressive CKE control to dynamically put the DRAM devices in a power-down state.
The processor IA core controller can be configured to put the devices in active power
down (CKE de-assertion with open pages) or pre-charge power-down (CKE de-
assertion with all pages closed). Pre-charge power-down provides greater power
savings but has a bigger performance impact, since all pages will first be closed before
putting the devices in power-down mode.
If dynamic power-down is enabled, all ranks are powered up before doing a refresh
cycle and all ranks are powered down at the end of the refresh.
Datasheet, Volume 1 of 2 99
5.2.2.4 DRAM I/O Power Management
Unused signals should be disabled to save power and reduce electromagnetic
interference. This includes all signals associated with an unused memory channel.
Clocks, CKE, ODT, and CS signals are controlled per DIMM rank and will be powered
down for unused ranks.
The I/O buffer for an unused signal should be tri-stated (output driver disabled), the
input receiver (differential sense-amp) should be disabled. The input path should be
gated to prevent spurious results due to noise on the unused signals (typically handled
automatically when input receiver is disabled).
5.2.3 DDR Electrical Power Gating
The DDR I/O of the processor supports Electrical Power Gating (DDR-EPG) while the
processor is at C3 or deeper power state.
In C3 or deeper power state, the processor internally gates VDDQ and VDD2 for the
majority of the logic to reduce idle power while keeping all critical DDR pins such as
CKE and VREF in the appropriate state.
In C7 or deeper power state, the processor internally gates V
CCSA for all non-critical
state to reduce idle power.
In C-state transitions, the DDR does not go through training mode and will restore the
previous training information.
5.2.4 Power Training
BIOS MRC performing Power Training steps to reduce DDR I/O power while keeping
reasonable operational margins still guaranteeing platform operation. The algorithms
attempt to weaken ODT, driver strength and the related buffers parameters both on the
MC and the DRAM side and find the best possible trade-off between the total I/O power
and the operating margins using advanced mathematical models.
§ §
100 Datasheet, Volume 1 of 2
6 USB-C* Sub System
USB-C* is a cable and connector specification defined by USB-IF.
The USB-C sub-system supports all processor lines DPoC (DisplayPort over Type-C)
protocols. The USB-C sub-system can also support be configured as native DisplayPort
or HDMI v2.0b interfaces, for more information refer to Chapter 10, “Display”.
Thunderbolt™ 4 is a USB-C solution brand which requires the following elements:
• USB2, USB3 (10 Gbps), USB3/DP implemented at the connector.
• In additional, it requires USB4 implemented up to 40 Gbps, including Thunderbolt™
3 compatibility as defined by USB4/USB-PD specs and 15 W of bus power
• Thunderbolt™ 4 solutions use (and prioritize) the USB4 PD entry mode (while still
supporting Thunderbolt™ 3 alt mode)
• This product has the ability to support these requirements
Note: If USB4 (20 Gbps) only solutions are implemented, Thunderbolt™ 3 compatibility as
defined by USB4/USB-PD specs and 15 W of bus power are still recommended
Note: USB-C sub-system support 2x USB 4 routers, each router can support up to two Type-
C ports.
Figure 6-1. USB-C* Sub-system Block Diagram
Datasheet, Volume 1 of 2 101
6.1 USB-C Sub-System General Capabilities
• xHCI (USB 3 host controller) and xDCI (USB 3 device controller) implemented in
the processor in addition to the controllers in the PCH.
• No support for USB Type-A on the processor side.
• Intel
®
AMT/vPro over Thunderbolt™ docking.
• Support power saving when USB-C* disconnected.
• Support up to four simultaneous ports.
• DbC Enhancement for Low Power Debug until Pkg C6
• Host
— Aggregate BW through the controller at least 3 GB/s, direct connection or over
USB 4.
— Wake capable on each host port from S0i3, Sx: Wake on Connects,
Disconnects, Device Wake.
• Device
— Aggregate BW through xHCI controller of at least 3 GB/s
— D0i2 and D0i3 power gating
— Wake capable on host initiated wakes when the system is in S0i3, Sx Available
on all ports
• Port Routing Control for Dual Role Capability
— Needs to support SW/FW and ID pin based control to detect host versus device
attach
— SW mode requires PD controller or other FW to control
• USB-R device to host controller connection is over UTMI+ links.
Table 6-1. USB-C* Port Configuration
Port Group Port UP4- Processor Line UP3- Processor Line H - Processor Line
Group A TCP 0 USB 4
4
USB 3
3
DisplayPort
1
HDMI
2
USB 4
4
USB 3
3
DisplayPort
1
HDMI
2
USB 4
4
USB 3
3
DisplayPort
1
HDMI
2
TCP 1
Group B TCP 2
TCP 3 N/A
Notes:
1. Supported on Type-C or Native connector
2. HDMI v2.0b is supported only on Native connector.
3. USB 3 supported link rates:
a. USB 3 Gen 1x1 (5 Gbps)
b. USB 3 Gen 2x1 (10 Gbps)
4. USB4 operating link rates (including both rounded and non-rounded modes for Thunderbolt™ 3 compatibility):
a. USB 4 Gen 2x2 (20 Gbps)
b. USB 4 Gen 3x2 (40 Gbps)
c. 10.3125 Gbps, 20.625 Gbps - Compatible to Thunderbolt™ 3 non-rounded modes.
5. USB 2 interface supported over Type-C connector, sourced from PCH.
6. USB Type-A connector is not supported.
7. Port group is defined as two ports sharing the same USB4 router, each router supports up to two display interfaces.
8. Display interface can be connected directly to a DP/HDMI/Type-C port or thru USB 4 router (Tunneled) on a Type-C
connector.
9. If two ports in the same group are configured to one as USB4 and the other as DP/HDMI fixed connection each port will
support single display interface.
102 Datasheet, Volume 1 of 2
6.2 USB™ 4 Router
USB4 is a Standard architecture (formerly known as CIO), but with the addition of
USB3 (10G) tunneling, and rounded frequencies. USB4 adds a new USB4 PD entry
mode, but fully documents mode entry, and negotiation elements of Thunderbolt™ 3.
USB4 architecture (formerly known as Thunderbolt™ 3 protocol) is a transformational
high-speed, dual protocol I/O, and it provides flexibility and simplicity by encapsulating
both data (PCIe* and USB3) and video
(DisplayPort*) on a single cable connection that can daisy-chain up to six devices.
USB4/Thunderbolt™ controllers act as a point of entry or a point of exit in the USB4
domain. The USB4 domain is built as a daisy chain of USB4/Thunderbolt™ enabled
products for the encapsulated protocols - PCIe, USB3 and DisplayPort. These protocols
are encapsulated into the USB4 fabric and can be tunneled across the domain.
USB4 controllers can be implemented in various systems such as PCs, laptops and
tablets, or devices such as storage, docks, displays, home entertainment, cameras,
computer peripherals, high end video editing systems, and any other PCIe based device
that can be used to extend system capabilities outside of the system's box.
The integrated connection maximum data rate is 20.625 Gbps per lane but supports
also 20.0 Gbps, 10.3125 Gbps, and 10.0 Gbps and is compatible with older
Thunderbolt™ device speeds.
6.2.1 USB 4 Host Router Implementation Capabilities
The integrated USB-C sub-system implements the following interfaces via USB 4:
• Two DisplayPort* sink interfaces each one capable of:
Table 6-2. USB-C* Lanes Configuration
Lane1 Lane2 Comments
USB 4 USB 4 Both lanes operate at Gen 2 (10G) or Gen 3 (20G) and also support non-
rounded frequencies (10.3125G / 20.625G) for TBT3 compatibility.
USB3 No connect Any combination of
• USB3.2 Gen 1x1 (5 Gbps)
• USB3.2 Gen 2x1 (10 Gbps)
No connect USB3
USB3 DPx2
Any of HBR3/HBR2/HBR1/RBR for DP and USB3.2 (10 Gbps)
DPx2 USB3
DPx4 Both lanes at the same DP rate - no support for 2x DPx2 USB-C connector
Table 6-3. USB-C* Non-Supported Lane Configuration
Lane1 Lane2 Comments
# PCIe* Gen3/2/1
No PCIe* native support
PCIe* Gen3/2/1 #
# USB4
No support for USB4 with any other protocol
USB4 #
USB3 USB3 No support for Multi-lane USB3
Datasheet, Volume 1 of 2 103
— DisplayPort 1.4 specification for tunneling
— 1.62 Gbps or 2.7 Gbps or 5.4 Gbps or 8.1 Gbps link rates
— x1, x2 or x4 lane operation
— Support for DSC compression
• Two PCI Express* Root Port interfaces each one capable of:
— PCI Express* 3.0 x4 compliant @ 8.0 GT/s
• Two xHCI Port interfaces each one capable of:
— USB 3.2 Gen2x1 (10 Gbps)
• USB 4 Host Interface:
— PCI Express* 3.0 x4 compliant endpoint
— Supports simultaneous transmit and receive on 12 paths
— Raw mode and frame mode operation configurable on a per-path basis
— MSI and MSI-X support
— Interrupt moderation support
• USB 4 Time Management Unit (TMU):
• Two Interfaces to USB-C* connectors, each one supports:
— USB4 PD entry mode, as well as TBT 3 compatibility mode, each supporting:
• 20 paths per port
• Each port support 20.625/20.0 Gbps or 10.3125/10.0 Gbps link rates.
• 16 counters per port
6.3 USB-C Sub-system xHCI/xDCI Controllers
The processor supports xHCI/xDCI controllers. The native USB 3 path proceeds from
the memory directly to PHY.
6.3.1 USB 3 Controllers
6.3.1.1 Extensible Host Controller Interface (xHCI)
Extensible Host Controller Interface (xHCI) is an interface specification that defines
Host Controller for a universal Serial Bus (USB 3), which is capable of interfacing with
USB 1.x, 2.0, and 3.x compatible devices.
In case that a device (example, USB3 mouse) was connected to the computer, the
computer will work as Host and the xHCI will be activated inside the CPU.
The xHCI controller support link rate of up to USB 3.2 Gen 2x1 (10G).
6.3.1.2 Extensible Device Controller Interface (xDCI)
Extensible Device Controller Interface (xDCI) is an interface specification that defines
Device Controller for a universal Serial Bus (USB 3), which is capable of interfacing with
USB 1.x, 2.0, and 3.x compatible devices.
104 Datasheet, Volume 1 of 2
In case that the computer is connected as a device (example, tablet connected to
desktop) to another computer then the xDCI controller will be activated inside the
device and will talk to the Host at the other computer.
The xDCI controller support link rate of up to USB 3.2 Gen 1x1 (5G).
Notes: These controllers are instantiated in the processor die as a separate PCI function
functionality for the USB-C* capable ports.
6.3.2 USB-C Sub-System PCIe Interface
6.4 USB-C Sub-System Display Interface
Refer Chapter 10, “Display”
§ §
Table 6-4. PCIe via USB4 Configuration
USB4 IPs USB4_PCIe UP4 USB-C* Ports UP3 USB-C* Ports H USB-C* Ports
USB4_DMA0
USB4_PCIE0 TCP0 TCP0 TCP0
USB4_PCIE1 TCP1 TCP1 TCP1
USB4_DMA1
USB4_PCIE2 TCP2 TCP2 TCP2
USB4_PCIE3 N/A TCP3 TCP3
Datasheet, Volume 1 of 2 105
7 PCIe* Interface
7.1 Processor PCI Express* Interface
This section describes the PCI Express* interface capabilities of the processor. Refer to
PCI Express Base* Specification 4.0 for details on PCI Express*.
7.1.1 PCI Express* Support
The UP4/UP3 processor PCI Express* interface a single 4-lane (x4) port. The
interconnect between the UP4/UP3 processor and NVMe* storage provided through an
M.2 connector (HotPlug is not supported for UP3/UP4 M.2 connector). In addition, it will
support graphics PCIe Gen4 devices too.
The H processor PCI Express* has two interfaces:
• 4-lane (x4) port, traditionally used for an interconnect to NVMe* storage through
an M.2 connector.
• 16-lane (x16) port that can also be configured as multiple ports at narrower widths.
Traditionally used for an interconnect to graphics PCIe Gen4 devices through device
down. dGPU support through the use of CEM form factor is supported on H-
processor DT only. x16 bifurcated can also be used to interface NVMe* storage
devices through an M.2 connector.
The UP4/UP3/H processor X4 port supports the configurations shown in the following
table:
The H processor X16 port supports the configurations shown in the following table:
Table 7-1. PCI Express* 4 -lane Bifurcation and Lane Reversal Mapping
Bifurcation
Link Width CFG Signals Lanes
0:6:0 CFG [14] 0 1 2 3
PCIe Controller PCIe 060
1x4 x4 1 0 1 2 3
1x4 Reversed x4 0 3 2 1 0
Note: PCIe 060 is a single x4 port without bifurcation capabilities, thus bifurcation pin straps are not
applicable
Table 7-2. PCI Express* 16-lane Bifurcation and Lane Reversal Mapping
Bifurcation
Link Width CFG Signals Lanes
0:1:0 0:1:1 0:1:2 CFG
[6]
CFG
[5]
CFG
[2]
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
PCIe Controller
PCIe 010
1x16 x16 N/A N/A
1 1 1
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
1x16
Reversed
x16 N/A N/A
1 1 0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
PCIe Controller
PCIe 010 PCIe 011
106 Datasheet, Volume 1 of 2
The processor supports the following:
• Hierarchical PCI-compliant configuration mechanism for downstream devices.
• Traditional PCI style traffic (asynchronous snooped, PCI ordering).
• PCI Express* extended configuration space. The first 256 bytes of configuration
space aliases directly to the PCI Compatibility configuration space. The remaining
portion of the fixed 4 KB block of memory-mapped space above that (starting at
100h) is known as extended configuration space.
• PCI Express* Enhanced Access Mechanism. Accessing the device configuration
space in a flat memory-mapped fashion.
• Automatic discovery, negotiation, and training of link out of reset.
• Multiple Virtual Channel.
• 64-bit downstream address format, but the processor never generates an address
above 512 GB (Bits 63:39 will always be zeros).
• 64-bit upstream address format, but the processor responds to upstream read
transactions to addresses above 512 GB (addresses where any of Bits 63:39 are
nonzero) with an Unsupported Request response. Upstream write transactions to
addresses above 512 GB will be dropped.
• Re-issues Configuration cycles that have been previously completed with the
Configuration Retry status.
• PCI Express* reference clock is a 100 MHz differential clock.
• Power Management Event (PME) functions.
• Dynamic width capability.
2x8 x8 x8 N/A
1 0 1
0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7
PCIe Controller
PCIe 011 PCIe 010
2x8
Reversed
x8 x8 N/A
1 0 0
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
PCIe Controller
PCIe 010 PCIe 011 PCIe 012
1x8+2x4 x8 x4 x4
0 0 1
0 1 2 3 4 5 6 7 0 1 2 3 0 1 2 3
PCIe Controller
PCIe 012 PCIe 011 PCIe 010
1x8+2x4
Reversed
x8 x4 x4
0 0 0
3 2 1 0 3 2 1 0 7 6 5 4 3 2 1 0
Notes:
1. For CFG bus details, refer to Section 6.4.
2. Support is also provided for narrow width and use devices with lower number of lanes (that is, usage on x4 configuration),
however further bifurcation is not supported.
3. In case that more than one device is connected, the device with the highest lane count, should always be connected to the
lower lanes, as follows:
— Connect lane 0 of 1
st
device to lane 0 (PCIe 010 controller).
— Connect lane 0 of 2
nd
device to lane 8 to (PCIe 011 controller).
— Connect lane 0 of 3
rd
device to lane 12 to i(PCIe 012 controller).
For example:
a. When using 1x8 + 2x4, the 8 lane device should use lanes 0:7.
b. When using 1x4 + 1x2, the 4 lane device should use lanes 0:3, and other 2 lanes device should use lanes 8:9.
c. When using 1x4 + 1x2 + 1x1, 4 lane device should use lanes 0:3, two lane device should use lanes 8:9, one lane
device should use lane 12.
4. For reversal lanes, for example: When using 1x8, the 8 lane device should use lanes 8:15, so lane 15 will be connected to
lane 0 of the Device.
Table 7-2. PCI Express* 16-lane Bifurcation and Lane Reversal Mapping
Bifurcation
Link Width CFG Signals Lanes
0:1:0 0:1:1 0:1:2 CFG
[6]
CFG
[5]
CFG
[2]
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Datasheet, Volume 1 of 2 107
• Message Signaled Interrupt (MSI and MSI-X) messages.
• Lane reversal
• Advanced Error Reporting (AER)
TC/VC Mapping - Allows mapping Traffic Classes to different internal virtual channels.
While default configuration may apply to most use cases, the use of certain Traffic Class
may impact performance. This capability should be enabled using the BIOS.
The following table summarizes the transfer rates and theoretical bandwidth of PCI
Express* link.
7.1.2 PCI Express* Lane Polarity Inversion
The PCI Express* Base Specification requires polarity inversion to be supported
independently by all receivers across a Link. Each differential pair within each Lane of a
PCIe* Link handles its own polarity inversion. Polarity inversion is applied, as needed,
during the initial training sequence of a Lane. In other words, a Lane will still function
correctly even if a positive (Tx+) signal from a transmitter is connected to the negative
(Rx-) signal of the receiver. Polarity inversion eliminates the need to untangle a trace
route to reverse a signal polarity difference within a differential pair and no special
configuration settings are necessary to enable it.
Note: The polarity inversion does not imply direction inversion or direction reversal; that is,
the Tx differential pair from one device must still connect to the Rx differential pair on
the receiving device, per the PCIe* Base Specification. Polarity Inversion is not the
same as “PCI Express* Controller Lane Reversal”.
7.1.3 PCI Express* Architecture
Compatibility with the PCI addressing model is maintained to ensure that all existing
applications and drivers operate unchanged.
The PCI Express* configuration uses standard mechanisms as defined in the PCI Plug-
and-Play specification. The processor PCI Express* port supports Gen 4 at 16 GT/s uses
a 128b/130b encoding.
The four lanes port can operate at 2.5 GT/s, 5 GT/s, 8 GT/s or 16 GT/s.
The PCI Express* architecture is specified in three layers – Transaction Layer, Data Link
Layer, and Physical Layer. Refer to the PCI Express Base Specification 4.0 for details of
PCI Express* architecture.
Table 7-3. PCI Express* Maximum Transfer Rates and Theoretical Bandwidth
PCI
Express*
Generation
Encoding
Maximum
Transfer Rate
[GT/s]
Theoretical Bandwidth [GB/s]
All processor lines
x4
H-processor
line
x8
H-processor
line
x16
Gen 1 8b/10b 2.5 1.0 2.0 4.0
Gen 2 8b/10b 5 2.0 4.0 8.0
Gen 3 128b/130b 8 3.9 7.9 15.8
Gen 4 128b/130b 16 7.9 15.8 31.5
Note: Theoretical BW is the Maximum BW during data streaming, without considering utilization factor and overheads.
108 Datasheet, Volume 1 of 2
7.1.4 PCI Express* Configuration Mechanism
The PCI Express* (external graphics) link is mapped through a PCI-to-PCI bridge
structure.
PCI Express* extends the configuration space to 4096 bytes per-device/function, as
compared to 256 bytes allowed by the conventional PCI specification. PCI Express*
configuration space is divided into a PCI-compatible region (that consists of the first
256 bytes of a logical device's configuration space) and an extended PCI Express*
region (that consists of the remaining configuration space). The PCI-compatible region
can be accessed using either the mechanisms defined in the PCI specification or using
the enhanced PCI Express* configuration access mechanism described in the PCI
Express* Enhanced Configuration Mechanism section. The PCI Express* Host Bridge is
required to translate the memory-mapped PCI Express* configuration space accesses
from the host processor to PCI Express* configuration cycles. To maintain compatibility
with PCI configuration addressing mechanisms, it is recommended that system
software access the enhanced configuration space using 32-bit operations (32-bit
aligned) only. Refer to the PCI Express Base Specification for details of both the PCI-
compatible and PCI Express* Enhanced configuration mechanisms and transaction
rules.
7.1.5 PCI Express* Equalization Methodology
Link equalization requires equalization for both TX and RX sides for the processor and
for the Endpoint device. Adjusting transmitter and receiver of the lanes is done to
improve signal reception quality and for improving link robustness and electrical
margin.The link timing margins and voltage margins are strongly dependent on
equalization of the link.
The processor supports the following:
• Full TX Equalization: Three Taps Linear Equalization (Pre, Current and Post
cursors), with FS/LF (Full Swing /Low Frequency) values.
• Full RX Equalization and acquisition for AGC (Adaptive Gain Control), CDR (Clock
and Data Recovery), adaptive DFE (decision feedback equalizer) and adaptive CTLE
peaking (continuous time linear equalizer).
• Full adaptive phase 3 EQ compliant with PCI Express* Gen 3 and Gen 4
specification.
Figure 7-1. PCI Express* Related Register Structures in the Processor
PCI-PCI Bridge
representing
root PCI
Express* ports
(Device 1)
PC I C om patible
Host Bridge
Device
(Device 0)
PCI
Express*
Device
PEG
DMI
Datasheet, Volume 1 of 2 109
7.1.6 PCI Express* Hot-Plug
All PCIe* Root Ports support Express Card 1.0 based hot - plug that performs the
following:
• Presence Detect and Link Active Changed Support
• Interrupt Generation Support
7.1.6.1 Presence Detection
When a module is plugged in and power is supplied, the physical layer will detect the
presence of the device, and the root port sets SLSTS.PDS and SLSTS.PDC. If
SLCTL.PDE and SLCTL.HPE are both set, the root port will also generate an interrupt.
When a module is removed (using the physical layer detection), the root port clears
SLSTS.PDS and sets SLSTS.PDC. If SLCTL.PDE and SLCTL.HPE are both set, the root
port will also generate an interrupt.
7.1.6.2 SMI/SCI Generation
Interrupts for power - management events are not supported on legacy operating
systems. To support power - management on non - PCI Express* aware operating
systems, power management events can be routed to generate SCI. To generate SCI,
MPC.HPCE must be set. When set, enabled hot - plug events will cause SMSCS.HPCS to
be set
Additionally, BIOS workaround for hot - plug can be supported by setting MPC.HPME.
When this bit is set, hot - plug events can cause SMI status bits in SMSCS to be set.
Supported hot - plug events and their corresponding SMSCS bit are:
• Presence Detect Changed – SMSCS.HPPDM
• Link Active State Changed – SMSCS.HPLAS
When any of these bits are set, SMI# will be generated. These bits are set regardless of
whether interrupts or SCI is enabled for hot - plug events. The SMI# may occur
concurrently with an interrupt or SCI
Notes:
• SMI is referred to Serial management Interfaces
• SLSTS - Slot Status
• SLCTL – Slot Control
§ §
110 Datasheet, Volume 1 of 2
8 Direct Media Interface (DMI)
and On Package Interface
(OPI)
8.1 Direct Media Interface (DMI)
Note: The DMI interface is only present in 2-Chip platform processors.
Direct Media Interface (DMI) connects the processor and the PCH.
Main characteristics:
• 8 lanes Gen 3 DMI support
• Reduced 4 lane DMI support
• DC coupling - no capacitors between the processor and the PCH
• PCH end-to-end lane reversal across the link
• Half-Swing support (low-power/low-voltage)
8.1.1 DMI Lane Reversal and Polarity Inversion
Note: Polarity Inversion and Lane Reversal on DMI Link are not allowed in S-Processor
segment. Lane reversal can only be allowed on the PCH side.
Figure 8-1. Example for DMI Lane Reversal Connection
Datasheet, Volume 1 of 2 111
8.1.2 DMI Error Flow
DMI can only generate SERR in response to errors; never SCI, SMI, MSI, PCI INT, or
GPE. Any DMI related SERR activity is associated with Device 0.
8.1.3 DMI Link Down
The DMI link going down is a fatal, unrecoverable error. If the DMI data link goes to
data link down, after the link was up, then the DMI link hangs the system by not
allowing the link to retrain to prevent data corruption. This link behavior is controlled by
the PCH.
Downstream transactions that had been successfully transmitted across the link prior
to the link going down may be processed as normal. No completions from downstream,
non-posted transactions are returned upstream over the DMI link after a link down
event.
8.2 On Package Interface (OPI)
8.2.1 OPI Support:
The processor communicates with the PCIe using an internal interconnect BUS named
OPI.
8.2.2 Functional description:
OPI supports either 4 GT/s or 2 GT/s data rates where 4GT/s is supported by UP3 and
2GT/s is supported by UP4. 4GT/s OPI operates at 0.95V and 2GT/s OPI operates at
0.85V.
§ §
Notes:
1. DMI Lane Reversal is supported only on PCH-H and not on the Processor.
2. L[7:0] - Processor and PCH DMI Controller Logical Lane Numbers.
3. P[7:0] - Processor and PCH DMI Package Pin Lane Numbers.
4. For reduced 4 lane reversal connection, CPU L0 - CPU P0 <-> PCH P3 - PCH L0 and CPU L3 - CPU P3 <->
PCH P0 - PCH L3. For further data, refer to PCH Datasheet
Figure 8-1. Example for DMI Lane Reversal Connection
112 Datasheet, Volume 1 of 2
9 Graphics
9.1 Processor Graphics
The processor graphics is based on X
e
graphics core architecture that enables
substantial gains in performance and lower-power consumption over prior generations.
X
e
architecture supports up to 96 Execution Units (EUs) depending on the processor
SKU.
The processor graphics architecture delivers high dynamic range of scaling to address
segments spanning low power to high power, increased performance per watt, support
for next generation of APIs.
X
e
scalable architecture is partitioned by usage domains
along Render/Geometry, Media, and Display. The architecture also delivers very low-
power video playback and next generation analytics and filters for imaging related
applications. The new Graphics Architecture includes 3D compute elements, Multi-
format HW assisted decode/encode pipeline, and Mid-Level Cache (MLC) for superior
high definition playback, video quality, and improved 3D performance and media.
9.1.1 Media Support (Intel
®
QuickSync and Clear Video
Technology HD)
X
e
implements multiple media video codecs in hardware as well as a rich set of image
processing algorithms.
Note: HEVC and VP9 support additional 10 bpc, YCbCr 4:2:2 or 4:4:4 profiles. Refer
additional detail support matrix.
9.1.1.1 Hardware Accelerated Video Decode
X
e
implements a high-performance and low-power HW acceleration for video decoding
operations for multiple video codecs.
The HW decode is exposed by the graphics driver using the following APIs:
• Direct3D* 9 Video API (DXVA2)
• Direct3D11 Video API
• Intel Media SDK
• MFT (Media Foundation Transform) filters.
• Intel VA API
X
e
supports full HW accelerated video decoding for AVC/VC1/MPEG2/HEVC/VP9/JPEG/
AV1.
Table 9-1. Hardware Accelerated Video Decoding (Sheet 1 of 2)
Codec Profile Level Maximum Resolution
MPEG2 Main
Main
High
1080p
Datasheet, Volume 1 of 2 113
Expected performance:
• More than 16 simultaneous decode streams @ 1080p.
Note: Actual performance depends on the processor SKU, content bit rate, and memory
frequency. Hardware decode for H264 SVC is not supported.
9.1.1.2 Hardware Accelerated Video Encode
Gen12 implements a low-power low-latency fixed function encoder and a high-quality
customizable encoder with hardware assisted motion estimation engine which supports
AVC, MPEG-2, HEVC, and VP9.
The HW encode is exposed by the graphics driver using the following APIs:
• Intel
®
Media SDK
• MFT (Media Foundation Transform) filters
X
e
supports full HW accelerated video encoding for AVC/HEVC/VP9/JPEG.
WMV9
Advanced
Main
Simple
L3
High
Simple
3840x3840
AVC/H264
High
Main
L5.2
4K
4:2:0 8 bit 4K@60
JPEG/MJPEG Baseline Unified level 16Kx16K
HEVC/H265
Main 12
Main 422 10
Main 422 12
Main 444
Main 444 10
Main 444 12
SCC main
SCC main 10
SCC main 444
SCC main 444 10
L6.2
5K@60
8K@60
VP9
0 (4:2:0 Chroma 8 bit)
1 (4:4:4 8 bit)
2 (4:2:0 Chroma 10/12 bit)
Unified level
4320p(8K)
16Kx4K
4:4:4 10 bit 5K@60
4:2:0 12 bit 8K@60
AV1
0 (4:2:0 8 bit)
0 (4:2:0 10 bit)
L3
4Kx2K (video)
16Kx16K (still picture)
Table 9-1. Hardware Accelerated Video Decoding (Sheet 2 of 2)
Codec Profile Level Maximum Resolution
Table 9-2. Hardware Accelerated Video Encode (Sheet 1 of 2)
Codec Profile Level Maximum Resolution
AVC/H264
High
Main
L5.1 2160p(4 K)
114 Datasheet, Volume 1 of 2
Note: Hardware encode for H264 SVC is not supported.
9.1.1.3 Hardware Accelerated Video Processing
There is hardware support for image processing functions such as De-interlacing, Film
cadence detection, Advanced Video Scaler (AVS), detail enhancement, image
stabilization, gamut compression, HD adaptive contrast enhancement, skin tone
enhancement, total color control, Chroma de-noise, SFC (Scalar and Format
Conversion), memory compression, Localized Adaptive Contrast Enhancement (LACE),
spatial de-noise, Out-Of-Loop De-blocking (from AVC decoder), 16 bpc support for de-
noise/de-mosaic.
The HW video processing is exposed by the graphics driver using the following APIs:
• Direct3D* 9 Video API (DXVA2).
• Direct3D* 11 Video API.
• Intel
®
Media SDK.
• MFT (Media Foundation Transform) filters.
• Intel
®
CUI SDK.
• Intel VA API
Note: Not all features are supported by all the above APIs. Refer to the relevant
documentation for more details.
9.1.1.4 Hardware Accelerated Transcoding
Transcoding is a combination of decode, video processing (optional) and encode. Using
the above hardware capabilities can accomplish a high-performance transcode pipeline.
There is not a dedicated API for transcoding.
The processor graphics supports the following transcoding features:
• High performance high quality flexible encoder for video editing, video archiving.
• Low-power low latency encoder for video conferencing, wireless display, and game
streaming.
• Lossless memory compression for media engine to reduce media power.
• High-quality Advanced Video Scaler (AVS)
JPEG Baseline — 16 Kx16 K
HEVC/H265
Main
Main10
Main 4:2:2 10
Main 4:4:4
Main 4:4:4 10
L5.1
4320p(8 K)
16 Kx4 K @higher freq
VP9
0 (4:2:0 Chroma 8 bit)
1 (partial: 4:4:4 8 bit)
2 (partial: 4:2:0 10 bit)
3 (partial: 4:4:4 10 bit)
—
4320p(8 K)
16 Kx4 K @higher freq
Table 9-2. Hardware Accelerated Video Encode (Sheet 2 of 2)
Codec Profile Level Maximum Resolution
Datasheet, Volume 1 of 2 115
• Low power Scaler and Format Converter.
9.2 Platform Graphics Hardware Feature
9.2.1 Hybrid Graphics
Microsoft* Windows* 10 operating system enables the Windows*10 Hybrid graphics
framework wherein the GPUs and their drivers can be simultaneously utilized to provide
users with the benefits of both performance capability of discrete GPU (dGPU) and low-
power display capability of the processor GPU (iGPU). For instance, when there is a
high-end 3D gaming workload in progress, the dGPU will process and render the game
frames using its graphics performance, while iGPU continues to perform the display
operations by compositing the frames rendered by dGPU. We recommend that OEMS
should seek further guidance from Microsoft* to confirm that the design fits all the
latest criteria defined by Microsoft* to support HG.
Microsoft* Hybrid Graphics definition includes the following:
1. The system contains a single integrated GPU and a single discrete GPU.
2. It is a design assumption that the discrete GPU has a significantly higher
performance than the integrated GPU.
3. Both GPUs shall be physically enclosed as part of the system.
— Microsoft* Hybrid DOES NOT support hot-plugging of GPUs
— OEMS should seek further guidance from Microsoft* before designing systems
with the concept of hot-plugging
4. Starting with Windows*10 Th1 (WDDM 2.0), a previous restriction that the discrete
GPU is a render-only device, with no displays connected to it, has been removed. A
render-only configuration with NO outputs is still allowed, just NOT required.
§ §
116 Datasheet, Volume 1 of 2
10 Display
10.1 Display Technologies Support
10.2 Display Configuration
Technology Standard
eDP* 1.4b VESA* Embedded DisplayPort* Standard 1.4b
MIPI DSI MIPI* Display Serial Interface (DSI) Specification Version 1.3
DisplayPort*
1.4a
VESA* DisplayPort* Standard 1.4a
VESA* DisplayPort* PHY Compliance Test Specification 1.4a
VESA* DisplayPort* Link Layer Compliance Test Specification 1.4a
VESA* DisplayPort* Alt Mode on USB Type-C Standard Version 1.0b
HDMI* 2.0b High-Definition Multimedia Interface Specification Version 2.0b
Table 10-1. Display Ports Availability and Link Rate
Port UP3-Processor Line UP4-Processor Line H-Processor Line
DDI A
1,2
DP* up to HBR2
HDMI* up to 5.94 Gbps
eDP* up to HBR3
MIPI DSI up to 2.5 Gbps
5
DP* up to HBR2
HDMI* up to 5.94 Gbps
eDP* up to HBR3
MIPI DSI up to 2.5 Gbps
eDP* up to HBR3
DDI B
2
eDP* up to HBR3
DP* up to HBR2
HDMI* up to 5.94 Gbps
eDP* up to HBR3
DP* up to HBR2
HDMI* up to 5.94 Gbps
MIPI DSI up to 2.5 Gbps
eDP* up to HBR3
DP* up to HBR2
HDMI* up to 5.94 Gbps
DDI TCP0
3
DP* up to HBR3
HDMI* up to 5.94 Gbps
DP* up to HBR3
HDMI* up to 5.94 Gbps
DP* up to HBR3
HDMI* up to 5.94 Gbps
DDI TCP1
3
DP* up to HBR3
HDMI* up to 5.94 Gbps
DP* up to HBR3
HDMI* up to 5.94 Gbps
DP* up to HBR3
HDMI* up to 5.94 Gbps
DDI TCP2
3
DP* up to HBR3
HDMI* up to 5.94 Gbps
DP* up to HBR3
HDMI* up to 5.94 Gbps
DP* up to HBR3
HDMI* up to 5.94 Gbps
DDI TCP3
3
DP* up to HBR3
HDMI* up to 5.94 Gbps
N/A
DP* up to HBR3
HDMI* up to 5.94 Gbps
DPIP0
4
N/A N/A
DP* up to HBR3
DPIP1
4
DP* up to HBR3
DPIP2
4
DP* up to HBR3
DPIP3
4
DP* up to HBR3
Notes:
1. Dual low power embedded panel are supported (each can be eDP and/or MIPI DSI).
a. PSR2 can be supported only on single low power display.
b. Highest Package C state supported for dual embedded display configuration is PC8.
2. DDI - Digital Display Interface.
3. Each of the four TCP ports can be implemented as HDMI, DP, or DPoC (DisplayPort over Type-C)
4. DPIPx are DisplayPort* Rx ports referred as DP-in port, for more information refer to DP-IN section.
5. MIPI DSI supported on UP3 processor family but not fully validated.
Datasheet, Volume 1 of 2 117
Note: For port availability in each of the processor lines, refer Table 10-1, “Display Ports
Availability and Link Rate”.
Figure 10-1. Processor Display Architecture
118 Datasheet, Volume 1 of 2
10.3 Display Features
10.3.1 General Capabilities
• Up to four simultaneous displays.
— Single 8K60Hz panel, supported by joining two pipes over single port.
— Up to 4x4K60Hz display concurrent.
• Audio stream support on external ports.
• Up to four USB* Type-C for DisplayPort* Alt Mode, DisplayPort* over TBT, or
DisplayPort*/HDMI* interfaces.
• Up to four DP-IN interfaces supporting discrete GPU DisplayPort* stream via USB-
C* sub system
• HDR (High Dynamic Range) support.
• Four Display Pipes - Supporting blending, color adjustments, scaling and dithering.
• Transcoders - Containing the Timing generators supporting eDP*, DSI*, DP*,
HDMI* interfaces.
• One Low Power optimized pipe.
— LACE (Localized Adaptive Contrast Enhancement), supported up to 5 K
resolutions.
— 3D LUT - power efficient pixel modification function for color processing.
— FBC (Frame Buffer Compression) - power saving feature.
Note: DP-IN supported only in H segment.
10.3.2 Multiple Display Configurations
The following multiple display configuration modes are supported (with appropriate
driver software):
• Single Display is a mode with one display port activated to display the output to
one display device.
• Display Clone is a mode with up to four display ports activated to drive the display
content of same color depth setting but potentially different refresh rate and
resolution settings to all the active display devices connected.
• Extended Desktop is a mode with up to four display ports activated to drive the
content with potentially different color depth, refresh rate, and resolution settings
on each of the active display devices connected.
10.3.3 High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high-definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, and so on) and
the sink (panels, monitor, and TVs). The processor supports both HDCP 2.3 and 1.4
content protection over wired displays (HDMI* and DisplayPort*).
The HDCP 1.4, 2.2, 2.3 keys are integrated into the processor and customers are not
required to physically configure or handle the keys.
Datasheet, Volume 1 of 2 119
10.3.4 DisplayPort*
The DisplayPort* is a digital communication interface that uses differential signaling to
achieve a high-bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays.
A DisplayPort* consists of a Main Link (four lanes), Auxiliary channel, and a Hot-Plug
Detect signal. The Main Link is a unidirectional, high-bandwidth, and low-latency
channel used for transport of isochronous data streams such as uncompressed video
and audio. The Auxiliary Channel (AUX CH) is a half-duplex bi-directional channel used
for link management and device control. The Hot-Plug Detect (HPD) signal serves as an
interrupt request from the sink device to the source device.
The processor is designed in accordance with VESA* DisplayPort* specification. Refer
Section 10.1, “Display Technologies Support”.
The DisplayPort* support DisplayPort* Alt mode over Type-C and DP tunneling via TBT.
Refer to Chapter 6, “USB-C* Sub System” For DisplayPort* Alt mode support.
• Support main link of 1, 2, or 4 data lanes.
• Aux channel for Link/Device management.
• Support up to 36 BPP (Bit Per Pixel).
• Support SSC.
• Support YCbCR 4:4:4, YCbCR 4:2:0, and RGB color format.
• Support MST (Multi-Stream Transport).
• Support VESA DSC 1.1.
• Adaptive Sync.
10.3.4.1 Multi-Stream Transport (MST)
• The processor supports Multi-Stream Transport (MST), enabling multiple monitors
to be used via a single DisplayPort connector.
• Maximum MST DP supported resolution:
Figure 10-2. DisplayPort* Overview
Source Device Sink Device
Main Link
(Isochronous Streams)
AUX CH
(Link/Device Managemet)
Hot-Plug Detect
(Interrupt Request)
DisplayPort Tx
(Processor)
DisplayPort Rx
120 Datasheet, Volume 1 of 2
Table 10-2. Display Resolutions and Link Bandwidth for Multi-Stream Transport
Calculations
Pixels per line Lines Refresh Rate [Hz] Pixel Clock [MHz]
Link Bandwidth
[Gbps]
640 480 60 25.2 0.76
800 600 60 40 1.20
1024 768 60 65 1.95
1280 720 60 74.25 2.23
1280 768 60 68.25 2.05
1360 768 60 85.5 2.57
1280 1024 60 108 3.24
1400 1050 60 101 3.03
1680 1050 60 119 3.57
1920 1080 60 148.5 4.46
1920 1200 60 154 4.62
2048 1152 60 156.75 4.70
2048 1280 60 174.25 5.23
2048 1536 60 209.25 6.28
2304 1440 60 218.75 6.56
2560 1440 60 241.5 7.25
3840 2160 30 262.75 7.88
2560 1600 60 268.5 8.06
2880 1800 60 337.5 10.13
3200 2400 60 497.75 14.93
3840 2160 60 533.25 16.00
4096 2160 60 556.75 16.70
4096 2304 60 605 18.15
5120 3200 60 1042.5 31.28
Notes:
1. All the above is related to bit depth of 24.
2. The data rate for a given video mode can be calculated as- Data Rate = Pixel Frequency * Bit Depth.
3. The bandwidth requirements for a given video mode can be calculated as: Bandwidth = Data Rate * 1.25
(for 8B/10B coding overhead).
4. The link bandwidth depends if the standards is reduced blanking or not.
If the standard is not reduced blanking - the expected bandwidth may be higher.
For more details refer to VESA and Industry Standards and Guidelines for Computer Display Monitor
Timing (DMT). Version 1.0
5. To calculate what are the resolutions that can be supported in MST configurations, follow the below
guidelines:
a. Identify what is the link bandwidth column according to the requested display resolution.
b. Summarize the bandwidth for two of three displays accordingly, and make sure the final result is
below 21.6 Gbps. (for example: 4 lanes HBR2 bit rate)
For example:
a. Docking two displays: 3840x2160@60 Hz + 1920x1200@60 Hz = 16 + 4.62 = 20.62 Gbps
[Supported]
b. Docking three displays: 3840x2160@30 Hz + 3840x2160@30 Hz + 1920x1080@60 Hz = 7.88
+ 7.88 + 4.16 = 19.92 Gbps [Supported]
Datasheet, Volume 1 of 2 121
10.3.5 High-Definition Multimedia Interface (HDMI*)
The High-Definition Multimedia Interface (HDMI*) is provided for transmitting
uncompressed digital audio and video signals from DVD players, set-top boxes, and
other audio-visual sources to television sets, projectors, and other video displays. It
can carry high-quality multi-channel audio data and all standard and high-definition
consumer electronics video formats. The HDMI display interface connecting the
processor and display devices uses transition minimized differential signaling (TMDS) to
carry audiovisual information through the same HDMI cable.
HDMI* includes three separate communications channels: TMDS, DDC, and the
optional CEC (consumer electronics control). CEC is not supported on the processor. As
shown in the following figure, the HDMI* cable carries four differential pairs that make
up the TMDS data and clock channels. These channels are used to carry video, audio,
and auxiliary data. In addition, HDMI carries a VESA DDC. The DDC is used by an
HDMI* Source to determine the capabilities and characteristics of the Sink.
Audio, video, and auxiliary (control/status) data is transmitted across the three TMDS
data channels. The video pixel clock is transmitted on the TMDS clock channel and is
used by the receiver for data recovery on the three data channels. The digital display
data signals driven natively through the PCH are AC coupled and needs level shifting to
convert the AC coupled signals to the HDMI* compliant digital signals. The processor
HDMI* interface is designed in accordance with the High-Definition Multimedia
Interface.
Table 10-3. DisplayPort Maximum Resolution
Standard UP3-Processor Line
1
UP4-Processor Line
1
H-Processor Line
1
DP* 4096x2304 60 Hz 36 bpp
5120x3200 60 Hz 24 bpp
4096x2304 60 Hz 36 bpp
5120x3200 60 Hz 24 bpp
4096x2304 60 Hz 36 bpp
5120x3200 60 Hz 24 bpp
DP* with DSC 5120x3200 120 Hz 30 bpp 5120x3200 120 Hz 30 bpp 5120x3200 120 Hz 30 bpp
Notes:
1. Maximum resolution is based on the implementation of 4 lanes at HBR3 link data rate.
2. bpp - bit per pixel.
3. Resolution support is subject to memory BW availability.
4. Due to the support of low power mode, no compressed pipe joiner feature is co-exist which leads to the maximum of 5K60
resolution.
122 Datasheet, Volume 1 of 2
• DDC (Display Data Channel) channel.
• Support YCbCR 4:4:4, YCbCR 4:2:0, and RGB color format.
• Support up to 36 BPP (Bit Per Pixel).
10.3.6 embedded DisplayPort* (eDP*)
The embedded DisplayPort* (eDP*) is an embedded version of the DisplayPort
standard oriented towards applications such as notebook and All-In-One PCs. Like
DisplayPort, embedded DisplayPort* also consists of the Main Link, Auxiliary channel,
and an optional Hot-Plug Detect signal.
• Supported on Low power optimized pipe.
• Support up to HBR3 link rate.
• Support Backlight PWM control signal.
• Support VESA DSC (Data Stream Compression).
• Support SSC.
• Panel Self Refresh 1.
• Panel Self Refresh 2.
• MSO 2x2 (Multi Segment Operation).
• Dedicated Aux channel.
Figure 10-3. HDMI* Overview
HDMI Source
HDMI Sink
TMDS Data Channel 0
Hot-Plug Detect
HDMI Tx
(Processor)
HDMI Rx
T
M
D
S
D
a
t
a
C
h
a
n
n
e
l
1
TMDS Data Channel 2
TMDS Clock Channel
CEC Line (optional)
Display Data Channel (DDC)
Table 10-4. HDMI Maximum Resolution
Standard UP3-Processor Line UP4-Processor Line H-Processor Line
HDMI 1.4 4 Kx2 K 24-30 Hz 24 bpp 4 Kx2 K 24-30 Hz 24 bpp 4 Kx2 K 24-30 Hz 24 bpp
HDMI 2.0b
4 Kx2 K 48-60 Hz 24 bpp (RGB/
YUV444)
4 Kx2 K 48-60 Hz 12 bpc (YUV420)
4 Kx2 K 48-60 Hz 24 bpp (RGB/
YUV444)
4 Kx2 K 48-60 Hz 12 bpc (YUV420)
4 Kx2 K 48-60 Hz 24bpp
(RGB/YUV444)
4 Kx2 K 48-60 Hz 12bpc
(YUV420)
Notes:
1. bpp - bit per pixel.
2. Resolution support is subject to memory BW availability.
3. HDMI2.1 Can be supported using LSPCON (DP1.4 to HDMI2.1 protocol converter).
Datasheet, Volume 1 of 2 123
• Adaptive Sync.
10.3.7 MIPI* DSI
Display Serial Interface (DSI*) specifies the interface between a host processor and
peripherals such as a display module. DSI is a high speed and high performance serial
interface that offers efficient and low power connectivity between the processor and the
display module.
• One link x8 data lanes or two links each with x4 lanes support.
• Supported on Low power optimized pipe.
• Support the Backlight control signal.
• Support VESA DSC (Data Stream Compression).
Table 10-5. Embedded DisplayPort Maximum Resolution
Standard UP3-Processor Line
1
UP4-Processor Line
1
H-Processor Line
1
eDP* 4096x2304 60 Hz 36 bpp
5120x3200 60 Hz 24 bpp
4096x2304 60 Hz 36 bpp
5120x3200 60 Hz 24 bpp
4096x2304 60 Hz 36 bpp
5120x3200 60 Hz 24 bpp
eDP* with DSC
5
5120x3200 120 Hz 30 bpp
7680x4320 60 Hz 30 bpp
5120x3200 120 Hz 30 bpp
7680x4320 60 Hz 24 bpp
5120x3200 120 Hz 30 bpp
7680x4320 60 Hz 30 bpp
Notes:
1. Maximum resolution is based on the implementation of 4 lanes at HBR3 link data rate.
2. PSR2 supported for up to 5 K resolutions.
3. bpp - bit per pixel.
4. Resolution support is subject to memory BW availability.
5. High resolution are supported, validation is depended on panel market availability.
Figure 10-4. MIPI* DSI Overview
Source Device Sink Device
Data Lane n
Data Lane 0
High Speed Clock
Host Device
(Processor)
Display
124 Datasheet, Volume 1 of 2
10.3.8 Integrated Audio
• HDMI* and DisplayPort interfaces can carry audio along with video.
• The processor supports three High Definition audio streams on four digital ports
simultaneously (the DMA controllers are in PCH).
• The integrated audio processing (DSP) is performed by the PCH and delivered to
the processor using the AUDIO_SDI and AUDIO_CLK inputs pins.
• The AUDIO_SDO output pin is used to carry responses back to the PCH.
• Supports only the internal HDMI and DP CODECs.
The processor will continue to support Silent stream. A Silent stream is an integrated
audio feature that enables short audio streams, such as system events to be heard
over the HDMI* and DisplayPort* monitors. The processor supports silent streams over
the HDMI and DisplayPort interfaces at 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz, 176.4 kHz,
and 192 kHz sampling rates and silent multi-stream support.
10.3.9 DisplayPort* Input (DP-IN)
DP-IN interface supports platforms that are using discrete GPU with DisplayPort*
output interfaces.
Each stream transmitted from the discrete GPU towards DP-IN Receiver interface can
be internally routed to each of USB-C* sub system ports, as long as a Type-C solution
have been implemented:
• DPoC port - Display Port Over Type-C.
• USB4 port - DisplayPort tunneled over USB4.
Table 10-6. MIPI* DSI Maximum Resolution
Standard UP3-Processor Line UP4-Processor Line H-Processor Line
MIPI* DSI (Single Link) 3200x2000 @60 Hz 24
bpp
3200x2000 @60 Hz 24 bpp
N/A
MIPI* DSI (Single Link)
with DSC
5120x3200 @60 Hz 24
bpp
5120x3200 @60 Hz 24bpp
MIPI* DSI (Dual Link)
N/A
4096x2304 @60 Hz 24 bpp
3840x2160 @60 Hz 24 bpp
MIPI* DSI (Dual Link)
with DSC
N/A 5120x3200 @60 Hz 24 bpp
Notes:
1. bpp - bit per pixel.
2. Resolution support is subject to memory BW availability.
Table 10-7. Processor Supported Audio Formats over HDMI and DisplayPort*
Audio Formats HDMI* DisplayPort*
AC-3 Dolby* Digital Yes Yes
Dolby* Digital Plus Yes Yes
DTS-HD* Yes Yes
LPCM, 192 kHz/24 bit, 6 Channel Yes Yes
Dolby* TrueHD, DTS-HD Master Audio*
(Lossless Blu-Ray Disc* Audio Format)
Yes Yes
Datasheet, Volume 1 of 2 125
DP-IN interface support VESA* LTTPR (Link Training Tunable PHY Repeater).
Notes:
1. DP-IN is supported only in H processor line.
2. DP-IN requires an external display source that supports VESA* LTTPR (Link Training
Tunable PHY Repeater). The following modes are supported
i. Non-transparent mode – recommended model.
ii. Transparent mode – this mode is limited only for TCP ports which is
connected through a BBR re-timer.
Each DP-in port support:
• Hot Plug Detect, required on board Level shifter
• AUX channel
• Main Link supporting up to 4 lanes each with up to HBR3 link rate.
• VESA* Link Training Tunable PHY Repeater
• Supported for DisplayPort over Type-C (DPoC) and DisplayPort* tunneling via
thunderbolt on each of USB-C* ports.
Note: Supported for DisplayPort over Type-C (DPoC) and DisplayPort* tunneling via
thunderbolt on each of USB-C* ports.
Not supported for Fixed DP, HDMI, or eDP interfaces.
Figure 10-5. DP-IN Block Diagram
TGL SoC
DP-in
TypeC Subsystem
Display
dGfx
USB4 controller
FIA
iGfx/dGfx Source Mux
TypeC PHYs
DPIP x
PCIe
126 Datasheet, Volume 1 of 2
§ §
Datasheet, Volume 1 of 2 127
11 Camera/MIPI
11.1 Camera Pipe Support
The IPU6se fixed function pipe supports the following functions:
• Black level correction;
• White balance;
• Color matching;
• Lens shading (vignette) correction;
• Color crosstalk (color shading) correction;
• Dynamic defect pixel replacement;
• Auto-focus-pixel (PDAF) hiding;
• High quality demosaic;
• Scaling and format conversion;
• Temporal noise reduction running on Intel graphics.
11.2 MIPI* CSI-2 Camera Interconnect
The Camera I/O Controller provides a native/integrated interconnect to camera
sensors, compliant with MIPI* CSI-2 V2.0 protocol. Total of 12 data + 4 clock lanes
(UP3), 15 data + 6 clock (UP4) and 4 data + 2 clock (H-processor) lanes are available
for the camera interface supporting up to 4 sensors (UP3), 6 sensors (UP4) or 2
sensors (H-processor).
Data transmission interface (referred as CSI-2) is a unidirectional differential serial
interface with data and clock signals; the physical layer of this interface is the MIPI*
Alliance Specification for D-PHY.
The control interface (referred as CCI) is a bi-directional control interface compatible
with I
2
C standard.
11.2.1 Camera Control Logic
The camera infrastructure supports several architectural options for camera control
utilizing camera PMIC and/or discrete logic. IPU6 control options utilize I
2
C for
bidirectional communication and PCH GPIOs to drive various control functions.
11.2.2 Camera Modules
Intel maintains an Intel User Facing Camera Approved Vendor List and Intel World-
Facing Approved Vendor List to simplify system design. Additional services are available
to support non-AVL options.
128 Datasheet, Volume 1 of 2
11.2.3 CSI-2 Lane Configuration
Table 11-1. CSI-2 Lane Configuration for UP3-Processor Line
Port Data/Clock Configuration Option 1 Configuration Option 2
Port B Lane 0
x4 x4
Port B Lane 1
Port B Clock
Port B Lane 2
Port B Lane 3
Port C Clock
x4 x4
Port C Lane 0
Port C Lane 1
Port C Lane 2
Port C Lane 3
Port E Clock Not Used
x2Port E Lane 0
x4
Port E Lane 1
Port F Clock
x2Port F Lane 0
Port F Lane 1
Table 11-2. CSI-2 Lane Configuration for UP4-Processor Line (Sheet 1 of 2)
Port Data/Clock Configuration Option 1 Configuration Option 2
Port B Lane 0
x4 x4
Port B Lane 1
Port B Clock
Port B Lane 2
Port B Lane 3
Port C Clock
x4 x4
Port C Lane 0
Port C Lane 1
Port C Lane 2
Port C Lane 3
Port E Clock Not Used
x2Port E Lane 0
x4
Port E Lane 1
Port F Clock
x2Port F Lane 0
Port F Lane 1
Port G Clock
x2 x2Port G Lane 0
Port G Lane 1
Datasheet, Volume 1 of 2 129
Table 11-3. CSI-2 Lane Configuration for H-Processor Line
§ §
Port H Lane 0
Not Used x1
Port H Clock
Notes:
1. Ports G and H available on UP4 only.
2. Port E,F selection of configuration 1 or 2 is orthogonal to Port G, H selection of
configuration 1 or 2.
Port Data/Clock Configuration Option 1 Configuration Option 2
Port A Clock
x2
x4
Port B Lane 0
Port B Lane 1
Port B Clock
x2
Port B Lane 2 / Port A Lane 1
Port B Lane 3 / Port A Lane 0
Note: H-processor IPU6-Slim has 4 data and 2 clock lanes only.
Table 11-2. CSI-2 Lane Configuration for UP4-Processor Line (Sheet 2 of 2)
Port Data/Clock Configuration Option 1 Configuration Option 2
130 Datasheet, Volume 1 of 2
12 Signal Description
This chapter describes the processor signals. They are arranged in functional groups
according to their associated interface or category. The notations in the following table
are used to describe the signal type.
The signal description also includes the type of buffer used for the particular signal
(refer to the following table).
Table 12-1. Signal Tables Terminology (Sheet 1 of 2)
Short name Functionality
Direction
I/O Input or Output
O Output only
I Input only
N/A Not applicable (Mostly for power rails and RSVD signals)
Buffer Type
DDR4 DDR4 memory (1.2 V tolerant)
LPDDR4 LPDDR4 memory (1.1 V tolerant)
LPDDR4x LPDDR4x memory (1.1 V TX, 0.6 V RX tolerant)
Analog
Analog reference or output. May be used as a threshold
voltage or for buffer compensation.
PCIE PCI Express
DMI DMI
GTL Gunning Transceiver Logic signaling technology
CMOS CMOS
AUDIO AUDIO
N/A Not Applicable
Async CMOS
1
Async CMOS
DP/HDMI DP/HDMI
DPHY Used for DSI and CSI
OD Open Drain
PECI Async PECI Async
Diff Amp Clock Diff Amp Clock Input Buffer
Ref Voltage Reference signal
Power Power
PWR_SENSE Isolated, low impedance voltage sense pins.
Ground Ground
GND_SENSE Isolated, low impedance reference ground sense pins.
TCP Type-C port
Link Type
SE Single Ended
DIFF Differential pair
Datasheet, Volume 1 of 2 131
Notes:
1. Qualifier for a buffer type
1
2. CMOS - Complementary Metal Oxide Substrate
3. GTL - Gunning Transceiver Signaling Technology Logic
4. DP - DisplayPort
5. PECI - Platform Environment Control Interface
6. Async - Signal is not related to any clock in the system
7. DDR - Double Data Rate Synchronous Dynamic Random Access Memory
8. LPDDR - Low Power DDR
9. On some case I/O may be split into: I=GTL, O=OD
Table 12-1. Signal Tables Terminology (Sheet 2 of 2)
Short name Functionality
132 Datasheet, Volume 1 of 2
12.1 System Memory Interface
12.1.1 DDR4 Memory Interface
Table 12-2. DDR4 Memory Interface (Sheet 1 of 3)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
DDR0_DQ[7:0][7:0]
DDR1_DQ[7:0][7:0]
Data Buses: Data signals interface to
the SDRAM data buses.
Example: DDR0_DQ2[5] refers to
DDR channel 0, Byte 2, Bit 5.
I/O DDR4 SE
UP3/H Processor
Lines
DDR0_DQ8[7:0]
DDR1_DQ8[7:0]
ECC Data Buses: Data signals
interface to the SDRAM data buses.
I/O DDR4 SE H Processor Line
DDR0_DQSP[7:0]
DDR0_DQSN[7:0]
DDR1_DQSP[7:0]
DDR1_DQSN[7:0]
Data Strobes: Differential data strobe
pairs. The data is captured at the
crossing point of DQS during reading
and write transactions.
Example: DDR0_DQSP0 refers to
DQSP of DDR channel 0, Byte 0.
O DDR4 Diff
UP3/H Processor
Lines
DDR0_DQSP[8]
DDR0_DQSN[8]
DDR1_DQSP[8]
DDR1_DQSN[8]
ECC Data Strobes: Differential data
strobe pairs. The data is captured at
the crossing point of DQS during
reading and write transactions.
O DDR4 Diff H Processor Line
DDR0_CLK_N[1:0]
DDR0_CLK_P[1:0]
DDR1_CLK_N[1:0]
DDR1_CLK_P[1:0]
SDRAM Differential Clock:
Differential clocks signal pairs, pair per
rank. The crossing of the positive edge
and the negative edge of their
complement are used to sample the
command and control signals on the
SDRAM.
O DDR4 Diff UP3 Processor
Line
DDR0_CLK_N[3:0]
DDR0_CLK_P[3:0]
DDR1_CLK_N[3:0]
DDR1_CLK_P[3:0]
SDRAM Differential Clock:
Differential clocks signal pairs, pair per
rank. The crossing of the positive edge
and the negative edge of their
complement are used to sample the
command and control signals on the
SDRAM.
O DDR4 Diff
H Processor Line
DDR0_CKE[1:0]
DDR1_CKE[1:0]
Clock Enable: (1 per rank). These
signals are used to:
• Initialize the SDRAMs during
power-up.
• Power-down SDRAM ranks.
• Place all SDRAM ranks into and out
of self-refresh during STR
(Suspend to RAM).
O DDR4 SE
UP3 Processor
Line
DDR0_CKE[3:0]
DDR1_CKE[3:0]
Clock Enable: (1 per rank). These
signals are used to:
• Initialize the SDRAMs during
power-up.
• Power-down SDRAM ranks.
• Place all SDRAM ranks into and out
of self-refresh during STR
(Suspend to RAM).
O DDR4 SE H Processor Line
DDR0_CS[3:0]
DDR1_CS[3:0]
Chip Select: (1 per rank). These
signals are used to select particular
SDRAM components during the active
state. There is one Chip Select for each
SDRAM rank.
O DDR4 SE
[1:0] applicable
for All Processor
Lines.
[3:2] applicable
only for H-
Processor Line.
Datasheet, Volume 1 of 2 133
DDR0_ODT[1:3]
DDR1_ODT[1:3]
On Die Termination: (1 per rank).
Active SDRAM Termination Control.
O DDR4 SE
UP3/H Processor
Lines
DDR0_MA[16:0]
DDR1_MA[16:0]
Address: These signals are used to
provide the multiplexed row and
column address to the SDRAM.
• A[16:14] use also as command
signals, see ACT_N signal
description.
• A10 is sampled during Read/Write
commands to determine whether
• Autoprecharge should be
performed to the accessed bank
after the Read/Write operation.
HIGH: Autoprecharge;
LOW: no Autoprecharge).
• A10 is sampled during a Precharge
command to determine whether
the Precharge applies to one bank
(A10 LOW) or all banks (A10
HIGH). If only one bank is to be
precharged, the bank is selected
by bank addresses.
• A12 is sampled during Read and
Write commands to determine if
burst chop
• (on-the-fly) will be performed.
(HIGH, no burst chop;
LOW: burst chopped
)
DDR0_MA[16] uses as RAS# signal
DDR0_MA[15] uses as CAS# signal
DDR0_MA[14] uses as WE# signal
DDR1_MA[16] uses as RAS# signal
DDR1_MA[15] uses as CAS# signal
DDR1_MA[14] uses as WE# signal
O DDR4 SE
UP3/H Processor
Lines
DDR0_ACT#
DDR1_ACT#
Activation Command: ACT# HIGH
along with CS_N determines that the
signals addresses below have
command functionality.
O DDR4 SE
UP3/H Processor
Lines
DDR0_ALERT#
DDR1_ALERT#
Alert: This signal is used at command
training only. It is getting the
Command and Address Parity error
flag during training. CRC feature is not
supported.
I DDR4 SE
UP3/H Processor
Lines
DDR0_BG[1:0]
DDR1_BG[1:0]
Bank Group: BG[1:0] define to which
bank group an Active, reading, Write
or Precharge command is being
applied.
BG0 also determines which mode
register is to be accessed during a MRS
cycle.
O DDR4 SE
UP3/H Processor
Lines
DDR0_BA[1:0]
DDR1_BA[1:0]
Bank Address: BA[1:0] define to
which bank an Active, reading, Write
or Precharge command is being
applied. Bank address also determines
which mode register is to be accessed
during a MRS cycle.
O DDR4 SE
UP3/H Processor
Lines
Table 12-2. DDR4 Memory Interface (Sheet 2 of 3)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
134 Datasheet, Volume 1 of 2
DDR1_CA[12:0]
Command Address: These signals
are used to provide the multiplexed
command and address to the SDRAM.
O DDR4 SE H Processor Line
DDR0_PAR
DDR1_PAR
Command and Address Parity:
These signals are used for parity
check.
O DDR4 SE
UP3/H Processor
Lines
DDR0_VREF_CA[1:0]
DDR1_VREF_CA[1:0]
Memory Reference Voltage for
Command and Address
O A SE
UP3/H Processor
Lines
DDR_RCOMP
System Memory Resistance
Compensation
I Analog SE
UP3/H Processor
Lines
DRAM_RESET#/
RESET#
Memory Reset
I CMOS SE
UP3/H Processor
Lines
DDR_VTT_CTL
System Memory Power Gate
Control: When signal is high –
platform memory VTT regulator is
enable, output high.
When signal is low - Disables the
platform memory VTT regulator in C8
and deeper and S3 (H SKU only).
O CMOS SE
UP3/H Processor
Lines
Table 12-2. DDR4 Memory Interface (Sheet 3 of 3)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
Datasheet, Volume 1 of 2 135
12.1.2 LPDDR4x Memory Interface
Table 12-3. LPDDR4x Memory Interface (Sheet 1 of 2)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
DDR0_DQ[1:0][7:0]
DDR1_DQ[1:0][7:0]
DDR2_DQ[1:0][7:0]
DDR3_DQ[1:0][7:0]
DDR4_DQ[1:0][7:0]
DDR6_DQ[1:0][7:0]
DDR7_DQ[1:0][7:0]
Data Buses: Data signals interface to
the SDRAM data buses.
Example: DDR0_DQ1[5] refers to
DDR channel 0, Byte 1, Bit 5.
I/O
LPDDR4x
SE
UP3/UP4
Processor Lines
DDR0_DQSP[1:0]
DDR1_DQSP[1:0]
DDR2_DQSP[1:0]
DDR3_DQSP[1:0]
DDR4_DQSP[1:0]
DDR6_DQSP[1:0]
DDR7_DQSP[1:0]
DDR0_DQSN[1:0]
DDR1_DQSN[1:0]
DDR2_DQSN[1:0]
DDR3_DQSN[1:0]
DDR4_DQSN[1:0]
DDR6_DQSN[1:0]
DDR7_DQSN[1:0]
Data Strobes: Differential data strobe
pairs. The data is captured at the
crossing point of DQS during reading
and write transactions.
O
LPDDR4x
Diff
UP3/UP4
Processor Lines
DDR0_CLK_N
DDR0_CLK_P
DDR1_CLK_N
DDR1_CLK_P
DDR2_CLK_N
DDR2_CLK_P
DDR3_CLK_N
DDR3_CLK_P
DDR4_CLK_N
DDR4_CLK_P
DDR6_CLK_N
DDR6_CLK_P
DDR7_CLK_N
DDR7_CLK_P
SDRAM Differential Clock:
Differential clocks signal pairs, pair per
channel and package. The crossing of
the positive edge and the negative
edge of their complement are used to
sample the command and control sig-
nals on the SDRAM.
O
LPDDR4x
Diff
UP3/UP4
Processor Lines
DDR0_CKE[1:0]
DDR1_CKE[1:0]
DDR2_CKE[1:0]
DDR3_CKE[1:0]
DDR4_CKE[1:0]
DDR6_CKE[1:0]
DDR7_CKE[1:0]
Clock Enable: (1 per rank) These
signals are used to:
• Initialize the SDRAMs during
power-up.
• Power-down SDRAM ranks.
• Place all SDRAM ranks into and out
of self-refresh during STR.
O
LPDDR4x SE
UP3/UP4
Processor Lines
136 Datasheet, Volume 1 of 2
12.2 PCIe4 Gen4 Interface Signals
12.3 Direct Media Interface (DMI) Signals
DDR0_CS[1:0]
DDR1_CS[1:0]
DDR2_CS[1:0]
DDR3_CS[1:0]
DDR4_CS[1:0]
DDR6_CS[1:0]
DDR7_CS[1:0]
Chip Select: (1 per rank). These
signals are used to select particular
SDRAM components during the active
state. There is one Chip Select for each
SDRAM rank.
The Chip select signal is Active High.
O
LPDDR4x
SE
UP3/UP4
Processor Lines
DDR0_CA[5:0]
DDR1_CA[5:0]
DDR2_CA[5:0]
DDR3_CA[5:0]
DDR4_CA[5:0]
DDR6_CA[5:0]
DDR7_CA[5:0]
Command Address: These signals
are used to provide the multiplexed
command and address to the SDRAM.
O
LPDDR4x SE
UP3/UP4
Processor Lines
DDR_RCOMP
System Memory Resistance
Compensation
A
Analog SE
UP3/UP4
Processor Lines
DRAM_RESET# Memory Reset
I
CMOS SE
UP3/UP4
Processor Lines
Table 12-3. LPDDR4x Memory Interface (Sheet 2 of 2)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
Signal Name Description Dir
Buffer
Type
Link
Type
Availability
PCIE4_RCOMP_P
PCIE4_RCOMP_N
Resistance Compensation for PEG
channel
I Analog Diff All Processor Lines
PCIE4_TX_P[3:0]
PCIE4_TX_N[3:0]
PCIe Transmit Differential Pairs
O PCIE Diff All Processor Lines
PCIE4_RX_P[3:0]
PCIE4_RX_N[3:0]
PCIe Receive Differential Pairs
I PCIE Diff All Processor Lines
Table 12-4. DMI Interface Signals
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
DMI_RX_P[7:0]
DMI_RX_N[7:0]
DMI Input from PCH: Direct Media
Interface receive differential pairs.
I DMI Diff
H Processor Line
DMI_TX_P[7:0]
DMI_TX_N[7:0]
DMI Output to PCH: Direct Media Interface
transmit differential pairs.
O DMI Diff
DMI_RCOMP_P
DMI_RCOMP_N
Configuration Resistance
Compensation.
I DMI Diff
Datasheet, Volume 1 of 2 137
12.4 PCIe16 Gen4 Interface Signals
12.5 Reset and Miscellaneous Signals
Signal Name Description Dir
Buffer
Type
Link
Type
Availability
PCIE16_COM0_RCOMP_P
PCIE16_COM0_RCOMP_N
Resistance Compensation for PEG
channel
I Analog Diff H Processor Line
PCIE16_TX_P[15:0]
PCIE16_TX_N[15:0]
PCIe Transmit Differential Pairs
O PCIE Diff H Processor Line
PCIE16_RX_P[15:0]
PCIE16_RX_N[15:0]
PCIe Receive Differential Pairs
I PCIE Diff H Processor Line
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
CFG[17:0]
Configuration Signals: The CFG signals have a default
value of '1' if not terminated on the board. Intel
recommends placing test points on the board for CFG
pins.
• CFG[3], CFG[0]: Reserved configuration lane.
• CFG[2]: UP4/
UP3 Reserved
• CFG[2]: H
PCI Express* Static x16 Lanes
Numbering Reversal.
— 1 - (Default) Normal
— 0 - Reversed
• CFG[4]: eDP enable:
— 1 = Disabled.
— 0 = Enabled.
• CFG[6:5]: UP4/
UP3 Reserved
• CFG[6:5]: H
PCI Express* Bifurcation
— 00 = 1 x8, 2 x4 PCI Express*
— 01 = reserved
— 10 = 2 x8 PCI Express*
— 11 = 1 x16 PCI Express*
• CFG[13:7]: Reserved configuration lanes.
• CFG[14]: PEG60 (PCIE4) Lane Reversal:
— 1 - (Default) Normal
— 0 - Reversed
• CFG[17:15]: Reserved configuration lanes.
I GTL SE
All Processor
Lines
CFG_RCOMP Configuration Resistance Compensation I N/A SE
All Processor
Lines
EAR_N/
EAR_N_TEST_NCTF
• Stall reset sequence after PCU PLL lock until de-
asserted:
— 1 = (Default) Normal Operation; No stall.
— 0 = Stall.
I CMOS SE
All Processor
Lines
PROC_POPIRCOMP POPIO Resistance Compensation I N/A SE
UP3/UP4
Processor
Lines
CPU_ID
A PLATFORM indication signal, the signal defers between
current Gen processor and the compatibility option, with
the new Gen processor. Ensure to connect the signal pin
according to
usage of the platform. This Signal (PIN) is important for
functional and booting.
I CMOS SE
H Processor
Line
138 Datasheet, Volume 1 of 2
12.6 Display Interfaces
12.6.1 Embedded DisplayPort* (eDP*) Signals
PROC_TRIGOUT
Debug pin
O CMOS SE
H Processor
Line
PROC_TRIGIN
Debug pin
I CMOS SE
H Processor
Line
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
DDIA/B_TXP[3:0]
DDIA/B_TXN[3:0]
embedded DisplayPort Transmit: differential pair
O DP/HDMI Diff All Processor Lines
DDIA/B_AUX_P
DDIA/B_AUX_N
embedded DisplayPort Auxiliary: Half-duplex,
bidirectional channel consist of one differential pair.
O DP/HDMI Diff All Processor Lines
DISP_UTILS
embedded DisplayPort Utility: Output control
signal used for brightness correction of embedded
LCD displays with back light modulation.
This pin will co-exist with functionality similar to
existing BKLTCTL pin on PCH
O
Async
CMOS
SE All Processor Lines
DDI_RCOMP
DDI IO Compensation resistor, supporting
DP*, eDP* and HDMI* channels.
I Analog SE All Processor Lines
Note: eDP* implementation go along with additional sideband signals
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
Datasheet, Volume 1 of 2 139
12.6.2 MIPI DSI* Signals
12.6.3 Digital Display Interface (DDI) Signals
12.6.4 Digital Display Audio Signals
Signal Name Description Dir
Buffer
Type
Link Type Availability
DDIA/B_TXP[3:0]
DDIA/B_TXN[3:0]
DDIA/B_AUXP
DDIA/B_AUXN
DPHY Transmit: differential pair
DPHY Clock: differential pair
I/O DPHY Diff
UP4/UP3 Processor Lines
UP3 processor lines support
DDIA only.
DSI_DE_TE_1
DSI_DE_TE_2
Tearing Effect
I
Async
CMOS
SE
UP4/UP3 Processor Lines
UP3 processor lines support
DSI_DE_TE_1 only.
Signal Name Description Dir.
Buffer
Type
Link Type Availability
DDIA_TXP[3:0]
DDIA_TXN[3:0]
DDIB_TXP[3:0]
DDIB_TXN[3:0]
Digital Display Interface Transmit:
DisplayPort and HDMI Differential Pairs
O DP*/HDMI Diff
All Processor
Lines
DDIA_AUX_P
DDIA_AUX_N
DDIB_AUX_P
DDIB_AUX_N
Digital Display Interface Display Port
Auxiliary: Half-duplex, bidirectional
channel consist of one differential pair for
each channel.
I/O DP* Diff
Note: HDMI* implementation go along with additional sideband signals
Signal Name Description Dir. Link Type Availability
AUDOUT
Serial Data Output for display audio
interface
O SE
H Processor Line
AUDIN
Serial Data Input for display audio
interface
I SE
AUDCLK Serial Data Clock I SE
140 Datasheet, Volume 1 of 2
12.7 DP-IN Interface Signals
12.8 USB Type-C Signals
Signal Name Description Dir.
Buffer
Type
Link Type Availability
DPIP0_RXP/N[3:0]
DPIP1_RXP/N[3:0]
DPIP2_RXP/N[3:0]
DPIP3_RXP/N[3:0]
DisplayPort* Receiver:
DisplayPort Differential Pairs
I DP* Diff
H Processor Line
DPIP0_AUX_P/N
DPIP1_AUX_P/N
DPIP2_AUX_P/N
DPIP3_AUX_P/N
DP-IN Display Port Auxiliary: Half-
duplex, bidirectional channel consist of one
differential pair for each channel.
I/O DP* Diff
DPIP0_RCOMP
DPIP1_RCOMP
DPIP2_RCOMP
DPIP3_RCOMP
IO Compensation resistor, supporting
DP* channel.
N/A Analog SE
DPIP0_HPD
DPIP1_HPD
DPIP2_HPD
DPIP3_HPD
DisplayPort* Hot Plug Detect O DP* SE
Note: HPD signal require on-board level shifter
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
TCP[2:0]_TX_P[1:0]
TCP[2:0]_TX_N[1:0]
TX Data Lane. O TCP Diff All Processor Lines
TCP[3]_TX_P[1:0]
TCP[3]_TX_N[1:0]
TX Data Lane. O TCP Diff UP3/H Processor Lines
TCP[2:0]_TXRX_P[1:0]
TCP[2:0]_TXRX_N[1:0]
RX Data Lane, also serves as the
secondary TX data lane.
I/O TCP Diff All Processor Lines
TCP[3]_TXRX_P[1:0]
TCP[3]_TXRX_N[1:0]
RX Data Lane, also serves as the
secondary TX data lane.
I/O TCP Diff UP3/H Processor Lines
TCP[2:0]_AUX_P
TCP[2:0]_AUX_N
Common Lane AUX-PAD. I/O TCP Diff All Processor Lines
TCP[3]_AUX_P
TCP[3]_AUX_N
Common Lane AUX-PAD. I/O TCP Diff UP3/H Processor Lines
TC_RCOMP_P
TC_RCOMP_N
Type-C Resistance Compensation.
I Analog Diff All Processor Lines
TCP0_MBIAS_RCOMP
Type-C Resistance Compensation.
I Analog Diff All Processor Lines
Datasheet, Volume 1 of 2 141
12.9 MIPI* CSI-2 Interface Signals
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
CSI_A_DP[1:0]
CSI_A_DN[1:0]
CSI-2 Ports Data lane I DPHY Diff H Processor Line
CSI_B_DP[3:0]
CSI_B_DN[3:0]
CSI-2 Ports Data lane I DPHY Diff
All Processor Lines
CSI_C_DP[3:0]
CSI_C_DN[3:0]
UP3/UP4 Processor Lines
CSI_E_DP[1:0]
CSI_E_DN[1:0]
UP3/UP4 Processor Lines
CSI_F_DP[3:0]
CSI_F_DN[3:0]
UP3/UP4 Processor Lines
CSI_G_DP[1:0]
CSI_G_DN[1:0]
CSI-2 Ports Data lane
I DPHY Diff
UP4 Processor Line
CSI_H_DP[0]
CSI_H_DN[0]
UP4 Processor Line
CSI_A_CLK_P
CSI_A_CLK_N
CSI 2 Port A Clock lane I DPHY Diff H Processor Line
CSI_B_CLK_P
CSI_B_CLK_N
CSI-2 Ports B-C Clock lane I DPHY Diff
All Processor Lines
CSI_C_CLK_P
CSI_C_CLK_N
UP3/UP4 Processor Lines
CSI_E_CLK_P
CSI_E_CLK_N
CSI-2 Ports E-H Clock lane I DPHY Diff
UP3/UP4 Processor Lines
CSI_F_CLK_P
CSI_F_CLK_N
UP3/UP4 Processor Lines
CSI_G_CLK_P
CSI_G_CLK_N
CSI-2 Ports E-H Clock lane I DPHY Diff
UP4 Processor Line
CSI_H_CLK_P
CSI_H_CLK_N
UP4 Processor Line
CSI_RCOMP CSI Resistance Compensation N/A N/A SE All Processor Lines
142 Datasheet, Volume 1 of 2
12.10 Processor Clocking Signals
12.11 Testability Signals
Note: Refer to the electric spec in DC specification data for more details on the Buffer type
power spec requirement. For the buffer type, refer to CMOS Section 13.2.1.12, “CMOS
DC Specifications” data. For the buffer type, refer to TGTL in table, Section 13.2.1.13,
“GTL and OD DC Specification” for electric DC specification data.
Table 12-5. Processor Clocking Signals
Signal Name Description Dir. Buffer Type
Link
Type
Availability
BCLK_P
BCLK_N
100 MHz Differential bus clock input to the processor I CMOS Diff
H Processor Line
CLK_XTAL_P
CLK_XTAL_N
38.4 MHz Differential bus clock input to the processor I CMOS Diff
PCI_BCLKP
PCI_BCLKN
100 MHz Clock for PCI Express* logic I CMOS Diff
RTC_CLK Real time counter I CMOS SE
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
BPM#[3:0]
Breakpoint and Performance Monitor Signals: Outputs
from the processor that indicate the status of breakpoints and
programmable counters used for monitoring processor
performance.
I/O GTL SE All Processor Lines
PROC_PRDY#
Probe Mode Ready: PROC_PRDY# is a processor output
used by debug tools to determine processor debug readiness.
O OD SE All Processor Lines
PROC_PREQ#
Probe Mode Request: PROC_PREQ# is used by debug tools
to request debug operation of the processor.
I GTL SE All Processor Lines
PROC_TCK
Test Clock: This signal provides the clock input for the
processor Test Bus (also known as the Test Access Port). This
signal should be driven low or allowed to float during power on
Reset.
I GTL SE All Processor Lines
PROC_TDI
Test Data In: This signal transfers serial test data into the
processor. This signal provides the serial input needed for
JTAG specification support.
I GTL SE All Processor Lines
PROC_TDO
Test Data Out: This signal transfers serial test data out of
the processor. This signal provides the serial output needed
for JTAG specification support.
O OD SE All Processor Lines
PROC_TMS
Test Mode Select: A JTAG specification support signal used
by debug tools.
I GTL SE All Processor Lines
PROC_TRST#
Test Reset: Resets the Test Access Port (TAP) logic. This
signal should be driven low during power on Reset.
I GTL SE All Processor Lines
Datasheet, Volume 1 of 2 143
12.12 Error and Thermal Protection Signals
12.13 Processor Power Rails
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
CATERR#
Catastrophic Error: This signal indicates that
the system has experienced a catastrophic
error and cannot continue to operate. The
processor will set this signal for non-
recoverable machine check errors or other
unrecoverable internal errors. CATERR# is used
for signaling the following types of errors:
Legacy MCERRs, CATERR# is asserted for 16
BCLKs. Legacy IERRs, CATERR# remains
asserted until warm or cold reset.
O OD SE All Processor Lines
PECI
Platform Environment Control Interface: A
serial sideband interface to the processor. It is
used primarily for thermal, power, and error
management. Details regarding the PECI
electrical specifications, protocols and functions
can be found in the RS-Platform Environment
Control Interface (PECI) Specification, Revision
3.0.
I/O
PECI
Async
SE All Processor Lines
PROCHOT#
Processor Hot: PROCHOT# goes active when
the processor temperature monitoring
sensor(s) detects that the processor has
reached its maximum safe operating
temperature. This indicates that the processor
Thermal Control Circuit (TCC) has been
activated, if enabled. This signal can also be
driven to the processor to activate the TCC.
I/O
GTL I
OD O
SE All Processor Lines
THERMTRIP#
Thermal Trip: The processor protects itself
from catastrophic overheating by use of an
internal thermal sensor. This sensor is set well
above the normal operating temperature to
ensure that there are no false trips. The
processor will stop all executions when the
junction temperature exceeds approximately
130 °C. This is signaled to the system by the
THERMTRIP# pin.
O OD SE All Processor Lines
Table 12-6. Processor Power Rails Signals (Sheet 1 of 2)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
Vcc
IN
Input FIVR, Processor IA Cores and
Graphics Power Rail.
I Power - All Processor Lines
Vcc
IN_AUX
Input FIVR, SA and PCH components. I Power - All Processor Lines
Vcc
1P8A
Power rail supporting PCIe PHY and
DPIN PHY power supply
I Power - H Processor Line
V
DD2
System Memory power rail I Power - All Processor Lines
Vcc
ST
Sustain voltage for processor standby
modes
I Power - All Processor Lines
Vcc
STG
Gated sustain voltage for processor
standby modes
I Power - All Processor Lines
Vcc
IN
_SENSE
Vcc
IN_AUX
_VCCSENSE
Isolated, low impedance voltage
sense pins. They can be used to
sense or measure voltage near the
silicon.
I
PWR_
SENSE
SE All Processor Lines
144 Datasheet, Volume 1 of 2
12.14 Ground, Reserved and Non-Critical to Function
(NCTF) Signals
The following are the general types of reserved (RSVD) signals and connection
guidelines:
• RSVD: These signals should not be connected
• RSVD_TP: These signals should be routed to a test point
• _NCTF: These signals are non-critical to function and should not be connected.
• RSVD_2.2K_PD: This signal should be connected to GND via 2.2K ohm resistor.
Arbitrary connection of these signals to VCC, VDDQ, VSS, or to any other signal
(including each other) may result in component malfunction or incompatibility with
future processors. Refer Section 12-8, “GND, RSVD, and NCTF Signals”.
For reliable operation, always connect unused inputs or bi-directional signals to an
appropriate signal level. Unused active high inputs should be connected through a
resistor to ground (V
SS
). Unused outputs may be left unconnected however, this may
interfere with some Test Access Port (TAP) functions, complicate debug probing and
prevent boundary scan testing. A resistor should be used when tying bi-directional
signals to power or ground. When tying any signal to power or ground the resistor can
also be used for system testability. Resistor values should be within ±20% of the
impedance of the baseboard trace.
Vcc
IN_AUX
_VSSSENSE
Vss
IN
_SENSE
Isolated, low impedance reference
ground sense pins. They can be used
to sense or measure the reference
ground to the adequate voltage rail
near the silicon.
I
GND_
SENSE
SE All Processor Lines
Table 12-6. Processor Power Rails Signals (Sheet 2 of 2)
Signal Name Description Dir.
Buffer
Type
Link
Type
Availability
Table 12-7. Processor Pull-up Power Rails Signals
Signal Name Description Dir. Type Availability
Vcc
STG_OUT_LGC
Reference power rail for all Legacy
Signals Pull-up on platform.
O Reference Power UP3 Processor Line
Vcc
ST_OUT
Reference power rail for Legacy
Signals Pull-up on platform
O Reference Power UP4 Processor Line
Vcc
STG_OUT
Reference power rail for JTAG/
PROCHOT Signals Pull-up on
platform, Supplier of the FPGM
power rail
O Reference Power
UP4/H Processor
Lines
Vcc
STG_OUT
VCCSTG_OUT Power rail O Power UP3 Processor Line
Vcc
IO_OUT
Reference power rail for all Debug/
Config Signals Pull-up on platform.
O Reference Power All Processor Lines
Datasheet, Volume 1 of 2 145
12.15 Processor Internal Pull-Up / Pull-Down
Terminations
§ §
Table 12-8. GND, RSVD, and NCTF Signals
Signal Name Description Availability
Vss Ground: Processor ground node All Processor Lines
RSVD
Reserved: All signals that are RSVD should not be connected
on the board.
All Processor Lines
RSVD_NCTF
Reserved Non-Critical To Function: RSVD_NCTF should not
be connected on the board.
All Processor Lines
RSVD_TP
Test Point: Intel recommends to route each RSVD_TP to an
accessible test point. Intel may require these test points for
platform specific debug. Leaving these test points inaccessible
could delay debug by Intel.
All Processor Lines
RSVD_2.2K_PD
RSVD_2.2K_PD - must connect to 2.2K Ohm resistor 1% to
GND (pull down)
H Processor Line
Signal Name Pull Up/Pull Down Rail
BPM#[3:0] Pull Up/Pull Down VCC
IO
_OUT
PROC_PREQ# Pull Up VCC
STG
PROC_TDI Pull Up VCC
STG
PROC_TMS Pull Up VCC
STG
PROC_TRST# Pull Down VCC
STG
PROC_TCK Pull Down VCC
STG
CFG[17:0] Pull Up VCC
IO
_OUT
146 Datasheet, Volume 1 of 2
13 Electrical Specifications
13.1 Processor Power Rails
13.1.1 Power and Ground Pins
All power pins should be connected to their respective processor power planes, while all
VSS pins should be connected to the system ground plane. Use of multiple power and
ground planes is recommended to reduce I*R drop.
13.1.2 Full Integrated Voltage Regulator (FIVR)
Due to the integration of platform voltage regulators into the processor, the processor
has one main voltage rail (
V
CCIN
), the PCH has one main voltage rail (Vcc
IN_AUX
) and a
voltage rail for the memory interface (
V
DD2
).
The voltage rail
V
CCIN
will supply the integrated voltage regulators which in turn will
regulate to the appropriate voltages for the Cores, cache, System Agent, TCSS and
graphics. This integration allows the processor to better control on-die voltages to
optimize between performance and power savings. The
V
CCIN
rail will remain a VID-
based voltage with a loadline similar to the core voltage rail in previous processors.
13.1.3 V
CC
Voltage Identification (VID)
Intel processors/chipsets are individually calibrated in the factory to operate on a
specific voltage/frequency and operating-condition curve specified for that individual
processor. In normal operation, the processor autonomously issues voltage control
Power Rail Description
UP3 Processor
Line
UP4 Processor
Line
H Processor Line
V
CCIN
Input FIVR
1
, Processor IA Cores
And Graphic Power Rail
SVID SVID SVID
Vcc
IN_AUX
3
Input FIVR
1
, SA And PCH com-
ponents
PCH VID PCH VID PCH VID
Vcc
1P8A
5
PCIe PHY and DPIN PHY power
supply
N/A N/A Fixed
Vcc
ST
4
Sustain Power Rail Fixed Fixed Fixed
Vcc
STG
4
Sustain Gated Power Rail Fixed Fixed Fixed
V
DD2
Integrated Memory Controller
Power Rail
Fixed (Memory
technology
dependent)
Fixed (Memory
technology depen-
dent)
Fixed (Memory
technology depen-
dent)
Notes:
1. FIVR = Fully Integrated Voltage Regulator, refer to 13.1.2, Full Integrated Voltage Regulator (FIVR)
2. For details regarding each rail’s VR.
3. Vcc
IN_AUX
has a few discrete voltages defined by PCH VID.
4. Vcc
ST
and Vcc
STG
these rails are not connect to external voltage regulator moreover they are connected to
the VCC1P05 power rail (from PCH) through a power gate.
5. Power rail exist only in H SKU.
Datasheet, Volume 1 of 2 147
requests according to this calibrated curve using the serial voltage-identifier (SVID)
interface. Altering the voltage applied at the processor/chipset causing operation
outside of this calibrated curve is considered out-of-specification operation.
The SVID bus consists of three open-drain signals: clock, data, and alert# to both set
voltage-levels and gather telemetry data from the voltage regulators. Voltages are
controlled per an 8-bit integer value, called a VID, that maps to an analog voltage level.
An offset field also exists that allows altering the VID table. Alert can be used to inform
the processor that a voltage-change request has been completed or to interrupt the
processor with a fault notification.
For VID coding and further information, refer to the IMVP9 PWM Specification and
Serial VID (SVID) Protocol Specification.
13.2 DC Specifications
The processor DC specifications in this section are defined at the processor signal pins,
unless noted otherwise. For pin listing, refer to 11
th
Generation Intel
®
Core™ Processor
Line Package Ballout Mechanical Specification.
• The DC specifications for the LPDDR4x/DDR4 signals are listed in the Voltage and
Current Specifications section.
• The Voltage and Current Specifications section lists the DC specifications for the
processor and are valid only while meeting specifications for junction temperature,
clock frequency, and input voltages. Read all notes associated with each parameter.
• AC tolerances for all rails include voltage transients and voltage regulator voltage
ripple up to 1 MHz. Refer additional guidance for each rail.
13.2.1 Processor Power Rails DC Specifications
13.2.1.1 Vcc
IN
DC Specifications
Table 13-1. Processor Vcc
IN
Active and Idle Mode DC Voltage and Current Specifications
(Sheet 1 of 3)
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
Operating Voltage
Voltage Range
for Processor
Operating Mode
UP3/ UP3-
RefreshUP4/H35
Processor Lines
0 — 2.0 V 1,2,3, 7,12
Operating Voltage
Voltage Range
for Processor
Operating Mode
H Processor Line 0 — 2.05 V 1,2,3, 7,12
IccMAX
(UP3 Processor)
Maximum
Processor
I
CC
UP3 Processor UP3-
RefreshLine (28W)
4-Core GT2
— — 65 A
4,5,6,7,11
IccMAX
(H35 Processor)
Maximum
Processor
I
CC
H35 Processor Line
(35W)
4-Core GT2
— — 65 A
4,5,6,7,11
IccMAX
(UP3 Processor)
Maximum
Processor
I
CC
UP3 Processor Line
(28W)
2-Core GT2
— — 35 A
4,5,6,7,11
148 Datasheet, Volume 1 of 2
IccMAX
(UP3 Processor)
Maximum
Processor
I
CC
UP3 Processor Line
(15W)
Celeron
2-Core GT2
— — 35 A
4,5,6,7,11
IccMAX
(UP4 Processor)
Maximum
Processor
I
CC
UP4 Processor Line
(9W)
4-Core GT2
— — 42 A
4,5,6,7,11
IccMAX
(UP4 Processor)
Maximum
Processor
I
CC
UP4 Processor Line
(9W)
2-Core GT2
— — 25 A
4,5,6,7,11
IccMAX
(H Processor)
Maximum
Processor
I
CC
H Processor Line
(45W)
8-Core GT1
— — 105 A
4,5,6,7,11
H Processor Line
(45W)
6-Core GT1
— — 74 A
4,5,6,7,11
Icc
TDC
Thermal Design
Current (TDC)
for processor
Vcc
IN
Rail
— — — A 9
TOB
VCC
Voltage
Tolerance
PS0, PS1 — —
±20 mV 3, 6, 8
PS2, PS3 — —
±35
Ripple Ripple Tolerance
PS0, PS1 — —
±15 mV 3, 6, 8
PS2, PS3 — —
±30
DC_LL
Loadline slope
within the VR
regulation loop
capability
UP3/UP3-Refresh/
H35 Processor Lines
0 —
2.0
mΩ 10,13,14
DC_LL
Loadline slope
within the VR
regulation loop
capability
UP4 Processor Line
0
—
2.0
mΩ 10,13,14
DC_LL
Loadline slope
within the VR
regulation loop
capability
H Processor Line
(45W)
8-Core GT1
0 1.5
1.7
mΩ 10,13,14,15
DC_LL
Loadline slope
within the VR
regulation loop
capability
H Processor Line
(45W)
6 Core GT1
0 1.5
—
mΩ 10,13,14,15
AC_LL3
AC Loadline 3
(<1 MHz)
UP3/UP3-Refresh/
H35 4 Core
Processor Lines
— —
4.4
mΩ 10,13,14
AC_LL3
AC Loadline 3
(<1 MHz)
UP3 2 Core
Processor Line
— —
8.0
mΩ 10,13,14
AC_LL3
AC Loadline 3
(<1 MHz)
UP4 2 Core
Processor Line
— —
8.0
mΩ 10,13,14
AC_LL3
AC Loadline 3
(<1 MHz)
UP4 4 Cores
Processor Line
— —
4.7
mΩ 10,13,14
AC_LL3
AC Loadline 3
(<1 MHz)
H Processor Line
(45W)
8-Core GT1
— —
1.7
mΩ 10,13,14
Table 13-1. Processor Vcc
IN
Active and Idle Mode DC Voltage and Current Specifications
(Sheet 2 of 3)
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
Datasheet, Volume 1 of 2 149
13.2.1.2 VccIN_AUX DC Specifications
AC_LL3
AC Loadline 3
(<1 MHz)
H Processor Line
(45W)
6 Core GT1
— —
2.0
mΩ 10,13,14
T_OVS_TDP_MAX
Maximum
Overshoot time
TDP/virus
mode
— — —
500 μs
V_OVS
TDP_
MAX
/
virus_
MAX
Maximum
Overshoot at
TDP/virus
mode
— — —
10 %
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be
altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may
have different settings within the VID range. Note that this differs from the VID employed by the processor during a power
management event (Adaptive Thermal Monitor, Enhanced Intel Speed-step Technology, or low-power states).
3. The voltage specification requirements are measured across Vcc_SENSE and Vss_SENSE as near as possible to the processor. The
measurement needs to be performed with a 20 MHz bandwidth limit on the oscilloscope, 1.5 pF maximum probe capacitance, and
1 minimum impedance. The maximum length of the ground wire on the probe should be less than 5 mm. Ensure external noise
from the system is not coupled into the oscilloscope probe.
4. Processor Vcc
IN
VR to be designed to electrically support this current.
5. Processor Vcc
IN
VR to be designed to thermally support this current indefinitely.
6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
7. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
8. PSx refers to the voltage regulator power state as set by the SVID protocol.
9. LL measured at sense points.
10. Typ column represents Icc
MAX
for commercial application it is NOT a specification - it's a characterization of limited samples using
limited set of benchmarks that can be exceeded.
11. Operating voltage range in steady state.
12. LL spec values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
13. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly via the BIOS Load Line override setup
options. AC/DC Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior
board design with a shallower AC Load Line can improve on power, performance and thermals compared to boards designed for
POR impedance.
14. H-processor DC LL spec value is 1.5 mOhm, DC LL can be lower or equal to AC LL=1.7 mOhm.
Table 13-1. Processor Vcc
IN
Active and Idle Mode DC Voltage and Current Specifications
(Sheet 3 of 3)
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
Table 13-2. VccIN_AUX Supply DC Voltage and Current Specifications (Sheet 1 of 3)
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
VCCIN
AUX
Voltage Range
UP3/UP3-Refresh/
H35 Processor
Lines
— 1.8 —
V
1,2,3,7
VCCIN
AUX
Voltage Range
UP4 Processor
Line
— 1.65 1.8
V
1,2,3,7
VCCIN
AUX
Voltage Range
H Processor Line
— 1.8 —
V
1,2,3,7
Icc
MAX
Maximum
VccIN_AUX Icc
UP3/UP3-Refresh
Processor Line
(28W)
4/2-Core GT2
0 — 27
A 1,2
Icc
MAX
Maximum
VccIN_AUX Icc
H35 Processor
Line (35W)
4-Core GT2
0 — 27
150 Datasheet, Volume 1 of 2
Icc
MAX
Maximum
VccIN_AUX Icc
UP3 Processor
Line (15W)
Celeron
2-Core GT2
0 — 27
A 1,2
Icc
MAX
Maximum
VccIN_AUX Icc
UP4 Processor
Line (9W)
4/2-Core GT2
0 — 25 A 1,2
Icc
MAX
Maximum
VccIN_AUX Icc
H Processor Line
(45W)
8/6-Core GT1
0 — 42 A 1,2,8
TOB
VCC
Voltage
Tolerance
Budget
UP3/UP3-Refresh/
H35 Processor
Lines
— —
AC+DC: +5/-10 % 1,3,6
TOB
VCC
Voltage
Tolerance
Budget
UP4 Processor
Line
— —
DC Min: -4
AC+DC:± 7.5
% 1,3,6
TOB
VCC
Voltage
Tolerance
Budget
H Processor Line — —
AC+DC:+5/-10 % 1,3,6
VOS
Maximum
Overshoot
UP4 Processor
Line
— —
1.89
V 2,6
TVOS
Maximum
Overshoot
UP4 Processor
Line
— —
5
us 2,6
VOS
Maximum
Overshoot
UP3/UP3-Refresh/
H35 Processor
— —
1.95
V 2,6
TVOS
Maximum
Overshoot
UP3/H35
Processor Lines
— —
5
us 2,6
VOS
Maximum
Overshoot
H Processor Line
— —
1.89
V 2,6
TVOS
Maximum
Overshoot
H Processor Line — —
5
us 2,6
AC_LL AC Loadline
UP4 Processor
Line
— —
• 10 KHz-1 Mhz: 5.8
mΩ 4,5
UP3/UP3-Refresh/
H35 Processor
Lines
— —
• 10 KHz-1 Mhz: 6.9
mΩ 4,5
AC_LL AC Loadline
H Processor Line
— —
4.0 mΩ 4,5
DC_LL DC Loadline
H Processor Line
0
—
2.1 mΩ 4,5
DC_LL DC Loadline
UP3/UP3-Refresh/
H35 Processor
Lines
0
—
3.3 mΩ 4,5
UP4 Processor
Line
0
—
2.1 mΩ 4,5
Table 13-2. VccIN_AUX Supply DC Voltage and Current Specifications (Sheet 2 of 3)
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
Datasheet, Volume 1 of 2 151
13.2.1.3 V
DD2
DC Specifications
13.2.1.4 Vcc
ST
DC Specifications
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
3. The voltage specification requirements are measured across Vcc_SENSE and Vss_SENSE as near as possible to the
processor. The measurement needs to be performed with a 20 MHz bandwidth limit on the oscilloscope, 1.5 pF maximum
probe capacitance, and 1 minimum impedance. The maximum length of the ground wire on the probe should be less than
5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
4. LL measured at sense points. LL specification values should not be exceeded. If exceeded, power, performance, and
reliability penalty are expected.
5. The LL values are for reference. Must still need to meet the voltage tolerance specification.
6. Voltage Tolerance budget values Include ripples
7. Vcc
IN_AUX
is having few point of voltage define by PCH VID
8. VCCIN Aux ICCMAX includes both CPU and PCH, CPU will consume 27A and PCH 15A.
Table 13-3. Memory Controller (V
DD2
) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
V
DD2(LPDDR4x)
Processor I/O supply voltage for
LPDDR4x
UP3/UP3-
Refresh/UP4
Processor Lines
Typ-5% 1.115 Typ+5% V 3,4,5
V
DD2 (DDR4)
Processor I/O supply voltage for DDR4
UP3/UP3-
Refresh/H
Processor Lines
Typ-5% 1.2 Typ+5% V 3,4,5
TOB
VDD2
VDD2 Tolerance All V
DD2 MIN
<AC+DC< V
DD2 MAX
V 3,4,6
Icc
MAX_VDD2
(LPDDR4x)
Maximum Current for V
DD2
Rail
(LPDDR4x)
UP3/UP3-
Refresh/UP4
Processor Lines
— — 1.5 A
2
Icc
MAX_VDD2
(DDR4)
Maximum Current for V
DD2
Rail (DDR4) UP3/UP3-
Refresh
Processor Line
— — 1.5 A
2
Icc
MAX_VDD2
(DDR4)
Maximum Current for V
DD2
Rail (DDR4)
H Processor Line — — 4.3 2
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. The current supplied to the DIMM modules is not included in this specification.
3. Includes AC and DC error, where the AC noise is bandwidth limited to under 1 MHz, measured on package pins.
4. No requirement on the breakdown of AC versus DC noise.
5. The voltage specification requirements are measured on package pins as near as possible to the processor with an
oscilloscope set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum
length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the
oscilloscope probe.
6. For Voltage less than 1 V TOB will be 50 mV.
Table 13-4. Vcc Sustain (Vcc
ST
) Supply DC Voltage and Current Specifications (Sheet 1 of
2)
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2
Vcc
ST
Processor Vcc
Sustain supply
voltage
UP3/UP3-Refresh/H35
Processor Lines
— 1.025 — V 3
Vcc
ST
Processor Vcc
Sustain supply
voltage
UP4/H Processor Lines — 1.065 — V 3,6,7
Table 13-2. VccIN_AUX Supply DC Voltage and Current Specifications (Sheet 3 of 3)
Symbol Parameter Segment Minimum Typical Maximum Unit Note
1
152 Datasheet, Volume 1 of 2
13.2.1.5 Vcc
1P8A
DC Specifications
TOB
ST
Vcc
ST
Tolerance All AC+DC:± 5 % 3,5,7
Icc
MAX_ST
Maximum Current
for Vcc
ST
UP3/UP3-Refresh/H35
Processor Lines
— — 500
mA 4
Icc
MAX_ST
Maximum Current
for Vcc
ST
UP4 Processor Line
— — 300
mA 4
Icc
MAX_ST
Maximum Current
for Vcc
ST
H Processor Line
— — 970
mA 4
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
3. The voltage specification requirements are measured on package pins as near as possible to the processor with an oscilloscope
set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
4. The maximum Icc
MAX_ST
specification is preliminary and based on initial pre-silicon estimation and is subject to change.
5. For Voltage less than 1 V TOB will be 50 mV.
6. VCCST without PG will have typical of 1.025V, some collateral may indicate VCCST =1.025 V which present the typical voltage
without PG.
7. VCCST momentarily can go to 1.15V during certain scenarios, there is no side effect.
Table 13-5. Vcc Sustain Gated (Vcc
STG
) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2
Vcc
STG
Processor Vcc
Sustain gated
supply voltage
UP3/UP3-Refresh/
H35 Processor Lines
— 1.025 — V 3,7
Vcc
STG
Processor Vcc
Sustain gated
supply voltage
UP4/H Processor
Lines
— 1.065 — V 3,6,7
TOB
STG
Vcc
STG
Tolerance All AC+DC:± 5% % 3,5,7
Icc
MAX_STG
Maximum Current
for Vcc
STG
UP3/UP3-Refresh/
H35 Processor Lines
— — 300
mA 4
Icc
MAX_STG
Maximum Current
for Vcc
STG
UP4 Processor Line — — 250
mA 4
Icc
MAX_STG
Maximum Current
for Vcc
STG
H Processor Line — — 340
mA 4
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
3. The voltage specification requirements are measured on package pins as near as possible to the processor with an oscilloscope
set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
4. The maximum Icc
MAX_ST
specification is preliminary and based on initial pre-silicon estimation and is subject to change.
5. For Voltage less than 1 V TOB will be 50 mV.
6. VCCSTG without PG will have typical of 1.025 V, some collateral may indicate VCCSTG =1.025 V which present the typical
voltage without PG.
7. VCCSTG momentarily can go to 1.15V during certain scenarios, there is no side effect.
Table 13-4. Vcc Sustain (Vcc
ST
) Supply DC Voltage and Current Specifications (Sheet 2 of
2)
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2
Datasheet, Volume 1 of 2 153
13.2.1.6 DDR4 DC Specifications
Table 13-6. Vcc1P8A Supply DC Voltage and Current Specifications
Symbol Parameter Segment Minimum Typical Maximum Units Notes
1,2
Vcc
1P8A
Processor PCIE/DPIN
PHY supply voltage
H Processor Line
— 1.8 — V 3
TOB
1P8A
Vcc
1p8A
Tolerance
H Processor Line
AC+DC:± 5 % 3,5
Icc
MAX_1p8A
Maximum Current for
Vcc
1P8A
H Processor Line
— — 500
mA 4
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
3. The voltage specification requirements are measured on package pins as near as possible to the processor with an oscilloscope
set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope
probe.
4. The maximum Icc
MAX_1P8A
specification is preliminary and based on initial pre-silicon estimation and is subject to change.
5. For Voltage less than 1 V TOB will be 50 mV.
Table 13-7. DDR4 Signal Group DC Specifications (Sheet 1 of 2)
Symbol Parameter
UP3/H-Processor Line
Units Notes
1
Minimum Typical Maximum
V
IL
Input Low Voltage — 0.75*Vdd2 0.68*Vdd2 V 2, 3, 4
V
IH
Input High Voltage 0.82*Vdd2 0.75*Vdd2 — V 2, 3, 4
R
ON_UP(DQ)
Data Buffer pull-up Resistance 30 — 50 Ω 5,12
R
ON_DN(DQ)
Data Buffer pull-down Resistance 30 — 50
R
ODT(DQ)
On-die termination equivalent resistance
for data signals
40 — 200 Ω 6, 12
V
ODT(DC)
On-die termination DC working point
(driver set to receive mode)
0.45*Vdd2 — 0.85*Vdd2 V 12
R
ON_UP(CK)
Clock Buffer pull-up Resistance 25 — 45 Ω 5, 12
R
ON_DN(CK)
Clock Buffer pull-down Resistance 25 — 45 Ω 5, 12
R
ON_UP(CMD)
Command Buffer pull-up Resistance 25 — 45 Ω 5, 12
R
ON_DN(CMD)
Command Buffer pull-down Resistance 25 — 45 Ω 5, 12
R
ON_UP(CTL)
Control Buffer pull-up Resistance 25 — 45 Ω 5, 12
R
ON_DN(CTL)
Control Buffer pull-down Resistance 25 — 45 Ω 5, 12
R
ON_UP
(SM_PG_CNTL1)
System Memory Power Gate Control
Buffer Pull-up Resistance
45 — 125 Ω —
R
ON_DN
(SM_PG_CNTL1)
System Memory Power Gate Control
Buffer Pull- down Resistance
40 — 130 Ω —
I
LI
Input Leakage Current (DQ, CK)
0 V
0.2* V
DD2
0.8* V
DD2
— — 1.1 mA —
DDR0_VREF_DQ
DDR1_VREF_DQ
VREF output voltage
Trainable V
DD2
/2 Trainable V —
SM_RCOMP[0] Command COMP Resistance 99 100 101 Ω 8
SM_RCOMP[1] Data COMP Resistance 99 100 101 Ω 8
SM_RCOMP[2] ODT COMP Resistance 99 100 101 Ω 8
154 Datasheet, Volume 1 of 2
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. Timing specifications only depend on
the operating frequency of the memory channel and not the maximum rated frequency
2. V
IL
is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3. V
IH
is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
4. V
IH
and V
OH
may experience excursions above V
DD2
. However, input signal drivers should comply with the signal quality
specifications.
5. Pull up/down resistance after compensation (assuming ±5% COMP inaccuracy). Note that BIOS power training may change
these values significantly based on margin/power trade-off.
6. ODT values after COMP (assuming ±5% inaccuracy). BIOS MRC can reduce ODT strength towards
7. The minimum and maximum values for these signals are programmable by BIOS to one of the two sets.
8. SM_RCOMP[x] resistance should be provided on the system board with 1% resistors. SM_RCOMP[x] resistors are to VSS.
Values are pre-silicon estimations and are subject to change.
9. SM_DRAMPWROK must have a maximum of 15 ns rise or fall time over VDD2 * 0.30 ±100 mV and the edge must be
monotonic.
10. SM_VREF is defined as V
DD2
/2 for DDR4
11. R
ON
tolerance is preliminary and might be subject to change.
12. Maximum-minimum range is correct but center point is subject to change during MRC boot training.
13. Processor may be damaged if V
IH
exceeds the maximum voltage for extended periods.
Table 13-7. DDR4 Signal Group DC Specifications (Sheet 2 of 2)
Symbol Parameter
UP3/H-Processor Line
Units Notes
1
Minimum Typical Maximum
Datasheet, Volume 1 of 2 155
13.2.1.7 LPDDR4x DC Specifications
Table 13-8. LPDDR4x Signal Group DC Specifications
Symbol Parameter
UP3/UP4-Processor Line
Units Notes
1
Minimum Typical Maximum
V
IL
Input Low Voltage — 0.2*V
DD2
0.08*V
DD2
V 2, 3, 4
V
IH
0 = Input High Voltage 0.35*V
DD2
0.2*V
DD2
— V 2, 3, 4
R
ON_UP(DQ)
Data Buffer pull-up Resistance 30 — 50 Ω 5,12
R
ON_DN(DQ)
Data Buffer pull-down Resistance 30 — 50 Ω 5,12
R
ODT(DQ)
On-die termination equivalent
resistance for data signals
40 — 200 Ω 6, 12
V
ODT(DC)
On-die termination DC working point
(driver set to receive mode)
0.1*V
DD2
— 0.3*V
DD2
V 10
R
ON_UP(CK)
Clock Buffer pull-up Resistance 30 — 45 Ω 5, 12
R
ON_DN(CK)
Clock Buffer pull-down Resistance 30 — 45 Ω 5, 12
R
ON_UP(CMD)
Command Buffer pull-up Resistance 30 — 45 Ω 5, 12
R
ON_DN(CMD)
Command Buffer pull-down Resistance 30 — 45 Ω 5, 12
R
ON_UP(CTL)
Control Buffer pull-up Resistance 30 — 45 Ω 5, 12
R
ON_DN(CTL)
Control Buffer pull-down Resistance 30 — 45 Ω 5, 12
R
ON_UP
(SM_VTT_CTL1)
System Memory Power Gate Control
Buffer Pull-up Resistance
N/A — N/A Ω N/A
R
ON_DN
(SM_VTT_CTL1)
System Memory Power Gate Control
Buffer Pull- down Resistance
N/A — N/A Ω N/A
I
LI
Input Leakage Current (DQ, CK)
0 V
0.2* V
DD2
0.8* V
DD2
— — 1.1 mA —
DDR0_VREF_DQ
DDR1_VREF_DQ
DDR_VREF_CA
VREF output voltage
Trainable V —
SM_RCOMP[0] Command COMP Resistance 99 100 101 Ω 8
SM_RCOMP[1] Data COMP Resistance 99 100 101 Ω 8
SM_RCOMP[2] ODT COMP Resistance 99 100 101 Ω 8
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.Timing specifications only depend
on the operating frequency of the memory channel and not the maximum rated frequency
2. V
IL
is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3. V
IH
is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
4. V
IH
and V
OH
may experience excursions above V
DD2
. However, input signal drivers should comply with the signal quality
specifications.
5. Pull up/down resistance after compensation (assuming ±5% COMP inaccuracy). Note that BIOS power training may change
these values significantly based on margin/power trade-off.
6. ODT values after COMP (assuming ±5% inaccuracy). BIOS MRC can reduce ODT strength towards
7. The minimum and maximum values for these signals are programmable by BIOS to one of the two sets.
8. SM_RCOMP[x] resistance should be provided on the system board with 1% resistors. SM_RCOMP[x] resistors are to VSS.
Values are pre-silicon estimations and are subject to change.
9. SM_DRAMPWROK must have a maximum of 15 ns rise or fall time over V
DD2
* 0.30 ±100 mV and the edge must be
monotonic.
10. SM_VREF is defined as V
DD2
/2 for DDR4/LPDDR4x
11. R
ON
tolerance is preliminary and might be subject to change.
12. Maximum-minimum range is correct but center point is subject to change during MRC boot training.
13. Processor may be damaged if V
IH
exceeds the maximum voltage for extended periods.
156 Datasheet, Volume 1 of 2
13.2.1.8 PCI Express* Graphics (PEG) DC Specifications
13.2.1.9 Digital Display Interface (DDI) DC Specifications
Symbol Parameter Min Typ Max Units Notes
1
Z
TX-DIFF-DC
DC Differential Tx Impedance 80 100 120 Ω 1, 5
Z
RX-DC
DC Common Mode Rx Impedance 40 50 60 Ω 1, 4
Z
RX-DIFF-DC
DC Differential Rx Impedance 80 — 120 Ω 1
PEG_RCOMP resistance compensation 24.75 25 25.25 Ω 2, 3
Notes:
1. Refer the PCI Express Base Specification for more details.
2. Low impedance defined during signaling. Parameter is captured for 5.0 GHz by RLTX-DIFF.
3. PEG_RCOMP resistance should be provided on the system board with 1% resistors. COMP resistors are to VCCIO_OUT.
PEG_RCOMP- Intel allows using 24.9 Ω 1% resistors.
4. DC impedance limits are needed to ensure Receiver detect.
5. The Rx DC Common Mode Impedance should be present when the Receiver terminations are first enabled to ensure that
the Receiver Detect occurs properly.Compensation of this impedance can start immediately and the 15 Rx Common Mode
Impedance (constrained by RLRX-CM to 50 Ω ±20%) should be within the specified range by the time Detect is entered.
Table 13-10. DSI HS Transmitter DC Specifications
Parameter Description Minimum Nom Max Units Notes
1
V
CMTX
HS transmit static common-mode voltage 150 200 250 mV 1
|V
CMTX(1,0)
| V
CMTX
mismatch when output is Differential-1
or Differential-0
— — 5 mV 2
|V
OD
| HS transmit differential voltage 140 200 270 mV 1
|V
OD
| V
OD
mismatch when output is Differential-1
or Differential-0
— — 14 mV 2
V
OHHS
HS output high voltage — — 360 mV 1
Z
OS
Single ended output impedance 40 50 62.5 Ω
Z
OS
Single ended output impedance mismatch — — 10 %
Notes:
1. Value when driving into load impedance anywhere in the ZID range.
2. A transmitter should minimize V
OD
and V
CMTX(1,0)
in order to minimize radiation, and optimize signal integrity
Table 13-11. DSI LP Transmitter DC Specifications (Sheet 1 of 2)
Parameter Description Minimum Nominal Maximum Units Notes
1
V
OH
Thevenin output high level 1.1 1.05 1.3 V 1
0.95 — 1.3 V 2
V
OL
Thevenin output low level -50 — 50 mV
Z
OLP
Output impedance of LP transmitter 110 — — Ω 3
V
pin
Pin signal voltage range -50 — 1350 mV
I
LEAK
Pin Leakage current -10 — 10 uA 4
V
GNDSH
Ground shift -50 — 50 mV
V
pin(ABSMAX)
Transient pin voltage level -0.15 — 1.45 V 6
T
Vpin(ABSMAX)
Maximum transient time above
VPIN(MAX) or below VPIN(MIN)
— — 20 ns 5
Datasheet, Volume 1 of 2 157
13.2.1.10 embedded DisplayPort* (eDP*) DC Specification
13.2.1.11 MIPI* CSI-2 D-Phy Receiver DC Specifications
Notes:
1. Applicable when the supported data rate <= 1.5 Gbps.
2. Applicable when the supported data rate > 1.5 Gbps.
3. Though no maximum value for ZOLP is specified, the LP transmitter output impedance shall ensure the TRLP/TFLP
specification is met.
4. The voltage overshoot and undershoot beyond the VPIN is only allowed during a single 20ns window after any LP-0 to LP-1
transition or vice versa. For all other situations it must stay within the VPIN range.
5. This value includes ground shift.
Table 13-12. Digital Display Interface Group DC Specifications (DP/HDMI)
Symbol Parameter Minimum Typical Maximum Units Notes
1
V
IL
Aux Input Low Voltage — — 0.8 V
V
IH
Aux Input High Voltage 2.25 — 3.6 V
V
OL
DDIx_TX[3:0] Output Low Voltage
TCPx_TX[3:0] Output Low Voltage
— —
0.25*Vcc
IO_O
UT
V 1,2
V
OH
DDIx_TX[3:0] Output high Voltage
TCPx_TX[3:0] Output high Voltage
0.75*Vcc
IO_
OUT
— — V 1,2
Z
TX-DIFF-DC DC Differential Tx Impedance 100 — 120 Ω
Notes:
1. Vcc
IO_OUT
depends on segment.
2. V
OL
and V
OH
levels depends on the level chosen by the Platform.
Table 13-13. DP-IN Group DC Specifications
Symbol Parameter Minimum Typical Maximum Units Notes
1
V
OL
DPIPx HPD low level 0 — - V 1,2
V
OH
DPIPx HPD high level — Vcc
IO_OUT
V 1,2
Notes:
1. Vcc
IO_OUT
depends on segment.
2. x is referring to ports 0-3.
Symbol Parameter Minimum Typical Maximum Units
V
OL
eDP_DISP_UTIL Output Low Voltage — — 0.1*Vcc
IO_OUT
V
V
OH
eDP_DISP_UTIL Output High Voltage 0.9*Vcc
IO_O
UT
— — V
R
UP
eDP_DISP_UTIL Internal pull-up 45 — — Ω
R
DOWN
eDP_DISP_UTIL Internal pull-down 45 — — Ω
Notes:
1. COMP resistance is to V
COMP_OUT
.
2. eDP_RCOMP resistor should be provided on the system board.
Symbol Parameter Minimum Typical Maximum Units Notes
V
CMRX(DC)
Common-mode voltage HS receive
mode
70 — 330 mV 1,2
Table 13-11. DSI LP Transmitter DC Specifications (Sheet 2 of 2)
Parameter Description Minimum Nominal Maximum Units Notes
1
158 Datasheet, Volume 1 of 2
13.2.1.12 CMOS DC Specifications
13.2.1.13 GTL and OD DC Specification
V
IDTH
Differential input high threshold
— — 70 mV 3
— — 40 mV 4
V
IDTL
Differential input low threshold -70 — — mV 3
-40 — — mV 4
V
IHHS
Single-ended input high voltage — — 460 mV 1
V
ILHS
Single-ended input low voltage -40 — — mV 1
V
TERM-EN
Single-ended threshold for HS
termination enable
— — 450 mV
Z
ID
Differential input impedance 80 100 125 Ω
Notes:
1. Excluding possible additional RF interference of 100 mV peak sine wave beyond 450 MHz
2. This table value includes a ground difference of 50 mV between the transmitter and the receiver, the static common-mode
level tolerance and variations below 450 MHz
3. For devices supporting data rates < 1.5 Gbps.
4. For devices supporting data rates > 1.5 Gbps.
5. Associated Signals: MIPI* CSI2: Refer to MIPI
®
Alliance D-PHY Specification 1.2.
Table 13-14. CMOS Signal Group DC Specifications
Symbol Parameter Minimum Maximum Units Notes
1
V
IL
Input Low Voltage — Vcc*0.3 V 2, 5
V
IH
Input High Voltage Vcc*0.7 — V 2, 4, 5
R
ON
Buffer on Resistance 20 70 Ω -
I
LI
Input Leakage Current — ±150 μA 3
V
HYSTERESIS
Hysteresis Voltage 0.15*Vcc — V -
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The Vcc referred to in these specifications refers to instantaneous Vcc
ST/IO
.
3. For V
IN
between “0” V and Vcc
ST
. Measured when the driver is tri-stated.
4. V
IH
may experience excursions above Vcc
ST
. However, input signal drivers should comply with the signal quality
specifications.
5. Voh and Vol need to comply with Vil and Vih specs.
Table 13-15. GTL Signal Group and Open Drain Signal Group DC Specifications (Sheet 1 of
2)
Symbol Parameter Minimum Maximum Units Notes
1
V
IL
Input Low Voltage (TAP, except PROC_JTAG_TCK,
PROC_JTAG_TRST#)
— 0.6*Vcc V 2, 5
V
IH
Input High Voltage (TAP, except PROC_JTAG_TCK,
PROC_JTAG_TRST#)
0.72*Vcc — V 2, 4, 5
V
IL
Input Low Voltage
(PROC_JTAG_TCK,PROC_JTAG_TRST#)
— 0.3*Vcc V 2, 5
V
IH
Input High Voltage
(PROC_JTAG_TCK,PROC_JTAG_TRST#)
0.7*Vcc — V 2, 4, 5
V
HYSTERESIS
Hysteresis Voltage 0.2*Vcc — V -
R
ON
Buffer on Resistance (TDO) 7 17 Ω -
Symbol Parameter Minimum Typical Maximum Units Notes
Datasheet, Volume 1 of 2 159
13.2.1.14 PECI DC Characteristics
The PECI interface operates at a nominal voltage set by Vcc
ST
. The set of DC electrical
specifications shown in the following table is used with devices normally operating from
a Vcc
ST
interface supply.
Vcc
ST
nominal levels will vary between processor families. All PECI devices will operate
at the Vcc
ST
level determined by the processor installed in the system.
V
IL
Input Low Voltage (other GTL) — 0.6*Vcc V 2, 5
V
IH
Input High Voltage (other GTL) 0.72*Vcc — V 2, 4, 5
R
ON
Buffer on Resistance (BPM) 12 28 Ω -
R
ON
Buffer on Resistance (other GTL) 16 24 Ω -
I
LI
Input Leakage Current — ±150 μA 3
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The Vcc referred to in these specifications refers to instantaneous Vcc
ST/IO
.
3. For V
IN
between 0 V and Vcc. Measured when the driver is tri-stated.
4. V
IH
and V
OH
may experience excursions above Vcc. However, input signal drivers should comply with the signal quality
specifications.
Table 13-15. GTL Signal Group and Open Drain Signal Group DC Specifications (Sheet 2 of
2)
Symbol Parameter Minimum Maximum Units Notes
1
Table 13-16. PECI DC Electrical Limits
Symbol Definition and Conditions Minimum Maximum Units Notes
1
R
up
Internal pull up resistance 15 45 Ω 3
V
in
Input Voltage Range
-0.15
Vcc
ST
+
0.15
V -
V
hysteresis
Hysteresis 0.1 * Vcc
ST
— V -
V
IL
Input Voltage Low- Edge Threshold
Voltage
0.275 *
Vcc
ST
0.525 *
Vcc
ST
V -
V
IH
Input Voltage High- Edge Threshold
Voltage
0.550 *
Vcc
ST
0.725 *
Vcc
ST
V -
C
bus
Bus Capacitance per Node — 10 pF -
C
pad
Pad Capacitance 0.7 1.8 pF -
Ileak000 leakage current @ 0V — 0.25 mA -
Ileak100 leakage current @ Vcc
ST
— 0.15 mA -
Notes:
1. Vcc
ST
supplies the PECI interface. PECI behavior does not affect Vcc
ST
minimum/maximum
specifications.
2. The leakage specification applies to powered devices on the PECI bus.
3. The PECI buffer internal pull up resistance measured at 0.75* Vcc
ST
.
4. Ileak100 represents the worst case leakage at 100 DegC.
160 Datasheet, Volume 1 of 2
Input Device Hysteresis
The input buffers in both client and host models should use a Schmitt-triggered input
design for improved noise immunity. Use the following figure as a guide for input buffer
design.
§ §
Figure 13-1. Input Device Hysteresis
Minimum V
P
Maximum V
P
Minimum V
N
Maximum V
N
PECI High Range
PECI Low Range
Valid Input
Signal Range
Minimum
Hysteresis
V
TTD
PECI Ground
Datasheet, Volume 1 of 2 161
14 Package Mechanical
Specifications
14.1 Package Mechanical Attributes
The UP3/UP4 Processor Lines use a Flip Chip technology available in a Ball Grid Array
(BGA) package. The following table provides an overview of the package mechanical
attributes.
14.2 Package Loading and Die Pressure Specifications
Intel has defined the maximum total compressive load limits that can be applied to the
package for the following processor lines. These values should not be exceeded by the
system design.
14.2.1 Package Loading Specifications
• Considerations should be made to ensure steady state static loading on the
packages that does not exceed the limits recommended. Excessive steady state
static loading can induce solder ball cracks, especially over a period of time
resulting in higher failure rate.
• This static compressive load is not to be exceeded, therefore the tolerance of the
package and the tolerances of the thermal solution (including attach mechanism)
Table 14-1. Package Mechanical Attributes
Package Parameter
UP4-Processor Line UP3- Processor Line H-Processor Line
4/2 Core GT2 4/2 Core GT2 8/6 Core GT1
Package
Technology
Package Type Flip Chip Ball Grid Array Flip Chip Ball Grid Array
Flip Chip Ball Grid
Array
Interconnect Ball Grid Array (BGA) Ball Grid Array (BGA)
Ball Grid Array
(BGA)
Lead Free Yes Yes Yes
Halogenated Flame
Retardant Free
Yes Yes Yes
Package
Configuration
Solder Ball Composition SAC405 SAC405 SAC405
Ball/Pin Count 1598 1449 1787
Grid Array Pattern Balls Anywhere Balls Anywhere Balls Anywhere
Land Side Capacitors
Yes (250um maximum
height)
Yes (250 um maximum
height)
Yes (250 um
maximum height)
Die Side Capacitors No No No
Die Configuration
2 Dice Multi-Chip Package
(MCP)
2 Dice Multi-Chip Package
(MCP)
1 Die Single-Chip
Package
Package
Dimensions
Nominal Package Size 18.5x26.5 mm 25x45.5 mm 50x26.5
Z 0.963 +/-0.077 mm 1.185 +/-0.096 mm 1.41 +/- 0.109 mm
Minimum Ball/Pin pitch 0.4 mm 0.65 mm 0.65 mm
162 Datasheet, Volume 1 of 2
should be taken into account when calculating or measuring static load on the
package.
• An ideal thermal solution design would apply a load as uniform as possible on all
dies in order to optimize thermal performance and minimize mechanical risk.
Table 14-2. Package Loading Specifications
14.2.2 Die Pressure Specifications
A more relevant metric for concentrated loading is chosen by Intel based on the physics
of failure to evaluate die damage risk due to thermal solution enabling
Static Compressive pressure refers to the long term steady state pressure applied to
the die from the thermal solution after system assembly is complete.
Transient Compressive pressure refers to the pressure on the dice at any moment
during the thermal solution assembly/disassembly procedures. Other system
procedures such as repair/rework can also cause high pressure loading to occur on the
die and should be evaluated to ensure these limits are not exceeded.
Metric: This metric is pressure over a 2 mm x 2 mm area
Package
Maximum Static
Compressive Load [lbf]
Backing Plate
Allowable
Adhesive
Minimum PCB Thickness
Assumptions [mm/mils]
UP3-Processor Line
15 Yes
1
No 0.8/32
10 Yes
1
No 0.7/28
UP4-Processor Line
10 No No 0.7/28
5 No Yes
2
0.6/24
H-Processor Line 25 Yes
1
No 0.8/32
Notes:
1. If using backing plate, recommended maximum back plate thickness is 0.5mm.
2. At a minimum, corner glue is required.
Table 14-3. Package Loading Specifications
Package
Static Compressive Pressure
1
[PSI]
Transient Compressive Pressure
1
[PSI]
UP4-Processor Line 800 800
UP3-Processor Line 800 800
H-Processor Line 800 800
Note: This is the load and pressure that has been tested by Intel for a single assembly cycle. This metric is
a pressure over 2 mm
2
(2 mm x 2 mm) area.
Datasheet, Volume 1 of 2 163
14.3 Package Storage Specifications
§ §
Parameter Description Minimum Maximum Notes
T
ABSOLUTE STORAGE
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when subjected to this
temperature for any length of time in Intel
Original sealed moisture barrier bag and /
or box.
-25 °C 125 °C 1, 2, 3
T
SUSTAINED STORAGE
The ambient storage temperature limit (in
shipping media) for the sustained period of
time.
-5 °C 40 °C 1, 2, 3
RH
SUSTAINED STORAGE
The maximum device storage relative
humidity for the sustained period of time as
specified below in Intel Original sealed
moisture barrier bag and / or box
60% @ 24 °C 1, 2, 3
TIME
SUSTAINED STORAGE
Maximum time: associated with customer
shelf life in Intel Original sealed moisture
barrier bag and / or box
NA
Moisture Sensitive
Devices: 60 months
from bag seal date;
Non-moisture
sensitive devices: 60
months from lot date
1, 2, 3
Storage Conditions
Processors in a non-operational state may be installed in a platform, in a tray, boxed, or loose and
may be sealed in airtight package or exposed to free air. Under these conditions, processor
landings should not be connected to any supply voltages, have any I/Os biased, or receive any
clocks. Upon exposure to “free air” (that is, unsealed packaging or a device removed from
packaging material), the processor should be handled in accordance with moisture sensitivity
labeling (MSL) as indicated on the packaging material. Boxed Land Grid Array packaged (LGA)
processors are MSL 1 (‘unlimited’ or unaffected) as they are not heated in order to be inserted in
the socket.
Notes:
1. T
ABSOLUTE STORAGE
applies to the un-assembled component only and does not apply to the shipping media, moisture barrier
bags or desiccant. Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount re-flow are specified by applicable JEDEC
J-STD-020 and MAS documents. The JEDEC, J-STD-020 moisture level rating and associated handling practices apply to all
moisture sensitive devices removed from the moisture barrier bag.
3. Post board attaches storage temperature limits are not specified for non-Intel branded boards. Contact your board
manufacturer for storage specifications.
164 Datasheet, Volume 1 of 2
15 CPU And Device IDs
15.1 CPUID
The processor ID and stepping can be identified by the following register contents:
• The Extended Family, Bits [27:20] are used in conjunction with the Family Code,
specified in Bits[11:8], to indicate whether the processor belongs to the Pentium®,
Celeron®, or Intel® Core™ processor family.
• The Extended Model, Bits [19:16] in conjunction with the Model Number, specified
in Bits [7:4], are used to identify the model of the processor within the processor's
family.
• The Family Code corresponds to Bits [11:8] of the EDX register after RESET, Bits
[11:8] of the EAX register after the CPUID instruction is executed with a 1 in the
EAX register, and the generation field of the Device ID register accessible through
Boundary Scan.
• The Model Number corresponds to Bits [7:4] of the EDX register after RESET, Bits
[7:4] of the EAX register after the CPUID instruction is executed with a 1 in the EAX
register, and the model field of the Device ID register accessible through Boundary
Scan.
• The Stepping ID in Bits [3:0] indicates the revision number of that model.
• When EAX is initialized to a value of '1', the CPUID instruction returns the Extended
Family, Extended Model, Processor Type, Family Code, Model Number and Stepping
ID value in the EAX register. Note that the EDX processor signature value after
reset is equivalent to the processor signature output value in the EAX register.
Cache and TLB descriptor parameters are provided in the EAX, EBX, ECX and EDX
registers after the CPUID instruction is executed with a 2 in the EAX register.
15.2 PCI Configuration Header
Note: Every PCI-compatible function has a standard PCI configuration header, as shown in
Table 15-2, “PCI Configuration Header”. This includes mandatory registers (Bold) to
Table 15-1. CPUID Format
SKU CPUID
Reserved
[31:28]
Extended
Family
[27:20]
Extended
Model
[19:16]
Reserved
[15:14]
Processor
Type
[13:12]
Family
Code
[11:8]
Model
Number
[7:4]
Stepping
ID
[3:0]
UP4/UP3/
H35 806C1h Reserved 0000000b 1000b Reserved 00b 0110b 1100b 0001b
UP3-Refresh 806C2h Reserved 0000000b 1000b Reserved 00b 0110b 1100b 0010b
H35-Refresh 806C2h Reserved 0000000b 1000b Reserved 00b 0110b 1100b 0010b
H 806D1h Reserved 0000000b 1000b Reserved 00b 0110b 1101b 0001b
Datasheet, Volume 1 of 2 165
determine which driver to load for the device. Some of these registers define ID values
for the PCI function, which are described in this chapter.
Table 15-2. PCI Configuration Header
Byte3 Byte2 Byte1 Byte0 Address
Device ID Vendor ID (0x8086) 00h
Status Command 04h
Class Code Revision ID 08h
BIST Header Type Latency Timer Cache Line Size 0Ch
Base Address Register0 (BAR0) 10h
Base Address Register1 (BAR1) 14h
Base Address Register2 (BAR2) 18h
Base Address Register3 (BAR3) 1Ch
Base Address Register4 (BAR4) 20h
Base Address Register5 (BAR5) 24h
Card-bus CIS Pointer 28h
Subsystem ID Subsystem Vendor ID 2Ch
Expansion ROM Base Address 30h
Reserved
Capabilities
Pointer
34h
Reserved 38h
Maximum Latency Minimum Grant Interrupt Pin Interrupt Line 3Ch
Table 15-3. Host Device ID (DID0)
Platform Device ID
UP4 4 Cores 9A12h
UP4 2 Cores 9A02h
UP3 4 Cores 9A14h
UP3 2 Cores 9A04h
H35 4 Cores 9A14h
UP3-Refresh/H35-Refresh 4 Cores 9A1Ah
H 8 Cores 9A36h
H 6 Cores 9A26h
Table 15-4. Other Device ID UP3/UP4/H35/UP3-Refresh/H35-Refresh (Sheet 1 of 2)
Device Processor Line Bus / Device / Function DID
DTT All 0 / 4 / 0 9A03h
IPU UP4, UP3 0 / 5 / 0 9A19h
PEG60 All 0 / 6 / 0 9A09h
TBT_PCIe0 All 0 / 7 / 0 9A23h
TBT_PCIe1 All 0 / 7 / 1 9A25h
TBT_PCIe2 All 0 / 7 / 2 9A27h
TBT_PCIe3 All 0 / 7 / 3 9A29h
GNA All 0 / 8 / 0 9A11h
166 Datasheet, Volume 1 of 2
Table 15-5. Other Device IDs (H Processor Line)
NPK All 0 / 9 / 0 9A33h
Crash-log SRAM All 0 / 10 / 0 9A0Dh
USB xHCI UP4, UP3 0 / 13 / 0 9A13h
USB xDCI UP4, UP3 0 / 13 / 1 9A15h
TBT DMA0 All 0 / 13 / 2 9A1Bh
TBT DMA1 All 0 / 13 / 3 9A1Dh
VMD All 0 / 14 / 0 9A0Bh
Device Bus / Device / Function DID
PCIe RC 010 (x16) 0 / 1 / 0 9A01h
PCIe RC 011 (x8) 0 / 1 / 1 9A05h
PCIe RC 012 (x4) 0 / 1 / 2 9A07h
DPTF/DPPM 0 / 4 / 0 9A03h
IPU 0 / 5 / 0 9A39h
PCIe RC 060 (x4) 0 / 6 / 0 9A0Fh
TBT_PCIe0 0 / 7 / 0 9a2Bh
TBT_PCIe1 0 / 7 / 1 9a2Dh
TBT_PCIe2 0 / 7 / 2 9a2fh
TBT_PCIe3 0 / 7 / 3 9a31h
GNA 0 / 8 / 0 9A11h
NPK 0 / 9 / 0 9A33h
Crash-log SRAM 0 / 10 / 0 9A0Dh
USB xHCI 0 / 13 / 0 9A17h
USB xDCI 0 / 13 / 1 9A15h
TBT DMA0 0 / 13 / 2 9a1fh
TBT DMA1 0 / 13 / 3 9a21h
VMD 0 / 14 / 0 9A0Bh
Table 15-4. Other Device ID UP3/UP4/H35/UP3-Refresh/H35-Refresh (Sheet 2 of 2)
Device Processor Line Bus / Device / Function DID
Datasheet, Volume 1 of 2 167
Table 15-6. Graphics Device ID (DID2)
§ §
SKU #EUs Processor Step GT SKU Device 2 ID Device 2 Rev
UP4
4+2/2+2
96/80 B0 GT2 9A40h 1h
UP4
4+2/2+2
48 B0 GT2 9A78h 1h
UP3
4+2/2+2
96/80 B0 GT2 9A49h 1h
UP3
4+2/2+2
48 B0 GT2 9A78h 1h
H35
4+2
96/80 B0 GT2 9A49h 1h
UP3-Refresh
4+2
96/80 C0 GT2 9A49h 3h
H35-Refresh
4+2
96/80 C0 GT2 9A49h 3h
H
8+1/6+1
32 R0 GT1 9A60h 1h
H
8+1/6+1
16 R0 GT1 9A68h 1h
168 Datasheet, Volume 1 of 2
Datasheet, Volume 1 of 2 1
1-1 11
th
Generation Intel
®
Core™ Processor Lines ........................................................... 12
1-2 Operating Systems Support ..................................................................................... 18
1-3 Terminology .......................................................................................................... 18
1-4 Special marks ........................................................................................................ 21
3-1 System States ....................................................................................................... 56
3-2 Integrated Memory Controller (IMC) States ............................................................... 57
3-3 G, S, and C Interface State Combinations.................................................................. 57
3-4 Core C-states ........................................................................................................ 59
3-5 Package C-States ................................................................................................... 61
3-6 Deepest Package C-State Available........................................................................... 64
3-7 TCSS Power State .................................................................................................. 64
3-8 Package C-States with PCIe* Link States Dependencies............................................... 68
4-1 Configurable TDP Modes.......................................................................................... 73
4-2 TDP Specifications .................................................................................................. 82
4-3 Package Turbo Specifications ................................................................................... 84
4-4 Junction Temperature Specifications ......................................................................... 85
5-1 DDR Support Matrix Table ....................................................................................... 86
5-2 Processor DDR Speed Support ................................................................................. 86
5-4 LPDDR4x Channels Population Rules ......................................................................... 87
5-5 DDR4 Memory Down Channels Population Rules ......................................................... 87
5-3 DDR Technology Support Matrix ............................................................................... 87
5-6 H DDR4 SoDIMM Population Configuration ................................................................. 88
5-7 Supported DDR4 SoDIMM Module Configurations........................................................ 89
5-8 Supported DDR4 Memory Down Device Configurations ................................................ 89
5-9 Supported LPDDR4x x32 DRAMs Configurations.......................................................... 89
5-10 Supported LPDDR4x x64 DRAMs Configurations......................................................... 90
5-11 DDR4 System Memory Timing Support...................................................................... 90
5-12 LPDDR4x System Memory Timing Support ................................................................. 91
5-13 System Agent Enhanced Speed Steps (SA-GV) and Gear Mode Frequencies ................... 91
5-14 ECC H-Matrix Syndrome Codes ................................................................................ 94
5-15 Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping........................................ 95
6-1 USB-C* Port Configuration .................................................................................... 101
6-2 USB-C* Lanes Configuration .................................................................................. 102
6-3 USB-C* Non-Supported Lane Configuration ............................................................. 102
6-4 PCIe via USB4 Configuration.................................................................................. 104
7-1 PCI Express* 4 -lane Bifurcation and Lane Reversal Mapping...................................... 105
7-2 PCI Express* 16-lane Bifurcation and Lane Reversal Mapping..................................... 105
7-3 PCI Express* Maximum Transfer Rates and Theoretical Bandwidth.............................. 107
9-1 Hardware Accelerated Video Decoding..................................................................... 112
9-2 Hardware Accelerated Video Encode ....................................................................... 113
10-1 Display Ports Availability and Link Rate ................................................................... 116
10-2 Display Resolutions and Link Bandwidth for Multi-Stream Transport Calculations........... 120
10-3 DisplayPort Maximum Resolution............................................................................ 121
10-4 HDMI Maximum Resolution ................................................................................... 122
10-5 Embedded DisplayPort Maximum Resolution ............................................................ 123
10-6 MIPI* DSI Maximum Resolution ............................................................................ 124
10-7 Processor Supported Audio Formats over HDMI and DisplayPort*................................ 124
11-1 CSI-2 Lane Configuration for UP3-Processor Line ...................................................... 128
11-2 CSI-2 Lane Configuration for UP4-Processor Line ...................................................... 128
11-3 CSI-2 Lane Configuration for H-Processor Line ......................................................... 129
12-1 Signal Tables Terminology..................................................................................... 130
12-2 DDR4 Memory Interface........................................................................................ 132
12-3 LPDDR4x Memory Interface ................................................................................... 135
12-4 DMI Interface Signals ........................................................................................... 136
12-5 Processor Clocking Signals..................................................................................... 142
2 Datasheet, Volume 1 of 2
12-6 Processor Power Rails Signals................................................................................. 143
12-7 Processor Pull-up Power Rails Signals ...................................................................... 144
12-8 GND, RSVD, and NCTF Signals ...............................................................................145
13-1 Processor Vcc
IN
Active and Idle Mode DC Voltage and Current Specifications ................ 147
13-2 VccIN_AUX Supply DC Voltage and Current Specifications .......................................... 149
13-3 Memory Controller (VDD2) Supply DC Voltage and Current Specifications..................... 151
13-4 Vcc Sustain (VccST) Supply DC Voltage and Current Specifications.............................. 151
13-5 Vcc Sustain Gated (VccSTG) Supply DC Voltage and Current Specifications................... 152
13-7 DDR4 Signal Group DC Specifications ...................................................................... 153
13-6 Vcc1P8A Supply DC Voltage and Current Specifications.............................................. 153
13-8 LPDDR4x Signal Group DC Specifications ................................................................. 155
13-9 .......................................................................................................................... 155
13-10DSI HS Transmitter DC Specifications...................................................................... 156
13-11DSI LP Transmitter DC Specifications ...................................................................... 156
13-12Digital Display Interface Group DC Specifications (DP/HDMI) ......................................157
13-13DP-IN Group DC Specifications ............................................................................... 157
13-14CMOS Signal Group DC Specifications...................................................................... 158
13-15 GTL Signal Group and Open Drain Signal Group DC Specifications .............................. 158
13-16PECI DC Electrical Limits........................................................................................ 159
13-17System Reference Clocks DC and AC Specifications ...................................................160
14-1 Package Mechanical Attributes................................................................................ 161
14-2 Package Loading Specifications............................................................................... 162
14-3 Package Loading Specifications............................................................................... 162
15-1 CPUID Format ...................................................................................................... 164
15-2 PCI Configuration Header.......................................................................................165
15-3 Host Device ID (DID0) .......................................................................................... 165
15-4 Other Device ID UP3/UP4/H35/UP3-Refresh/H35-Refresh........................................... 165
15-5 Other Device IDs (H Processor Line)........................................................................166
15-6 Graphics Device ID (DID2)..................................................................................... 167
Datasheet, Volume 1 of 2 1
1-1 11
th
Generation Intel
®
Core™ UP3/UP4/H35/UP3-Refresh//H35-Refresh Processor Lines
Platform Diagram ................................................................................................... 13
1-2 H Processor Line Platform Diagram ........................................................................... 14
2-1 Example for PECI Host-Clients Connection ................................................................. 24
2-2 Example for PECI EC Connection .............................................................................. 25
2-3 Device to Domain Mapping Structures....................................................................... 29
2-4 Processor Cache Hierarchy ...................................................................................... 39
2-5 Processor Camera System ....................................................................................... 47
2-6 Telemetry Aggregator ............................................................................................. 49
3-1 UP3 and UP4 Processor Lines Power States ................................................................ 54
3-2 H Processor Line Power States ................................................................................. 55
3-3 Processor Package and IA Core C-States ................................................................... 56
3-4 Idle Power Management Breakdown of the Processor IA Cores ..................................... 58
3-5 Package C-State Entry and Exit................................................................................ 61
4-1 Package Power Control............................................................................................ 71
4-2 PROCHOT Demotion Signal Description ..................................................................... 79
5-1 Intel
®
DDR4 Flex Memory Technology Operations....................................................... 92
5-2 DDR4 Interleave (IL) and Non-Interleave (NIL) Modes Mapping.................................... 96
6-1 USB-C* Sub-system Block Diagram ........................................................................ 100
7-1 PCI Express* Related Register Structures in the Processor ......................................... 108
8-1 Example for DMI Lane Reversal Connection ............................................................. 110
10-1 Processor Display Architecture ............................................................................... 117
10-2 DisplayPort* Overview .......................................................................................... 119
10-3 HDMI* Overview .................................................................................................. 122
10-4 MIPI* DSI Overview ............................................................................................. 123
10-5 DP-IN Block Diagram ............................................................................................ 125
13-1 Input Device Hysteresis ....................................................................................... 160
2 Datasheet, Volume 1 of 2
Datasheet, Volume 1 of 2 1
1 Introduction ............................................................................................................ 12
1.1 Processor Volatility Statement............................................................................. 14
1.2 Package Support ............................................................................................... 14
1.3 Supported Technologies ..................................................................................... 15
1.3.1 API Support (Windows*) ......................................................................... 16
1.4 Power Management Support ............................................................................... 16
1.4.1 Processor Core Power Management........................................................... 16
1.4.2 System Power Management..................................................................... 16
1.4.3 Memory Controller Power Management...................................................... 17
1.4.4 Processor Graphics Power Management ..................................................... 17
1.4.4.1 Memory Power Savings Technologies ........................................... 17
1.4.4.2 Display Power Savings Technologies ............................................ 17
1.4.4.3 Graphics Core Power Savings Technologies................................... 17
1.5 Thermal Management Support ............................................................................ 17
1.6 Ball-out Information .......................................................................................... 18
1.7 Processor Testability .......................................................................................... 18
1.8 Operating Systems Support ................................................................................ 18
1.9 Terminology and Special Marks ........................................................................... 18
1.10 Related Documents ........................................................................................... 22
2 Technologies ........................................................................................................... 23
2.1 Platform Environmental Control Interface (PECI) ................................................... 23
2.1.1 PECI Bus Architecture ............................................................................. 23
2.2 Intel
®
Virtualization Technology (Intel
®
VT) .......................................................... 25
2.2.1 Intel
®
Virtualization Technology (Intel
®
VT) for Intel
®
64 and Intel
®
Architecture
(Intel
®
VT-X)......................................................................................... 25
2.2.2 Intel
®
Virtualization Technology (Intel
®
VT) for Directed I/O (Intel
®
VT-d) .... 28
2.2.3 Intel
®
APIC Virtualization Technology (Intel
®
APICv) .................................. 30
2.3 Security Technologies ........................................................................................ 31
2.3.1 Intel
®
Trusted Execution Technology (Intel
®
TXT) ...................................... 31
2.3.2 Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) ........ 32
2.3.3 Perform Carry-Less Multiplication Quad Word Instruction (PCLMULQDQ) ........ 33
2.3.4 Intel
®
Secure Key .................................................................................. 33
2.3.5 Execute Disable Bit................................................................................. 33
2.3.6 Boot Guard Technology ........................................................................... 34
2.3.7 Intel
®
Supervisor Mode Execution Protection (SMEP) .................................. 34
2.3.8 Intel
®
Supervisor Mode Access Protection (SMAP) ...................................... 34
2.3.9 Intel
®
Software Guard Extensions (Intel
®
SGX).......................................... 34
2.3.10 Intel
®
Secure Hash Algorithm Extensions (Intel
®
SHA Extensions)................ 36
2.3.11 User Mode Instruction Prevention (UMIP)................................................... 36
2.3.12 Read Processor ID (RDPID)...................................................................... 36
2.3.13 Total Memory Encryption (Intel
®
TME) ...................................................... 37
2.3.14 Control-flow Enforcement Technology (Intel
®
CET) ..................................... 37
2.3.14.1 Shadow Stack .......................................................................... 37
2.3.14.2 Indirect Branch Tracking............................................................ 38
2.3.15 KeyLocker Technology ............................................................................ 38
2.3.16 Devil’s Gate Rock (DGR).......................................................................... 38
2.4 Power and Performance Technologies................................................................... 39
2.4.1 Intel
®
Smart Cache Technology ............................................................... 39
2.4.2 IA Core Level 1 and Level 2 Caches .......................................................... 39
2.4.3 Intel
®
Turbo Boost Max Technology 3.0 .................................................... 40
2.4.4 Power Aware Interrupt Routing (PAIR) ...................................................... 40
2.4.5 Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) ......................... 40
2.4.6 Intel
®
Turbo Boost Technology 2.0 ........................................................... 41
2.4.6.1 Intel
®
Turbo Boost Technology 2.0 Power Monitoring ..................... 41
2 Datasheet, Volume 1 of 2
2.4.6.2 Intel
®
Turbo Boost Technology 2.0 Power Control ..........................41
2.4.6.3 Intel
®
Turbo Boost Technology 2.0 Frequency ...............................41
2.4.7 Enhanced Intel SpeedStep
®
Technology ....................................................42
2.4.8 Intel
®
Speed Shift Technology..................................................................42
2.4.9 Intel
®
Advanced Vector Extensions 2 (Intel
®
AVX2) ....................................42
2.4.10 Advanced Vector Extensions 512 Bit (Intel
®
AVX-512).................................43
2.4.11 Intel
®
64 Architecture x2APIC ..................................................................44
2.4.12 Intel
®
Dynamic Tuning Technology (DTT) ..................................................45
2.4.13 Intel
®
GNA 2.0 (GMM and Neural Network Accelerator)................................46
2.4.14 Cache Line Write Back (CLWB) .................................................................46
2.4.15 Ring Interconnect ...................................................................................46
2.5 Intel
®
Image Processing Unit (Intel
®
IPU6)...........................................................47
2.5.1 Platform Imaging Infrastructure................................................................47
2.5.2 Intel
®
Image Processing Unit (Intel
®
IPU6)................................................47
2.6 Debug Technologies ...........................................................................................48
2.6.1 Intel
®
Processor Trace ............................................................................48
2.6.2 Platform CrashLog ..................................................................................48
2.6.3 Telemetry Aggregator .............................................................................48
2.7 Clock Topology ..................................................................................................50
2.7.1 Integrated Reference Clock PLL ................................................................50
2.8 Intel Volume Management Device (VMD) Technology..............................................50
2.8.1 Intel Volume Management Device Technology Objective...............................50
2.8.2 Intel Volume Management Device Technology ............................................51
2.8.3 Key Features..........................................................................................52
2.9 Deprecated Technologies ....................................................................................52
3 Power Management .................................................................................................53
3.1 Advanced Configuration and Power Interface (ACPI) States Supported ......................56
3.2 Processor IA Core Power Management ..................................................................57
3.2.1 OS/HW Controlled P-states ......................................................................58
3.2.1.1 Enhanced Intel
SpeedStep
®
Technology .......................................58
3.2.1.2 Intel
®
Speed Shift Technology ....................................................58
3.2.2 Low-Power Idle States.............................................................................58
3.2.3 Requesting the Low-Power Idle States .......................................................59
3.2.4 Processor IA Core C-State Rules ...............................................................59
3.2.5 Package C-States ...................................................................................60
3.2.6 Package C-States and Display Resolutions..................................................63
3.3 Processor Graphics Power Management ................................................................64
3.3.1 Memory Power Savings Technologies.........................................................64
3.3.1.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)................64
3.3.2 Display Power Savings Technologies..........................................................65
3.3.2.1 Intel
®
Seamless Display Refresh Rate Switching Technology (Intel
®
SDRRS Technology) with eDP* Port .............................................65
3.3.2.2 Intel
®
Automatic Display Brightness ............................................65
3.3.2.3 Smooth Brightness ....................................................................65
3.3.2.4 Intel
®
Display Power Saving Technology (Intel
®
DPST) 6.3.............65
3.3.2.5 Panel Self-Refresh 2 (PSR 2).......................................................66
3.3.2.6 Low-Power Single Display Pipe (LPSP) ..........................................66
3.3.2.7 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .....................66
3.3.3 Processor Graphics Core Power Savings Technologies ..................................66
3.3.3.1 Intel
®
Graphics Dynamic Frequency.............................................66
3.3.3.2 Intel
®
Graphics Render Standby Technology (Intel
®
GRST) ............67
3.3.3.3 Dynamic FPS (DFPS)..................................................................67
3.4 System Agent Enhanced Intel
SpeedStep
®
Technology ...........................................67
3.5 Voltage Optimization ..........................................................................................67
3.6 ROP (Rest Of Platform) PMIC...............................................................................67
Datasheet, Volume 1 of 2 3
3.7 PCI Express* Power Management ........................................................................ 68
4 Thermal Management .............................................................................................. 69
4.1 Processor Thermal Management .......................................................................... 69
4.1.1 Thermal Considerations........................................................................... 69
4.1.1.1 Package Power Control .............................................................. 70
4.1.1.2 Platform Power Control .............................................................. 71
4.1.1.3 Turbo Time Parameter (Tau) ...................................................... 72
4.1.2 Configurable TDP (cTDP) and Low-Power Mode........................................... 72
4.1.2.1 Configurable TDP ...................................................................... 72
4.1.2.2 Low-Power Mode ...................................................................... 73
4.1.3 Thermal Management Features ................................................................ 74
4.1.3.1 Adaptive Thermal Monitor .......................................................... 74
4.1.3.2 Digital Thermal Sensor .............................................................. 76
4.1.3.3 PROCHOT# Signal..................................................................... 77
4.1.3.4 PROCHOT Output Only............................................................... 78
4.1.3.5 Bi-Directional PROCHOT# .......................................................... 78
4.1.3.6 PROCHOT Demotion Algorithm.................................................... 78
4.1.3.7 Voltage Regulator Protection using PROCHOT# ............................. 79
4.1.3.8 Thermal Solution Design and PROCHOT# Behavior ........................ 79
4.1.3.9 Low-Power States and PROCHOT# Behavior ................................. 80
4.1.3.10 THRMTRIP# Signal.................................................................... 80
4.1.3.11 Critical Temperature Detection ................................................... 80
4.1.3.12 On-Demand Mode ..................................................................... 80
4.1.3.13 MSR Based On-Demand Mode..................................................... 80
4.1.3.14 I/O Emulation-Based On-Demand Mode ....................................... 81
4.1.4 Intel
®
Memory Thermal Management........................................................ 81
4.2 Thermal and Power Specifications........................................................................ 82
5 Memory ................................................................................................................... 86
5.1 System Memory Interface .................................................................................. 86
5.1.1 Processor SKU Support Matrix.................................................................. 86
5.1.2 Supported Population.............................................................................. 87
5.1.3 Supported Memory Modules and Devices ................................................... 89
5.1.4 System Memory Timing Support............................................................... 90
5.1.5 System Memory Timing Support............................................................... 90
5.1.6 SAGV Points .......................................................................................... 91
5.1.7 Memory Controller (MC) .......................................................................... 91
5.1.8 System Memory Controller Organization Mode (DDR4) ................................ 92
5.1.9 System Memory Frequency...................................................................... 93
5.1.10 Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA).......... 93
5.1.11 Data Scrambling .................................................................................... 94
5.1.12 ECC DDR4 H-Matrix Syndrome Codes........................................................ 94
5.1.13 Data Swapping ...................................................................................... 95
5.1.14 DDR I/O Interleaving .............................................................................. 95
5.1.15 DRAM Clock Generation........................................................................... 96
5.1.16 DRAM Reference Voltage Generation ......................................................... 96
5.1.17 Data Swizzling ....................................................................................... 96
5.2 Integrated Memory Controller (IMC) Power Management ........................................ 96
5.2.1 Disabling Unused System Memory Outputs ................................................ 96
5.2.2 DRAM Power Management and Initialization ............................................... 97
5.2.2.1 Initialization Role of CKE............................................................ 98
5.2.2.2 Conditional Self-Refresh............................................................. 98
5.2.2.3 Dynamic Power-Down................................................................ 98
5.2.2.4 DRAM I/O Power Management .................................................... 99
5.2.3 DDR Electrical Power Gating .................................................................... 99
5.2.4 Power Training....................................................................................... 99
4 Datasheet, Volume 1 of 2
6 USB-C* Sub System ............................................................................................... 100
6.1 USB-C Sub-System General Capabilities.............................................................. 101
6.2 USB™ 4 Router ............................................................................................... 102
6.2.1 USB 4 Host Router Implementation Capabilities ........................................ 102
6.3 USB-C Sub-system xHCI/xDCI Controllers........................................................... 103
6.3.1 USB 3 Controllers ................................................................................. 103
6.3.1.1 Extensible Host Controller Interface (xHCI)................................. 103
6.3.1.2 Extensible Device Controller Interface (xDCI).............................. 103
6.3.2 USB-C Sub-System PCIe Interface ..........................................................104
6.4 USB-C Sub-System Display Interface.................................................................. 104
7 PCIe* Interface .....................................................................................................105
7.1 Processor PCI Express* Interface.......................................................................105
7.1.1 PCI Express* Support............................................................................ 105
7.1.2 PCI Express* Lane Polarity Inversion....................................................... 107
7.1.3 PCI Express* Architecture...................................................................... 107
7.1.4 PCI Express* Configuration Mechanism.................................................... 108
7.1.5 PCI Express* Equalization Methodology ................................................... 108
7.1.6 PCI Express* Hot-Plug...........................................................................109
7.1.6.1 Presence Detection..................................................................109
7.1.6.2 SMI/SCI Generation.................................................................109
8 Direct Media Interface (DMI) and On Package Interface (OPI) .............................. 110
8.1 Direct Media Interface (DMI) ............................................................................. 110
8.1.1 DMI Lane Reversal and Polarity Inversion................................................. 110
8.1.2 DMI Error Flow .....................................................................................111
8.1.3 DMI Link Down..................................................................................... 111
8.2 On Package Interface (OPI)............................................................................... 111
8.2.1 OPI Support:........................................................................................ 111
8.2.2 Functional description: .......................................................................... 111
9 Graphics ................................................................................................................ 112
9.1 Processor Graphics...........................................................................................112
9.1.1 Media Support (Intel
®
QuickSync and Clear Video Technology HD) .............. 112
9.1.1.1 Hardware Accelerated Video Decode .......................................... 112
9.1.1.2 Hardware Accelerated Video Encode........................................... 113
9.1.1.3 Hardware Accelerated Video Processing...................................... 114
9.1.1.4 Hardware Accelerated Transcoding ............................................114
9.2 Platform Graphics Hardware Feature ..................................................................115
9.2.1 Hybrid Graphics.................................................................................... 115
10 Display................................................................................................................... 116
10.1 Display Technologies Support ............................................................................ 116
10.2 Display Configuration .......................................................................................116
10.3 Display Features.............................................................................................. 118
10.3.1 General Capabilities ..............................................................................118
10.3.2 Multiple Display Configurations ............................................................... 118
10.3.3 High-bandwidth Digital Content Protection (HDCP) .................................... 118
10.3.4 DisplayPort* ........................................................................................ 119
10.3.4.1 Multi-Stream Transport (MST)................................................... 119
10.3.5 High-Definition Multimedia Interface (HDMI*)........................................... 121
10.3.6 embedded DisplayPort* (eDP*) ..............................................................122
10.3.7 MIPI* DSI............................................................................................ 123
10.3.8 Integrated Audio ..................................................................................124
10.3.9 DisplayPort* Input (DP-IN) .................................................................... 124
11 Camera/MIPI......................................................................................................... 127
Datasheet, Volume 1 of 2 5
11.1 Camera Pipe Support ....................................................................................... 127
11.2 MIPI* CSI-2 Camera Interconnect ..................................................................... 127
11.2.1 Camera Control Logic............................................................................ 127
11.2.2 Camera Modules .................................................................................. 127
11.2.3 CSI-2 Lane Configuration ...................................................................... 128
12 Signal Description ................................................................................................. 130
12.1 System Memory Interface ................................................................................ 132
12.1.1 DDR4 Memory Interface ........................................................................ 132
12.1.2 LPDDR4x Memory Interface ................................................................... 135
12.2 PCIe4 Gen4 Interface Signals............................................................................ 136
12.3 Direct Media Interface (DMI) Signals.................................................................. 136
12.4 PCIe16 Gen4 Interface Signals .......................................................................... 137
12.5 Reset and Miscellaneous Signals........................................................................ 137
12.6 Display Interfaces ........................................................................................... 138
12.6.1 Embedded DisplayPort* (eDP*) Signals ................................................... 138
12.6.2 MIPI DSI* Signals ................................................................................ 139
12.6.3 Digital Display Interface (DDI) Signals .................................................... 139
12.6.4 Digital Display Audio Signals .................................................................. 139
12.7 DP-IN Interface Signals.................................................................................... 140
12.8 USB Type-C Signals......................................................................................... 140
12.9 MIPI* CSI-2 Interface Signals ........................................................................... 141
12.10 Processor Clocking Signals................................................................................ 142
12.11 Testability Signals ........................................................................................... 142
12.12 Error and Thermal Protection Signals ................................................................. 143
12.13 Processor Power Rails ..................................................................................... 143
12.14 Ground, Reserved and Non-Critical to Function (NCTF) Signals .............................. 144
12.15 Processor Internal Pull-Up / Pull-Down Terminations ............................................ 145
13 Electrical Specifications ......................................................................................... 146
13.1 Processor Power Rails ..................................................................................... 146
13.1.1 Power and Ground Pins ......................................................................... 146
13.1.2 Full Integrated Voltage Regulator (FIVR) ................................................. 146
13.1.3 V
CC
Voltage Identification (VID) ............................................................. 146
13.2 DC Specifications ............................................................................................ 147
13.2.1 Processor Power Rails DC Specifications .................................................. 147
13.2.1.1 Vcc
IN
DC Specifications............................................................ 147
13.2.1.2 VccIN_AUX DC Specifications.................................................... 149
13.2.1.3 VDD2 DC Specifications ........................................................... 151
13.2.1.4 VccST DC Specifications........................................................... 151
13.2.1.5 Vcc1P8A DC Specifications ....................................................... 152
13.2.1.6 DDR4 DC Specifications ........................................................... 153
13.2.1.7 LPDDR4x DC Specifications ...................................................... 155
13.2.1.8 PCI Express* Graphics (PEG) DC Specifications ........................... 156
13.2.1.9 Digital Display Interface (DDI) DC Specifications ......................... 156
13.2.1.10embedded DisplayPort* (eDP*) DC Specification ......................... 157
13.2.1.11MIPI* CSI-2 D-Phy Receiver DC Specifications ............................ 157
13.2.1.12CMOS DC Specifications........................................................... 158
13.2.1.13GTL and OD DC Specification.................................................... 158
13.2.1.14PECI DC Characteristics ........................................................... 159
14 Package Mechanical Specifications ........................................................................ 161
14.1 Package Mechanical Attributes .......................................................................... 161
14.2 Package Loading and Die Pressure Specifications ................................................. 161
14.2.1 Package Loading Specifications .............................................................. 161
14.2.2 Die Pressure Specifications .................................................................... 162
14.3 Package Storage Specifications ......................................................................... 163
6 Datasheet, Volume 1 of 2
15 CPU And Device IDs ............................................................................................... 164
15.1 CPUID ............................................................................................................164
15.2 PCI Configuration Header..................................................................................164